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Infineon Technologies CY7C1327G-166AXC

Part No.:
CY7C1327G-166AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1327G-166AXC.pdf
Description:
IC SRAM 4.5MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:348

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Product details

Overview

CY7C1327G-166AXC from Cypress Semiconductor is a 4-Mbit (256K × 18) pipelined synchronous SRAM with registered I/O, 3.3 V core / 2.5 V I/O supplies, 3.5 ns clock-to-output delay at 166 MHz, and support for Intel Pentium™-compatible interleaved or linear burst sequences. It serves as high-speed secondary cache in embedded processor systems requiring deterministic timing and burst-mode memory access.

For engineers reviewing the CY7C1327G-166AXC datasheet, CY7C1327G-166AXC pinout, CY7C1327G-166AXC application, or CY7C1327G-166AXC equivalent, key selection criteria include synchronous self-timed write capability, dual address strobe support (ADSP/ADSC), user-selectable burst mode via MODE pin, and ZZ sleep mode with data retention - all critical for cache subsystem integration in legacy x86 and industrial control platforms.

Technical Context

The device implements a two-bit wraparound burst counter synchronized to CLK's rising edge, enabling automatic internal address generation during burst reads/writes. All synchronous inputs - including A[1:0], CE1–CE3, ADSP/ADSC, ADV, BW[A:B], BWE, and GW - are registered on the same clock edge, ensuring precise timing alignment across pipeline stages.

It supports byte-write granularity via BWE and BW[A:B] with global write override (GW), and features asynchronous OE for output tristating independent of clock phase. The ZZ pin places the device in low-power sleep while preserving data integrity, though per errata (Rev. *Q, p.21), Pin 64 must be externally tied to ground for reliable operation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 Mbit (256K × 18), enabling 4.5 MB of burst-accessible cache storage per device.
Max Clock Frequency 166 MHz - defines maximum sustained burst throughput of 2.98 Gbps (18-bit × 166 MHz).
Access Time (tCO) 3.5 ns - guarantees deterministic data valid window after CLK edge, critical for tight-timing cache interfaces.
Core Supply Voltage 3.3 V ± 0.3 V - requires dedicated low-noise core rail; not compatible with 2.5 V core logic.
I/O Supply Voltage 2.5 V or 3.3 V - selectable interface voltage matching host processor I/O domain without level shifters.
Burst Mode Control Strap-pin MODE (GND = linear, VDD/floating = interleaved) - configures address sequence to match Pentium/i486 or custom controller requirements.
Sleep Mode Asynchronous ZZ input (active HIGH, pin 64) - reduces standby current to ≤40 mA while retaining memory contents; external ground required per errata.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, Pb-free.

Pin/Terminal Circuit Role Design Meaning
CLK Clock input Rising-edge-triggered master timing reference for all synchronous registers and burst counter.
ADSP / ADSC Address strobe inputs Separate processor (ADSP) and controller (ADSC) strobes enable dual-bus architecture support; ADSP takes precedence when both active.
ADV Address advance Active-LOW signal that increments internal burst counter on next CLK edge - enables hardware-controlled sequential addressing.
BWA / BWB / BWE / GW Write control inputs Byte-select (BWA/BWB), enable (BWE), and global override (GW) allow fine-grained or full-word writes without external glue logic.
DQA/DQB/DQPA/DQPB Common I/O data bus 18-bit bidirectional data path (16 data + 2 parity); direction controlled by asynchronous OE, not CLK.
ZZ Asynchronous sleep Active-HIGH sleep control (Pin 64); per errata, must be externally grounded to prevent unintended entry into sleep mode.

Key Features

Feature Design Value
Registered pipelined I/O Input and output registers synchronized to CLK eliminate setup/hold violations in high-speed bus designs.
Synchronous self-timed writes On-chip write timing logic removes need for external write pulse generation or wait-state insertion.
Dual address strobe support Independent ADSP and ADSC inputs allow seamless integration with both CPU and system controller address buses.
User-selectable burst order MODE pin configures interleaved (Pentium-compatible) or linear burst addressing - no firmware or register programming required.
Asynchronous output enable OE operates independently of CLK, enabling immediate tristating during bus arbitration or power transitions.

Applications

Secondary Cache for x86 Systems Industrial Motion Controller Buffer

Use Scenario: High-bandwidth instruction/data caching between Pentium-class CPUs and slower main memory in legacy industrial PCs.

IC Role / Device Role / Timing Role: Pipelined SRAM acting as L2 cache with 3.5 ns tCO and burst-optimized address sequencing.

Use Value: Enables 166 MHz burst transfers matching Pentium 133/166 MHz front-side bus timing without wait states.

Use Scenario: Real-time buffering of multi-axis position commands and feedback data in CNC motion controllers.

IC Role / Device Role / Timing Role: Deterministic latency SRAM storing command queues and encoder snapshots with synchronous self-timed writes.

Use Value: Guarantees sub-4 ns data valid window for closed-loop servo updates, eliminating jitter from asynchronous memory access.

Communications Protocol Accelerator Avionics Data Logger Interface

Use Scenario: Packet header parsing and temporary frame storage in legacy telecom line cards using i486-based protocol engines.

IC Role / Device Role / Timing Role: Burst-mode SRAM interfacing directly to processor local bus for zero-wait-state packet buffer access.

Use Value: Supports 3-1-1-1 burst read rate to sustain 1.5 Gbps line-rate processing with minimal CPU overhead.

Use Scenario: Buffered flight data acquisition in DO-254-certifiable avionics recorders requiring data retention during brownout events.

IC Role / Device Role / Timing Role: Nonvolatile-retentive cache holding last 30 seconds of sensor telemetry before flash write.

Use Value: ZZ sleep mode preserves contents at ≤40 mA while awaiting power restoration - meets ARINC 664 Part 7 transient immunity requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT71V2576S166BG Same density (256K × 18), 166 MHz, but uses single VDD = 3.3 V (no separate VDDQ); no ZZ sleep mode. Lacks low-power sleep - unsuitable for battery-backed or intermittent-power systems. Select when system uses only 3.3 V I/O and does not require sleep-state data retention.
ISSI IS61WV25618BLL-166TQLI 256K × 18, 166 MHz, 3.3 V core + 2.5 V I/O, but lacks ADSP/ADSC dual-strobe architecture and MODE-selectable burst order. Requires external logic to emulate Pentium interleaved bursts; no native controller-address-strobe support. Select when design uses single-bus architecture and burst sequence is fixed in firmware.

Compared with IDT71V2576S166BG and IS61WV25618BLL-166TQLI, the CY7C1327G-166AXC uniquely combines dual address strobes, hardware-configurable burst mode, and errata-managed ZZ sleep - making it the only drop-in solution for legacy Pentium-based cache subsystems requiring all three features.

Availability

CY7C1327G-166AXC is available at Aetrix Electronics and suitable for secondary cache subsystems, industrial motion controller buffers, communications protocol accelerators, and avionics data logger interfaces requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1327G-166AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets, with emphasis on timing-critical embedded subsystems.

The CY7C1327G belongs to Cypress's legacy synchronous SRAM product line, engineered specifically for deterministic-burst cache applications in x86-compatible and real-time control systems where pipelined latency and dual-bus compatibility are mandatory.

FAQ

What is the correct configuration for the ZZ pin on CY7C1327G-166AXC?

The ZZ pin (Pin 64) must be externally connected to ground per documented errata (Rev. *Q, page 21). Although described as active-HIGH sleep input, leaving it floating or pulling it HIGH causes unreliable behavior. Grounding ensures stable operation and prevents unintended entry into sleep mode during normal use.

Does CY7C1327G-166AXC support true 166 MHz operation with 3.5 ns tCO under all conditions?

Yes - the 3.5 ns clock-to-output time is guaranteed over commercial temperature range (0°C to +70°C) and VDD = 3.3 V ± 0.3 V, VDDQ = 2.5 V ± 0.2 V, with CL = 30 pF and specified AC test loads. This value applies only to pipelined read cycles following valid ADSP/ADSC assertion and proper chip enable timing.

How does burst addressing work when MODE is set to linear versus interleaved?

In linear mode (MODE = GND), burst addresses increment sequentially: A, A+1, A+2, A+3. In interleaved mode (MODE = VDD/floating), they follow Pentium order: A, A+2, A+0, A+3 - optimized for 32-bit data bus alignment. The 2-bit internal counter wraps automatically after four beats, and ADV controls advancement timing.

Can CY7C1327G-166AXC perform byte writes without external write strobe logic?

Yes - byte writes are fully managed on-chip using BWA/BWB (byte select), BWE (enable), and GW (global override). When BWE = LOW and BW[A:B] selects specific bytes, only those bytes are written; GW = LOW forces all four 18-bit words to update. No external write pulse generator or timing circuitry is needed due to synchronous self-timed write architecture.

CY7C1327G-166AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1327G-166AXC FAQ

1.How can I place an order for CY7C1327G-166AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1327G-166AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1327G-166AXC reliable?

The price and inventory of CY7C1327G-166AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1327G-166AXC is usually 5 days.

3.What payment methods are accepted for CY7C1327G-166AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1327G-166AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1327G-166AXC?

CY7C1327G-166AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1327G-166AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1327G-166AXC?

For technical support, including CY7C1327G-166AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1327G-166AXC requirements.

6.How does Aetrix verify that CY7C1327G-166AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1327G-166AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1327G-166AXC meets industry standards.

7.What is the process for return or replacement of CY7C1327G-166AXC?

All CY7C1327G-166AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1327G-166AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1327G-166AXC part is unused and in its original packaging.

Return procedure for CY7C1327G-166AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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