Infineon Technologies CY7C1321KV18-250BZXCT
- Part No.:
- CY7C1321KV18-250BZXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1321KV18-250BZXCT.pdf
- Description:
- IC SRAM 18MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1321KV18-250BZXCT from Cypress Semiconductor is a 18-Mbit synchronous pipelined DDR II SRAM configured as 512K × 36, operating at 250 MHz with 1.8 V core supply and HSTL I/O. It implements four-word burst reads/writes synchronized to dual-edge–referenced clocks (K/K, C/C), features echo clocks (CQ/CQ) for timing margin recovery, and supports programmable output impedance via ZQ. Used in high-bandwidth packet buffering and network switch data planes.
For engineers reviewing the CY7C1321KV18-250BZXCT datasheet, CY7C1321KV18-250BZXCT pinout, CY7C1321KV18-250BZXCT application, or CY7C1321KV18-250BZXCT equivalent, key selection criteria include DDR II burst latency (1.5 cycles with DOFF HIGH), 36-bit wide I/O interface, 165-ball FBGA package compatibility, and JTAG 1149.1 test access support.
Technical Context
This device uses a synchronous pipelined architecture with internal two-bit burst counter driven by A[1:0], delivering four sequential 36-bit words per access. All address, control, and write data inputs are registered on rising edges of K and K clocks; read data is edge-aligned to C/C (or K/K in single-clock mode).
It integrates a PLL for precise data placement, echo clocks (CQ/CQ) phase-locked to C/C for receiver-side capture simplification, and on-chip self-timed write circuitry. Output drive strength is adjustable via ZQ calibration to match 40–60 Ω system trace impedance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 18 Mbit / 512K × 36 - enables compact 36-bit-wide memory subsystems without external width expansion. |
| Max Clock Frequency | 250 MHz (K/K) - defines maximum sustained burst throughput of 1.8 Gbps per data lane (36 × 250 MHz × 2). |
| Read Latency | 1.5 cycles (DOFF = HIGH) - adds half-cycle delay to align DDR II timing margins; reduces setup/hold risk in high-speed routing. |
| I/O Voltage | 1.8 V core / 1.4–1.8 V HSTL I/O - supports mixed-voltage systems and interoperability with 1.5 V or 1.8 V controllers. |
| Burst Length | Four-word - reduces address bus toggling frequency by 75% versus single-word access, lowering EMI and controller overhead. |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - provides fine-pitch, low-inductance interconnect suitable for >250 MHz DDR signaling. |
| JTAG Support | IEEE 1149.1 compliant - enables boundary-scan testing of SRAM interconnects without functional access. |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, 0.8 mm ball pitch, RoHS-compliant Pb-free finish (BZXCT suffix).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[35:0] | Synchronous bidirectional data | 36-bit DDR I/O bus; drives read data on rising edges of C/C; samples write data on rising edges of K/K. |
| K, K | Input clocks (positive/negative) | Master clock pair for all synchronous inputs; defines burst initiation timing and write data capture windows. |
| C, C | Output clocks (positive/negative) | Deskew-capable clocks for read data; used with CQ/CQ to compensate for board flight-time mismatches. |
| CQ, CQ | Echo clocks | Free-running outputs synchronized to C/C; provide receiver-side clock reference aligned to Q[35:0] edges. |
| LD | Load strobe | Active-low synchronous enable; latches address and R/W state on next K/K edge to initiate burst sequence. |
| BWS[3:0] | Byte write selects | Four active-low signals controlling 9-bit byte lanes; allows partial writes without read-modify-write overhead. |
| ZQ | Impedance calibration input | Connects to external resistor to ground; calibrates DQ/CQ output driver strength to match PCB trace impedance. |
| DOFF | DDR latency mode select | High = DDR II mode (1.5-cycle read latency); Low = DDR I mode (1-cycle latency); sets internal timing path. |
Key Features
| Feature | Design Value |
|---|---|
| Four-word burst architecture | Reduces address bus activity by 75% per transaction, lowering controller logic burden and signal count. |
| Programmable output impedance (ZQ) | Enables dynamic matching to 40–60 Ω PCB traces without external termination resistors, improving signal integrity. |
| Dual-output clocks (C/C) + echo clocks (CQ/CQ) | Eliminates need for separate capture clock generation at receiver; simplifies layout and timing closure in multi-SRAM systems. |
| Configurable read latency (DOFF pin) | Allows runtime selection between DDR I (1-cycle) and DDR II (1.5-cycle) timing models to match controller capability. |
| On-chip self-timed write | Removes requirement for external write-enable timing control; guarantees reliable write completion across voltage/temperature. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing variable-length Ethernet frames in ingress/egress queues of Layer 2/L3 switches. IC Role / Device Role / Timing Role: High-throughput, low-latency SRAM buffer interfacing directly to MAC-layer controllers via DDR II bus. Use Value: 36-bit width matches common packet header+payload alignment; four-word burst minimizes arbitration overhead during bursty traffic. |
Use Scenario: Frame assembly/disassembly and header translation in carrier-grade DSLAM and OLT line cards. IC Role / Device Role / Timing Role: Synchronous burst memory supporting deterministic latency for time-sensitive TDM-to-packet conversion. Use Value: DOFF-selectable latency allows tuning to match ASIC timing budgets; ZQ calibration maintains signal fidelity across temperature. |
| Baseband Processing Cache | Industrial Real-Time Controller Buffer |
|
Use Scenario: Temporary storage of OFDM symbol data between FFT processing stages in LTE/5G baseband units. IC Role / Device Role / Timing Role: Pipelined DDR II SRAM acting as low-latency scratchpad between FPGA-based DSP blocks. Use Value: CQ/CQ echo clocks simplify capture timing at FPGA inputs; 250 MHz operation sustains >1.7 Gbps sustained bandwidth. |
Use Scenario: Motion control trajectory buffering in CNC and robotics PLCs requiring jitter-free data delivery. IC Role / Device Role / Timing Role: Deterministic-access memory co-located with real-time microcontroller or FPGA fabric. Use Value: JTAG 1149.1 support enables in-system interconnect validation; 165-ball FBGA ensures thermal reliability in sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C33256P-25TIN | Asynchronous 32-Mbit SRAM, 25 ns access, parallel interface, no DDR or burst capability. | Lacks echo clocks, burst, or DDR timing; requires full address bus and separate OE/WE controls per access. | Select only when deterministic sub-25 ns single-word latency is required and controller lacks DDR support. |
| IS61WV102432BLL-10TLI | Synchronous 32-Mbit SRAM, 10 ns cycle time, single-data-rate (SDR), 1M × 32 organization. | No CQ/CQ echo clocks or ZQ calibration; limited to 100 MHz max clock; no DOFF-configurable latency. | Choose for cost-sensitive SDR designs where DDR complexity is unnecessary and bandwidth ≤3.2 Gbps suffices. |
Compared with AS7C33256P-25TIN and IS61WV102432BLL-10TLI, CY7C1321KV18-250BZXCT delivers higher effective bandwidth via DDR and burst, tighter timing control through echo clocks and ZQ, and configurable latency-critical for modern packet-processing and baseband systems.
Availability
CY7C1321KV18-250BZXCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial real-time controller buffer applications requiring stable component supply, long-lifecycle assurance, and RoHS-compliant packaging.
Supply support for CY7C1321KV18-250BZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and timing precision.
CY7C1321KV18 belongs to Cypress's DDR II SRAM product line, engineered specifically for high-bandwidth, low-latency buffering in packet-switched infrastructure where deterministic burst access and echo-clock–assisted data capture are essential.
FAQ
What is the function of the DOFF pin on CY7C1321KV18-250BZXCT?
The DOFF (DDR Off) pin configures read latency mode: when asserted HIGH, it enables DDR II operation with 1.5-cycle read latency; when LOW, it reverts to DDR I timing with 1-cycle latency. This allows hardware-level adaptation to controller timing capabilities without firmware change, and affects internal clock-to-output timing paths as defined in the AC switching characteristics table.
How does ZQ calibration work and what external component is required?
ZQ calibration adjusts output driver impedance by comparing internal reference current against an external precision resistor (RQ) tied between ZQ and ground. The device sets DQ/CQ output strength to 0.2 × RQ, enabling matched 40–60 Ω drive into typical PCB traces. RQ must be 240 Ω ±1% for 48 Ω target; direct connection to VDDQ enables minimum-impedance mode.
Can CY7C1321KV18-250BZXCT operate without C and C clocks?
Yes - in single-clock mode, the device uses K and K for both input sampling and output data timing. C/C pins become no-connect, and CQ/CQ are generated relative to K/K instead of C/C. However, echo-clock–assisted data capture and flight-time deskew are lost, reducing timing margin in multi-device systems above 200 MHz.
What is the role of BWS[3:0] during a write operation?
BWS[3:0] are active-low byte write selects that gate 9-bit data lanes: BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. When a BWS bit is HIGH, the corresponding 9-bit byte is masked and unchanged; only asserted (LOW) bytes are written, enabling partial updates without read-modify-write cycles.
CY7C1321KV18-250BZXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1321KV18-250BZXCT FAQ
1.How can I place an order for CY7C1321KV18-250BZXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1321KV18-250BZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1321KV18-250BZXCT reliable?
The price and inventory of CY7C1321KV18-250BZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1321KV18-250BZXCT is usually 5 days.
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Once your CY7C1321KV18-250BZXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1321KV18-250BZXCT?
For technical support, including CY7C1321KV18-250BZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1321KV18-250BZXCT requirements.
6.How does Aetrix verify that CY7C1321KV18-250BZXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1321KV18-250BZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1321KV18-250BZXCT meets industry standards.
7.What is the process for return or replacement of CY7C1321KV18-250BZXCT?
All CY7C1321KV18-250BZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1321KV18-250BZXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1321KV18-250BZXCT part is unused and in its original packaging.
Return procedure for CY7C1321KV18-250BZXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1321KV18-250BZXCT Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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Microchip Technology

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Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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