Infineon Technologies CY7C1325G-133AXC
- Part No.:
- CY7C1325G-133AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1325G-133AXC.pdf
- Description:
- IC SRAM 4.5MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:343
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Product details
Overview
CY7C1325G-133AXC from Cypress Semiconductor is a 4-Mbit (256K × 18) flow-through synchronous SRAM with 133 MHz clock support, 6.5 ns clock-to-output delay, 3.3 V core supply (VDD), and dual-voltage I/O (2.5 V/3.3 V VDDQ), designed for high-speed secondary cache interfacing in Pentium-class microprocessor systems.
For engineers reviewing the CY7C1325G-133AXC datasheet, CY7C1325G-133AXC pinout, CY7C1325G-133AXC application, or CY7C1325G-133AXC equivalent, key selection criteria include burst mode configurability (linear vs. interleaved), synchronous self-timed write capability, separate ADSP/ADSC address strobes, and ZZ sleep mode with data retention - all critical for cache coherency and power-aware embedded computing designs.
Technical Context
The device implements a 2-bit on-chip wraparound burst counter fed by A[1:0], enabling automatic address increment during burst reads/writes. Burst order (interleaved or linear) is statically selected via the MODE pin, with internal pull-up ensuring default interleaved operation when unconnected.
All synchronous inputs - including addresses, CE1/CE2/CE3, ADSP/ADSC, ADV, GW, BWE, BW[A:B], and CLK - are registered on the positive clock edge. Asynchronous controls OE and ZZ operate independently of CLK, with ZZ requiring external grounding per errata (Pin 64) to avoid unintended sleep activation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 18) - supports full-word cache line storage for 18-bit data paths in legacy x86-compatible systems. |
| Max Clock Frequency | 133 MHz - enables single-cycle burst transfers aligned with Pentium-class processor bus timing. |
| Access Time (tCDV) | 6.5 ns - defines maximum delay from CLK rise to valid DQ output, critical for meeting tight read setup windows. |
| VDD / VDDQ | 3.3 V core / 2.5 V or 3.3 V I/O - allows interoperability with both 2.5 V and 3.3 V logic domains without level shifters. |
| Burst Control | MODE-selectable linear or interleaved - matches Intel Pentium (interleaved) or custom controller (linear) addressing schemes. |
| Write Architecture | Synchronous self-timed write - eliminates external write pulse timing constraints; GW overrides BW[A:B] for full-word writes. |
| Power Management | ZZ sleep mode with data retention - reduces standby current to 40 mA while preserving cache contents during idle cycles. |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, JEDEC-standard JESD8-5 compatible.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Positive-edge-triggered master timing reference for all synchronous registers and burst counter advancement. |
| ADSP / ADSC | Address strobe inputs | Separate processor (ADSP) and controller (ADSC) strobes enable flexible cache coherency arbitration; ADSP takes priority. |
| ADV | Address advance control | Asserted LOW on CLK edge increments burst counter; enables pipelined sequential access without external address generation. |
| MODE | Burst sequence selector | Static strap pin: LOW = linear burst, HIGH/floating = interleaved; internal pull-up ensures safe default behavior. |
| ZZ | Asynchronous sleep enable | Active-HIGH sleep input; errata requires external grounding (Pin 64) to prevent spurious entry into low-power state. |
| DQPA/DQA/DQB/DQPB | 18-bit bidirectional I/O | Common I/O pins grouped as byte-wide banks (A/B); direction controlled by OE; tristated automatically post-write for safety. |
| CE1/CE2/CE3 | Chip enable group | Three-level synchronous chip select: CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW) support multi-bank memory expansion. |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through synchronous architecture | Eliminates pipeline bubbles in burst reads; data appears on DQs one clock after address capture, enabling deterministic timing. |
| User-selectable burst order | Hardware-mode configuration (MODE pin) avoids firmware overhead and guarantees boot-time compatibility with legacy CPU interfaces. |
| Synchronous self-timed write | Removes need for precise external write pulse generation; internal timing logic handles write duration based on clock and control signals. |
| Separate ADSP and ADSC strobes | Enables concurrent cache management by CPU and memory controller without arbitration logic or glue circuitry. |
| ZZ sleep with data retention | Reduces active standby current to 40 mA while maintaining full memory content integrity - essential for low-power cache hold states. |
Applications
| Intel Pentium Cache Subsystem | Industrial Real-Time Controller Cache |
|---|---|
|
Use Scenario: Secondary cache buffer between Pentium processor and main memory in embedded industrial PCs. IC Role / Device Role / Timing Role: Flow-through SRAM providing 133 MHz burst reads with 6.5 ns tCDV to meet Pentium's 2-1-1-1 access rate requirement. Use Value: Eliminates wait states during cache line fills; MODE pin hardwired for interleaved burst to match Pentium address mapping. |
Use Scenario: Deterministic instruction/data cache in safety-critical PLC motion controllers with strict jitter budgets. IC Role / Device Role / Timing Role: Synchronous SRAM with guaranteed 6.5 ns read latency and self-timed writes ensures repeatable execution timing across temperature ranges. Use Value: Reduces worst-case interrupt latency variance by removing asynchronous write handshaking; ZZ pin grounded for stable operation. |
| Legacy x86-Based Test Equipment | Avionics Data Buffering Module |
|
Use Scenario: High-bandwidth data capture buffer in automated test systems using i486-derived controllers. IC Role / Device Role / Timing Role: 256K × 18 common-I/O SRAM interfaced via ADSC-driven controller, supporting linear burst for sequential acquisition. Use Value: CE2/CE3 expansion enables multi-SRAM bank addressing; VDDQ configurable for 2.5 V FPGA interface compatibility. |
Use Scenario: Radiation-tolerant cache in airborne flight control computers requiring neutron soft error immunity. IC Role / Device Role / Timing Role: SRAM with documented neutron soft error immunity (per datasheet p.10) and ZZ-controlled low-power hold during system idle phases. Use Value: Maintains cached flight parameters during transient power dips; 40 mA standby current extends battery-backed operation time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous cache SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25618AL-133TQLI | 256K × 18, 133 MHz, 3.3 V only (no VDDQ flexibility), no ZZ sleep mode, 8 ns tCDV. | Lacks dual-voltage I/O and low-power sleep - unsuitable where 2.5 V interface or power-gating is required. | Select when cost sensitivity outweighs VDDQ flexibility and sleep functionality; verify timing margin with 8 ns access. |
| MT48LC16M18A2-75:G | SDRAM (not SRAM), 16M × 18, 133 MHz, requires refresh, higher latency, different command protocol. | Not drop-in compatible: needs memory controller reconfiguration, lacks flow-through timing, no ADSP/ADSC interface. | Consider only for bandwidth-scaling upgrades where latency tolerance exists and controller redesign is feasible. |
Compared with IS61LV25618AL-133TQLI and MT48LC16M18A2-75:G, CY7C1325G-133AXC uniquely delivers VDDQ voltage flexibility, hardware-configurable burst order, and ZZ sleep - making it the only option for legacy Pentium cache designs requiring deterministic timing and power-aware operation.
Availability
CY7C1325G-133AXC is available at Aetrix Electronics and suitable for Intel Pentium-based industrial PCs, real-time PLC controllers, legacy test equipment, and avionics data buffering modules requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1325G-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.
CY7C1325G belongs to Cypress's legacy synchronous SRAM product line, engineered specifically for high-performance cache subsystems in x86-compatible processors and deterministic real-time control systems.
FAQ
What is the correct handling of the ZZ pin per official errata?
The ZZ pin (Pin 64) must be externally connected to ground, as stated in the datasheet errata on page 21. Leaving it floating risks unintended entry into sleep mode due to noise or leakage, even though the pin has an internal pull-down. Grounding ensures stable normal operation and prevents data access interruption during critical cache reads.
Can CY7C1325G-133AXC operate with 2.5 V I/O while using 3.3 V core supply?
Yes - VDD is fixed at 3.3 V for core logic, while VDDQ is independently configurable for either 2.5 V or 3.3 V. This allows direct interfacing with 2.5 V FPGAs or ASICs without level shifters, provided VDDQ decoupling and signal integrity meet JEDEC JESD8-5 requirements for mixed-voltage operation.
How does the burst counter behave during interleaved vs. linear mode?
In interleaved mode (MODE = HIGH), the 2-bit counter sequences as 0→2→1→3; in linear mode (MODE = LOW), it sequences as 0→1→2→3. Both use wraparound behavior. The counter advances on each ADV assertion during burst cycles, and initial address A[1:0] is latched at ADSP/ADSC activation - matching Pentium and i486 burst protocols respectively.
Is CY7C1325G-133AXC suitable for new designs given its legacy status?
Yes - Aetrix Electronics maintains active inventory and long-term sourcing agreements for CY7C1325G-133AXC. Its pinout, timing, and electrical specs remain unchanged; design documentation, IBIS models, and application notes are fully archived and accessible. It is recommended for repair, replacement, and continuity builds of certified legacy systems.
CY7C1325G-133AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bulk
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.15V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1325G-133AXC FAQ
1.How can I place an order for CY7C1325G-133AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1325G-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1325G-133AXC reliable?
The price and inventory of CY7C1325G-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1325G-133AXC is usually 5 days.
3.What payment methods are accepted for CY7C1325G-133AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1325G-133AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1325G-133AXC?
CY7C1325G-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1325G-133AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1325G-133AXC?
For technical support, including CY7C1325G-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1325G-133AXC requirements.
6.How does Aetrix verify that CY7C1325G-133AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1325G-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1325G-133AXC meets industry standards.
7.What is the process for return or replacement of CY7C1325G-133AXC?
All CY7C1325G-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1325G-133AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1325G-133AXC part is unused and in its original packaging.
Return procedure for CY7C1325G-133AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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