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Infineon Technologies CY7C1325G-133AXCT

Part No.:
CY7C1325G-133AXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1325G-133AXCT.pdf
Description:
IC SRAM 4.5MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,029

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Product details

Overview

CY7C1325G-133AXCT from Cypress Semiconductor is a 4-Mbit (256K × 18) synchronous flow-through SRAM with 133 MHz clock rate, 6.5 ns clock-to-output delay, 3.3 V core supply (VDD), and dual-voltage I/O (2.5 V/3.3 V VDDQ), designed for high-speed secondary cache interfacing in Pentium-class microprocessor systems.

For engineers reviewing the CY7C1325G-133AXCT datasheet, CY7C1325G-133AXCT pinout, CY7C1325G-133AXCT application, or CY7C1325G-133AXCT equivalent, key selection factors include burst mode control (MODE pin), asynchronous ZZ sleep enable, synchronous self-timed write architecture, and support for both ADSP/ADSC address strobes in cache controller designs.

Technical Context

The device implements a 2-bit on-chip wraparound burst counter fed by A[1:0], enabling Intel Pentium-compatible interleaved or linear burst sequences selected via the static MODE pin. All synchronous inputs - including addresses, CE1/CE2/CE3, ADSP/ADSC/ADV, BW[A:B], BWE, GW, and CLK - are registered on the positive clock edge.

Asynchronous controls include OE (output enable) and ZZ (sleep mode), with ZZ requiring external grounding per errata. The memory uses common I/O architecture with DQA/DQB/DQPA/DQPB bidirectional data buses, JEDEC JESD8-5-compliant signaling, and synchronous self-timed write logic eliminating external write pulse timing constraints.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 Mbit (256K × 18) - supports full 18-bit cache word width without external data bus widening
Access Time (tCDV) 6.5 ns - maximum clock-to-output delay at 133 MHz, enabling tight timing closure in high-frequency CPU interfaces
Core Supply (VDD) 3.3 V ± 0.3 V - defines internal logic voltage domain; decoupling required per JEDEC spec
I/O Supply (VDDQ) 2.5 V or 3.3 V - allows direct interface to either 2.5 V or 3.3 V processor data buses
Burst Mode Control MODE pin strapping - LOW = linear burst, HIGH/floating = interleaved (Pentium-compatible)
Write Architecture Synchronous self-timed write - eliminates need for external write pulse generation or timing margining
Power Management ZZ sleep mode - asynchronous active-HIGH input reducing standby current to ≤40 mA while preserving data

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A0, A1 Address Input Feed 2-bit burst counter; sampled on CLK rise when ADSP/ADSC active; define burst start offset
ADSP / ADSC Address Strobe Input ADSP = processor-initiated access; ADSC = controller-initiated; ADSP takes priority if both asserted
ADV Burst Advance Control Asserted LOW on CLK rise increments burst counter; enables automatic sequential address progression
MODE Burst Sequence Selector Static strap pin: GND = linear, VDD/floating = interleaved; must remain stable during operation
ZZ Asynchronous Sleep Enable Active HIGH sleep input; per errata (p.21), must be externally tied to ground for reliable operation
DQA, DQB, DQPA, DQPB Bidirectional Data I/O Common I/O pins: OE LOW = output (read), OE HIGH = tristated input (write); byte-selectable via BWA/BWB
CE1, CE2, CE3 Chip Enable Inputs Three-level synchronous chip select: CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW)
BWA, BWB, BWE, GW Write Control Inputs BWA/BWB = byte masks for DQA/DQB; BWE = byte write qualifier; GW = global write override

Key Features

Feature Design Value
Flow-through synchronous architecture Eliminates pipeline latency between address capture and data output; enables single-cycle read access after address strobe
User-selectable burst order Hardware-mode selection (MODE pin) supports both Pentium interleaved and generic linear burst protocols without firmware change
Separate ADSP/ADSC strobes Enables concurrent processor and cache controller arbitration - critical for multi-master cache coherency schemes
Synchronous self-timed write Removes dependency on precise external write pulse width; simplifies timing design and improves robustness across voltage/temperature
Asynchronous ZZ sleep with data retention Reduces standby current to ≤40 mA while maintaining SRAM contents - essential for low-power cache subsystems

Applications

Intel Pentium Cache Subsystem Embedded RISC Processor Cache

Use Scenario: Secondary cache buffer between Pentium-class CPU and main memory in desktop/workstation platforms.

IC Role / Device Role / Timing Role: Synchronous flow-through SRAM providing 133 MHz burst reads with 6.5 ns tCDV to meet Pentium's tight cache timing requirements.

Use Value: Enables full-speed 2-1-1-1 burst access pattern matching Intel's interleaved addressing, eliminating wait states in L2 cache line fills.

Use Scenario: High-bandwidth instruction/data cache for industrial ARM9 or MIPS-based controllers running real-time OS.

IC Role / Device Role / Timing Role: Common-I/O synchronous SRAM with MODE-strapped linear burst mode for deterministic cache line fetches in deterministic execution environments.

Use Value: Supports predictable 133 MHz burst transfers with synchronous self-timed writes, reducing software overhead for cache maintenance operations.

Network Packet Buffer Industrial Motion Controller Memory

Use Scenario: Temporary packet storage in Gigabit Ethernet switch ASICs requiring low-latency, burst-capable buffer memory.

IC Role / Device Role / Timing Role: Dual-voltage (2.5 V/3.3 V) I/O SRAM interfacing directly to 2.5 V PHY and 3.3 V control logic without level shifters.

Use Value: Reduces BOM count and board area by eliminating external voltage translators while maintaining 6.5 ns read response for packet header inspection.

Use Scenario: Real-time trajectory buffer in CNC or servo drive controllers requiring deterministic memory access under EMI-heavy factory conditions.

IC Role / Device Role / Timing Role: ZZ-enabled low-power SRAM retaining cached motion profiles during idle cycles while supporting burst writes from position interpolators.

Use Value: Achieves ≤40 mA standby current with guaranteed data retention, extending system uptime between maintenance intervals in sealed enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous cache SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61LV25618AL-133TQLI 256K × 18, 3.3 V only (no VDDQ flexibility), 133 MHz, 7 ns tCDV, no ZZ sleep mode Lacks asynchronous sleep control and dual-voltage I/O; requires external 3.3 V I/O rail only Select when VDDQ flexibility and ultra-low standby power are not required; lower cost in volume production
MT55L25618A-133:G 256K × 18, 3.3 V core/I/O, 133 MHz, 6.5 ns tCDV, no MODE-selectable burst, no ZZ pin Fixed linear burst only; no hardware-configurable interleaved mode or sleep capability Choose when interfacing with non-Pentium processors and power gating is handled externally via system-level power management

Compared with IS61LV25618AL-133TQLI and MT55L25618A-133:G, the CY7C1325G-133AXCT uniquely combines MODE-selectable burst sequencing, asynchronous ZZ sleep, and dual-voltage I/O - making it the only option among the three that satisfies Pentium-compatible cache timing, low-power idle states, and mixed-voltage system integration simultaneously.

Availability

CY7C1325G-133AXCT is available at Aetrix Electronics and suitable for Intel Pentium cache subsystems, embedded RISC processor caches, network packet buffers, and industrial motion controller memory requiring stable component supply and long-lifecycle support.

Supply support for CY7C1325G-133AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C solutions.

The CY7C1325G belongs to Cypress's legacy synchronous SRAM product line, engineered specifically for high-speed CPU cache applications requiring flow-through timing, burst flexibility, and low-latency deterministic access in x86 and embedded computing platforms.

FAQ

What is the correct configuration for the ZZ pin on CY7C1325G-133AXCT?

The ZZ pin (Pin 64) must be externally connected to ground per documented errata on page 21 of Rev. *R datasheet. Although described as an active-HIGH sleep input, leaving it floating or pulling it HIGH causes unreliable operation. Internal pull-down ensures safe default behavior only when externally grounded.

Does CY7C1325G-133AXCT support true 133 MHz operation with 6.5 ns access time?

Yes - the 6.5 ns clock-to-output delay (tCDV) is specified at 133 MHz under VDD = 3.3 V ± 0.3 V, VDDQ = 2.5 V or 3.3 V, TA = 0 °C to +70 °C, and CL = 30 pF. This value is measured from CLK rising edge to valid DQ output and is guaranteed across the commercial temperature range.

How does burst addressing work when MODE is tied to VDD versus GND?

When MODE = VDD or floating, the device executes interleaved burst order (0→2→4→6→1→3→5→7), matching Intel Pentium requirements. When MODE = GND, it executes linear burst order (0→1→2→3→4→5→6→7). The burst counter is always fed by A[1:0] and wraps after four addresses in both modes.

Can CY7C1325G-133AXCT operate with only 2.5 V on VDDQ while using 3.3 V on VDD?

Yes - VDD (core) and VDDQ (I/O) are independently powered. The device is fully compliant with JEDEC JESD8-5 for mixed-voltage operation: VDD = 3.3 V ± 0.3 V and VDDQ = 2.5 V ± 0.2 V may be used simultaneously, enabling direct interface to 2.5 V processors while maintaining 3.3 V internal logic integrity.

CY7C1325G-133AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Last Time Buy
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.5 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1325G-133AXCT FAQ

1.How can I place an order for CY7C1325G-133AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1325G-133AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1325G-133AXCT reliable?

The price and inventory of CY7C1325G-133AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1325G-133AXCT is usually 5 days.

3.What payment methods are accepted for CY7C1325G-133AXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1325G-133AXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1325G-133AXCT?

CY7C1325G-133AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1325G-133AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1325G-133AXCT?

For technical support, including CY7C1325G-133AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1325G-133AXCT requirements.

6.How does Aetrix verify that CY7C1325G-133AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1325G-133AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1325G-133AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1325G-133AXCT?

All CY7C1325G-133AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1325G-133AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1325G-133AXCT part is unused and in its original packaging.

Return procedure for CY7C1325G-133AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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