Infineon Technologies CY7C1327G-166AXC
- Part No.:
- CY7C1327G-166AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1327G-166AXC.pdf
- Description:
- IC SRAM 4.5MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:348
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Product details
Overview
CY7C1327G-166AXC from Cypress Semiconductor is a 4-Mbit (256K × 18) pipelined synchronous SRAM with registered I/O, 3.3 V core / 2.5 V I/O supplies, 3.5 ns clock-to-output delay at 166 MHz, and support for Intel Pentium™-compatible interleaved or linear burst sequences. It serves as high-speed secondary cache in embedded processor systems requiring deterministic timing and burst-mode memory access.
For engineers reviewing the CY7C1327G-166AXC datasheet, CY7C1327G-166AXC pinout, CY7C1327G-166AXC application, or CY7C1327G-166AXC equivalent, key selection criteria include synchronous self-timed write capability, dual address strobe support (ADSP/ADSC), user-selectable burst mode via MODE pin, and ZZ sleep mode with data retention - all critical for cache subsystem integration in legacy x86 and industrial control platforms.
Technical Context
The device implements a two-bit wraparound burst counter synchronized to CLK's rising edge, enabling automatic internal address generation during burst reads/writes. All synchronous inputs - including A[1:0], CE1–CE3, ADSP/ADSC, ADV, BW[A:B], BWE, and GW - are registered on the same clock edge, ensuring precise timing alignment across pipeline stages.
It supports byte-write granularity via BWE and BW[A:B] with global write override (GW), and features asynchronous OE for output tristating independent of clock phase. The ZZ pin places the device in low-power sleep while preserving data integrity, though per errata (Rev. *Q, p.21), Pin 64 must be externally tied to ground for reliable operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 18), enabling 4.5 MB of burst-accessible cache storage per device. |
| Max Clock Frequency | 166 MHz - defines maximum sustained burst throughput of 2.98 Gbps (18-bit × 166 MHz). |
| Access Time (tCO) | 3.5 ns - guarantees deterministic data valid window after CLK edge, critical for tight-timing cache interfaces. |
| Core Supply Voltage | 3.3 V ± 0.3 V - requires dedicated low-noise core rail; not compatible with 2.5 V core logic. |
| I/O Supply Voltage | 2.5 V or 3.3 V - selectable interface voltage matching host processor I/O domain without level shifters. |
| Burst Mode Control | Strap-pin MODE (GND = linear, VDD/floating = interleaved) - configures address sequence to match Pentium/i486 or custom controller requirements. |
| Sleep Mode | Asynchronous ZZ input (active HIGH, pin 64) - reduces standby current to ≤40 mA while retaining memory contents; external ground required per errata. |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge-triggered master timing reference for all synchronous registers and burst counter. |
| ADSP / ADSC | Address strobe inputs | Separate processor (ADSP) and controller (ADSC) strobes enable dual-bus architecture support; ADSP takes precedence when both active. |
| ADV | Address advance | Active-LOW signal that increments internal burst counter on next CLK edge - enables hardware-controlled sequential addressing. |
| BWA / BWB / BWE / GW | Write control inputs | Byte-select (BWA/BWB), enable (BWE), and global override (GW) allow fine-grained or full-word writes without external glue logic. |
| DQA/DQB/DQPA/DQPB | Common I/O data bus | 18-bit bidirectional data path (16 data + 2 parity); direction controlled by asynchronous OE, not CLK. |
| ZZ | Asynchronous sleep | Active-HIGH sleep control (Pin 64); per errata, must be externally grounded to prevent unintended entry into sleep mode. |
Key Features
| Feature | Design Value |
|---|---|
| Registered pipelined I/O | Input and output registers synchronized to CLK eliminate setup/hold violations in high-speed bus designs. |
| Synchronous self-timed writes | On-chip write timing logic removes need for external write pulse generation or wait-state insertion. |
| Dual address strobe support | Independent ADSP and ADSC inputs allow seamless integration with both CPU and system controller address buses. |
| User-selectable burst order | MODE pin configures interleaved (Pentium-compatible) or linear burst addressing - no firmware or register programming required. |
| Asynchronous output enable | OE operates independently of CLK, enabling immediate tristating during bus arbitration or power transitions. |
Applications
| Secondary Cache for x86 Systems | Industrial Motion Controller Buffer |
|---|---|
|
Use Scenario: High-bandwidth instruction/data caching between Pentium-class CPUs and slower main memory in legacy industrial PCs. IC Role / Device Role / Timing Role: Pipelined SRAM acting as L2 cache with 3.5 ns tCO and burst-optimized address sequencing. Use Value: Enables 166 MHz burst transfers matching Pentium 133/166 MHz front-side bus timing without wait states. |
Use Scenario: Real-time buffering of multi-axis position commands and feedback data in CNC motion controllers. IC Role / Device Role / Timing Role: Deterministic latency SRAM storing command queues and encoder snapshots with synchronous self-timed writes. Use Value: Guarantees sub-4 ns data valid window for closed-loop servo updates, eliminating jitter from asynchronous memory access. |
| Communications Protocol Accelerator | Avionics Data Logger Interface |
|
Use Scenario: Packet header parsing and temporary frame storage in legacy telecom line cards using i486-based protocol engines. IC Role / Device Role / Timing Role: Burst-mode SRAM interfacing directly to processor local bus for zero-wait-state packet buffer access. Use Value: Supports 3-1-1-1 burst read rate to sustain 1.5 Gbps line-rate processing with minimal CPU overhead. |
Use Scenario: Buffered flight data acquisition in DO-254-certifiable avionics recorders requiring data retention during brownout events. IC Role / Device Role / Timing Role: Nonvolatile-retentive cache holding last 30 seconds of sensor telemetry before flash write. Use Value: ZZ sleep mode preserves contents at ≤40 mA while awaiting power restoration - meets ARINC 664 Part 7 transient immunity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT71V2576S166BG | Same density (256K × 18), 166 MHz, but uses single VDD = 3.3 V (no separate VDDQ); no ZZ sleep mode. | Lacks low-power sleep - unsuitable for battery-backed or intermittent-power systems. | Select when system uses only 3.3 V I/O and does not require sleep-state data retention. |
| ISSI IS61WV25618BLL-166TQLI | 256K × 18, 166 MHz, 3.3 V core + 2.5 V I/O, but lacks ADSP/ADSC dual-strobe architecture and MODE-selectable burst order. | Requires external logic to emulate Pentium interleaved bursts; no native controller-address-strobe support. | Select when design uses single-bus architecture and burst sequence is fixed in firmware. |
Compared with IDT71V2576S166BG and IS61WV25618BLL-166TQLI, the CY7C1327G-166AXC uniquely combines dual address strobes, hardware-configurable burst mode, and errata-managed ZZ sleep - making it the only drop-in solution for legacy Pentium-based cache subsystems requiring all three features.
Availability
CY7C1327G-166AXC is available at Aetrix Electronics and suitable for secondary cache subsystems, industrial motion controller buffers, communications protocol accelerators, and avionics data logger interfaces requiring stable component supply and long-term lifecycle support.
Supply support for CY7C1327G-166AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets, with emphasis on timing-critical embedded subsystems.
The CY7C1327G belongs to Cypress's legacy synchronous SRAM product line, engineered specifically for deterministic-burst cache applications in x86-compatible and real-time control systems where pipelined latency and dual-bus compatibility are mandatory.
FAQ
What is the correct configuration for the ZZ pin on CY7C1327G-166AXC?
The ZZ pin (Pin 64) must be externally connected to ground per documented errata (Rev. *Q, page 21). Although described as active-HIGH sleep input, leaving it floating or pulling it HIGH causes unreliable behavior. Grounding ensures stable operation and prevents unintended entry into sleep mode during normal use.
Does CY7C1327G-166AXC support true 166 MHz operation with 3.5 ns tCO under all conditions?
Yes - the 3.5 ns clock-to-output time is guaranteed over commercial temperature range (0°C to +70°C) and VDD = 3.3 V ± 0.3 V, VDDQ = 2.5 V ± 0.2 V, with CL = 30 pF and specified AC test loads. This value applies only to pipelined read cycles following valid ADSP/ADSC assertion and proper chip enable timing.
How does burst addressing work when MODE is set to linear versus interleaved?
In linear mode (MODE = GND), burst addresses increment sequentially: A, A+1, A+2, A+3. In interleaved mode (MODE = VDD/floating), they follow Pentium order: A, A+2, A+0, A+3 - optimized for 32-bit data bus alignment. The 2-bit internal counter wraps automatically after four beats, and ADV controls advancement timing.
Can CY7C1327G-166AXC perform byte writes without external write strobe logic?
Yes - byte writes are fully managed on-chip using BWA/BWB (byte select), BWE (enable), and GW (global override). When BWE = LOW and BW[A:B] selects specific bytes, only those bytes are written; GW = LOW forces all four 18-bit words to update. No external write pulse generator or timing circuitry is needed due to synchronous self-timed write architecture.
CY7C1327G-166AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.15V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1327G-166AXC FAQ
1.How can I place an order for CY7C1327G-166AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1327G-166AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1327G-166AXC reliable?
The price and inventory of CY7C1327G-166AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1327G-166AXC is usually 5 days.
3.What payment methods are accepted for CY7C1327G-166AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1327G-166AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1327G-166AXC?
CY7C1327G-166AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1327G-166AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1327G-166AXC?
For technical support, including CY7C1327G-166AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1327G-166AXC requirements.
6.How does Aetrix verify that CY7C1327G-166AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1327G-166AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1327G-166AXC meets industry standards.
7.What is the process for return or replacement of CY7C1327G-166AXC?
All CY7C1327G-166AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1327G-166AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1327G-166AXC part is unused and in its original packaging.
Return procedure for CY7C1327G-166AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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