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Infineon Technologies CY7C1327G-133AXIT

Part No.:
CY7C1327G-133AXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1327G-133AXIT.pdf
Description:
IC SRAM 4.5MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,854

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Product details

Overview

CY7C1327G-133AXIT from Cypress Semiconductor is a 4-Mbit (256K × 18) pipelined synchronous SRAM with registered I/O, 133-MHz clock operation, 4.0 ns clock-to-output delay, dual power rails (3.3 V core / 2.5 V I/O), and user-selectable linear or interleaved burst mode. It serves as secondary cache memory in high-performance embedded and computing systems requiring deterministic timing and burst data throughput.

For engineers reviewing the CY7C1327G-133AXIT datasheet, CY7C1327G-133AXIT pinout, CY7C1327G-133AXIT application, or CY7C1327G-133AXIT equivalent, key selection criteria include synchronous self-timed write support, ZZ sleep mode behavior, ADSP/ADSC dual address strobe architecture, and TQFP-100 package compatibility with Intel Pentium™-compatible burst sequences.

Technical Context

The device implements a two-bit wraparound burst counter synchronized to CLK's rising edge, enabling internal address generation for 1–4-word bursts. All synchronous inputs-including A[1:0], CE1/CE2/CE3, ADSP/ADSC/ADV, BWA/BWB, BWE, and GW-are registered on the same clock edge, ensuring precise pipeline alignment.

It supports both processor-initiated (ADSP) and controller-initiated (ADSC) access protocols: ADSP-triggered writes require two clocks, while ADSC-triggered writes complete in one clock. Output enable (OE) is asynchronous, and ZZ sleep mode is active-HIGH but requires external grounding per errata (Pin 64).

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4 Mbit (256K × 18) - provides 460,800 bytes of burst-accessible synchronous storage
Max Clock Frequency133 MHz - enables 7.5 ns clock period for deterministic pipeline timing
Access Time (tCO)4.0 ns - defines minimum valid data hold window after CLK edge for read output registration
Power SuppliesVDD = 3.3 V ± 0.3 V (core); VDDQ = 2.5 V ± 0.2 V (I/O) - mandates separate low-noise supply domains
Burst Mode ControlMODE pin strapping - GND = linear; VDD/floating = interleaved (Pentium™-compatible)
Write ArchitectureSynchronous self-timed - eliminates external write pulse timing constraints; supports byte (BWA/BWB + BWE) or global (GW) writes
ZZ Sleep ModeAsynchronous active-HIGH - reduces standby current to ≤40 mA; requires external ground connection per errata

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), RoHS-compliant, body size 14 mm × 14 mm, 0.5 mm pitch.

Pin/TerminalCircuit RoleDesign Meaning
A0, A1, A[17:2]Address InputsSynchronous; sampled on CLK rise when ADSP or ADSC active; A1:A0 load burst counter
DQA, DQB, DQPA, DQPBBidirectional Data I/OSynchronous I/O; direction controlled by OE; tristated automatically during writes regardless of OE state
CE1, CE2, CE3Chip Enable InputsCE1 (sync, active-LOW), CE2 (sync, active-HIGH), CE3 (sync, active-LOW); all sampled on CLK rise for bank selection
ADSP, ADSCAddress Strobe InputsADSP (processor strobe), ADSC (controller strobe); mutually exclusive; ADSP takes priority when both asserted
ADVBurst Address AdvanceSynchronous; LOW on CLK rise increments internal burst counter for next address
BWA, BWB, BWE, GWWrite Control InputsBWA/BWB select byte lanes; BWE enables byte write; GW overrides and forces full 18-bit write
CLKSystem Clock InputPositive-edge-triggered master clock; gates all synchronous registers and burst counter
OEOutput EnableAsynchronous, active-LOW; controls I/O direction; masked during first cycle after deselection
ZZSleep Mode InputAsynchronous, active-HIGH; must be externally grounded (errata Pin 64) to disable sleep function
MODEBurst Sequence SelectStatic strap pin; GND = linear burst; VDD/floating = interleaved burst (Pentium™-compatible)

Key Features

FeatureDesign Value
Registered Pipelined I/OEliminates setup/hold timing violations at 133 MHz by registering all address/data/control signals on CLK edge
Dual-Voltage I/O InterfaceEnables direct interfacing with 2.5 V logic while maintaining 3.3 V core integrity-critical for mixed-voltage system integration
ADSP/ADSC Dual Protocol SupportAllows seamless integration into both processor-centric (Pentium™) and controller-driven (ASIC/FPGA) memory subsystems
Synchronous Self-Timed WritesRemoves need for external write pulse generation; write completion is internally timed and signaled via CLK-aligned register updates
User-Selectable Burst OrderHardware-mode pin (MODE) enables board-level configuration for linear or interleaved addressing without firmware change

Applications

Processor Cache InterfaceNetwork Packet Buffer

Use Scenario: Secondary cache between Pentium™-class CPU and main memory in industrial control CPUs.

IC Role / Device Role / Timing Role: Synchronous burst buffer providing 133-MHz pipelined reads/writes with interleaved addressing aligned to CPU burst protocol.

Use Value: Delivers 4.0 ns tCO and deterministic 3-1-1-1 access rate, eliminating wait states in cache refill cycles.

Use Scenario: Temporary storage for variable-length Ethernet frames in FPGA-based switch fabric line cards.

IC Role / Device Role / Timing Role: High-throughput, low-latency SRAM buffer supporting concurrent ingress/egress packet buffering with burst-aligned DMA transfers.

Use Value: Enables full 133-MHz bus utilization with byte-write granularity (BWA/BWB/BWE), preserving partial frame integrity during partial writes.

Real-Time DSP Data BufferAvionics Display Frame Memory

Use Scenario: Co-processor scratchpad for TI C6000-series DSPs performing real-time FFT and filtering in radar signal processing.

IC Role / Device Role / Timing Role: Deterministic latency SRAM used for coefficient tables and intermediate result storage with linear burst access pattern.

Use Value: MODE pin strapped to GND enables linear burst mode matching DSP's sequential memory access, reducing address overhead by 75% vs. random access.

Use Scenario: Frame buffer for MIL-STD-1553B interface modules driving ruggedized cockpit displays in military aircraft.

IC Role / Device Role / Timing Role: Radiation-tolerant (neutron soft error immunity documented) synchronous memory storing dual-buffered display raster data.

Use Value: ZZ sleep mode (with external ground) reduces standby power to ≤40 mA during display idle periods without data loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61LV25618AL-133TQLI3.3 V only (no VDDQ separation); no ZZ sleep mode; 100-pin TQFP but different pinoutLacks dual-voltage I/O and sleep mode; requires redesign of power and control routingSelect only if VDDQ = VDD is acceptable and sleep mode is unnecessary
AS7C3256A-133JCIN256K × 16 organization; no ADSP/ADSC dual strobe; no MODE-selectable burst orderSupports only linear burst; incompatible with Pentium™-interleaved systems; narrower data busChoose only for cost-sensitive linear-burst-only designs where 16-bit width suffices

Compared with IS61LV25618AL-133TQLI and AS7C3256A-133JCIN, CY7C1327G-133AXIT uniquely delivers dual-voltage I/O, hardware-selectable burst modes, and ADSP/ADSC protocol flexibility-enabling drop-in compatibility with legacy Pentium™-based architectures without voltage translation or timing revalidation.

Availability

CY7C1327G-133AXIT is available at Aetrix Electronics and suitable for industrial control CPUs, network line cards, real-time DSP subsystems, and avionics display modules requiring stable component supply across extended product lifecycles.

Supply support for CY7C1327G-133AXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for industrial, automotive, and communications markets.

The CY7C1327G belongs to Cypress's high-speed synchronous SRAM product line, designed specifically for low-latency, burst-capable cache and buffer applications in performance-critical computing and embedded systems.

FAQ

What is the required connection for the ZZ pin on CY7C1327G-133AXIT?

The ZZ pin (Pin 64) must be externally connected to ground per documented errata (Rev. *Q, page 21). Although defined as active-HIGH sleep input, internal design requires this external pull-down to ensure reliable operation and prevent unintended entry into sleep mode during normal use.

How does the MODE pin affect burst addressing behavior?

When MODE is tied to GND, the device executes linear burst sequences (e.g., 0x0000 → 0x0001 → 0x0002); when tied to VDD or left floating, it uses interleaved burst (e.g., 0x0000 → 0x0002 → 0x0001 → 0x0003), matching Intel Pentium™ processor requirements. This is a static configuration set at power-up and cannot be changed dynamically.

Can CY7C1327G-133AXIT operate with only a 3.3 V supply?

No. The device requires two independent supplies: VDD = 3.3 V ± 0.3 V for core logic and VDDQ = 2.5 V ± 0.2 V for I/O drivers. Using 3.3 V on VDDQ violates JEDEC JESD8-5 compliance, risks output driver overstress, and invalidates AC timing specifications including tCO and setup/hold margins.

What is the functional difference between ADSP and ADSC strobes?

ADSP initiates processor-style accesses: address capture occurs on its assertion, but writes require two clocks. ADSC initiates controller-style accesses: address and write data are latched in one clock, enabling single-cycle writes. ADSP takes precedence when both are asserted simultaneously, and ADSP is ignored if CE1 is inactive.

CY7C1327G-133AXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Last Time Buy
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1327G-133AXIT FAQ

1.How can I place an order for CY7C1327G-133AXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1327G-133AXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1327G-133AXIT reliable?

The price and inventory of CY7C1327G-133AXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1327G-133AXIT is usually 5 days.

3.What payment methods are accepted for CY7C1327G-133AXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1327G-133AXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1327G-133AXIT?

CY7C1327G-133AXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1327G-133AXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1327G-133AXIT?

For technical support, including CY7C1327G-133AXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1327G-133AXIT requirements.

6.How does Aetrix verify that CY7C1327G-133AXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1327G-133AXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1327G-133AXIT meets industry standards.

7.What is the process for return or replacement of CY7C1327G-133AXIT?

All CY7C1327G-133AXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1327G-133AXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1327G-133AXIT part is unused and in its original packaging.

Return procedure for CY7C1327G-133AXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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