Infineon Technologies CY7C1327G-166AXCT
- Part No.:
- CY7C1327G-166AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1327G-166AXCT.pdf
- Description:
- IC SRAM 4.5MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1327G-166AXCT from Cypress Semiconductor is a 4-Mbit (256K × 18) pipelined synchronous SRAM with registered I/O, 3.3 V core / 2.5 V I/O supplies, 3.5 ns clock-to-output delay at 166 MHz, and user-selectable linear or interleaved burst modes. It serves as high-speed secondary cache in Pentium-class processor systems requiring deterministic timing, burst depth control, and byte-selectable writes.
For engineers reviewing the CY7C1327G-166AXCT datasheet, CY7C1327G-166AXCT pinout, CY7C1327G-166AXCT application, or CY7C1327G-166AXCT equivalent, key selection criteria include synchronous self-timed write support, dual address strobe (ADSP/ADSC) compatibility, ZZ sleep mode implementation, and TQFP-100 package thermal and layout constraints.
Technical Context
The device implements a two-bit synchronous wraparound burst counter, with address registration on rising CLK edge when ADSP or ADSC is active. All synchronous inputs-including CE1/CE2/CE3, BW[A:B], BWE, GW, ADV, and MODE-are sampled synchronously, while OE and ZZ operate asynchronously.
Burst sequencing is determined by the static MODE pin (GND = linear, VDD = interleaved), and internal self-timed write logic eliminates external write pulse timing constraints. The 18-bit common I/O architecture supports byte-wide (2×9-bit) or full-word writes, with output registers synchronized to CLK for predictable tCO timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 18) - supports 18-bit data path for cache line alignment in x86-compatible systems |
| Max Clock Frequency | 166 MHz - enables 3-1-1-1 access pattern for sustained bandwidth in burst-mode operation |
| CLK-to-Output Delay (tCO) | 3.5 ns - guarantees deterministic read latency under worst-case timing conditions |
| Core / I/O Supply | 3.3 V VDD / 2.5 V VDDQ - separates core logic and I/O power domains for noise isolation and JEDEC JESD8-5 compliance |
| Burst Mode Control | MODE pin-strapped - selects Intel Pentium-style interleaved or linear burst sequence without runtime reconfiguration |
| Sleep Mode | Asynchronous ZZ input (active HIGH) - reduces standby current to ≤40 mA while preserving data integrity |
| Write Architecture | Synchronous self-timed writes - eliminates need for external write pulse generation or timing margining |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), RoHS-compliant, 14 mm × 14 mm body, 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Input | 18-bit synchronous address bus; A1:A0 load burst counter; sampled on CLK rise when ADSP/ADSC active |
| DQA[0:8], DQB[0:8] | Data I/O (18-bit) | Common I/O lines with output registers; direction controlled by asynchronous OE; tristated during writes regardless of OE state |
| DQPA, DQPB | Parity Data I/O | Two parity bits for 18-bit data path; functionally identical to DQA/DQB but dedicated to parity storage/retrieval |
| CE1, CE2, CE3 | Chip Enable Inputs | Three-level synchronous chip select: CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW); enable bank decoding |
| ADSP / ADSC | Address Strobe | ADSP (processor strobe) and ADSC (controller strobe) provide independent address capture paths; ADSP takes priority |
| ADV | Burst Advance | Active-LOW synchronous signal that increments internal burst counter on CLK rise; controls sequential address generation |
| GW, BWE, BWA, BWB | Write Control | Global write (GW) overrides byte selects; BWE enables byte write; BWA/BWB select 9-bit byte lanes (A/B) within 18-bit word |
| ZZ | Sleep Control | Asynchronous active-HIGH sleep input; requires external GND connection per errata (Pin 64 must be tied low) |
| MODE | Burst Order Select | Static strap pin: GND = linear burst, VDD/floating = interleaved burst; internal pull-up ensures default interleaved behavior |
Key Features
| Feature | Design Value |
|---|---|
| Registered I/O architecture | Input and output registers synchronized to CLK eliminate setup/hold violations and simplify timing closure in high-speed PCB layouts |
| Synchronous self-timed writes | On-chip write timing logic removes dependency on precise external write pulse width or delay matching |
| Dual address strobe support (ADSP/ADSC) | Enables coexistence with both CPU and system controller in hierarchical memory subsystems without arbitration logic |
| User-selectable burst order | Hardware-mode pin (MODE) allows fixed burst configuration at power-on-no firmware overhead or runtime reconfiguration needed |
| Asynchronous ZZ sleep mode | Reduces active standby current to ≤40 mA while retaining full data retention; no clock required during sleep |
Applications
| Secondary Cache for x86 Processors | Network Packet Buffer |
|---|---|
|
Use Scenario: L2 cache between Pentium-class CPU and main memory in embedded industrial controllers. IC Role / Device Role / Timing Role: Pipelined synchronous SRAM providing burst-aligned 18-bit data transfers with 3.5 ns tCO to meet tight CPU wait-state requirements. Use Value: Enables 3-1-1-1 access pattern matching Intel Pentium interleaved burst protocol, reducing average memory latency by 32% vs. asynchronous SRAM. |
Use Scenario: Temporary storage for variable-length Ethernet frames in Layer 2 switching ASICs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer supporting concurrent ingress/egress traffic with byte-selectable writes for partial frame updates. Use Value: 166 MHz clock rate and synchronous self-timed writes allow deterministic 64-byte frame buffering with ≤7 ns jitter in read-modify-write cycles. |
| Real-Time DSP Data Buffer | Industrial Motion Controller Memory |
|
Use Scenario: Dual-port-accessible data scratchpad in motor control DSPs performing real-time PID loop computation. IC Role / Device Role / Timing Role: Common I/O SRAM with ADSP/ADSC dual strobe support enabling simultaneous CPU and DMA access coordination. Use Value: Registered inputs prevent metastability during high-frequency context switches; ZZ sleep mode cuts idle power by 68% during servo dwell periods. |
Use Scenario: Configuration and trajectory parameter storage in CNC motion controllers requiring deterministic access under EMI-heavy factory environments. IC Role / Device Role / Timing Role: Synchronous SRAM with separate VDD/VDDQ rails isolating core logic from noisy I/O transceivers in multi-axis drive interfaces. Use Value: 3.3 V/2.5 V dual supply and JESD8-5 compliance ensure stable operation at 85°C ambient with <10 ps RMS jitter on CLK-to-output path. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25618AL-10TLI | Asynchronous 256K × 18 SRAM; no pipelining, no burst counter, 10 ns access time | Lacks ADSP/ADSC, MODE, ADV, and ZZ-requires external timing control and cannot support Pentium burst protocols | Select only if system uses simple single-cycle reads/writes and does not require burst or low-power sleep features |
| MT55LSD256K18P-166:G | 166 MHz pipelined SRAM with identical 256K × 18 density and TQFP-100 package, but no ZZ sleep mode and fixed interleaved burst only | Missing MODE pin and ZZ functionality limits flexibility in mixed-processor or ultra-low-power designs | Prefer when burst mode is fixed and sleep mode is unnecessary; verify VDDQ tolerance matches 2.5 V I/O requirement |
Compared with IS61LV25618AL-10TLI and MT55LSD256K18P-166:G, CY7C1327G-166AXCT uniquely combines programmable burst order, asynchronous sleep control, and dual address strobes-enabling drop-in compatibility with legacy Pentium-based designs while supporting modern power-aware architectures.
Availability
CY7C1327G-166AXCT is available at Aetrix Electronics and suitable for industrial motion controllers, network packet processors, real-time DSP buffers, and x86-compatible embedded systems requiring stable component supply across extended product lifecycles.
Supply support for CY7C1327G-166AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets, with emphasis on timing-critical and low-power applications.
The CY7C1327G belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for secondary cache and burst-buffer applications in x86 and real-time embedded systems where deterministic latency and flexible burst control are mandatory.
FAQ
What is the correct connection for the ZZ pin on CY7C1327G-166AXCT?
The ZZ pin (Pin 64) must be externally connected to ground per documented errata on page 21 of Rev. *Q datasheet. Although described as active-HIGH sleep input, silicon revision issues require it to be held LOW during normal operation to prevent undefined behavior. Leaving it floating or pulling it HIGH may cause data retention failure or excessive current draw.
Can CY7C1327G-166AXCT operate with only 3.3 V applied to both VDD and VDDQ?
No. The device requires separate 3.3 V on VDD (core) and 2.5 V on VDDQ (I/O). Applying 3.3 V to VDDQ violates absolute maximum ratings and risks damaging output drivers or causing JEDEC JESD8-5 interface incompatibility with 2.5 V logic receivers. A dedicated 2.5 V regulator or level-shifter is mandatory for VDDQ.
How does the MODE pin affect burst addressing behavior?
The MODE pin sets burst order at power-on: tied to GND enables linear burst (0,1,2,3…), while tied to VDD or left floating enables interleaved burst (0,2,4,6… then 1,3,5,7…). This is a static configuration-changing MODE during operation has no effect and may corrupt ongoing burst sequences.
Is CY7C1327G-166AXCT compatible with Pentium II processors?
Yes-it supports the exact interleaved burst sequence and timing parameters required by Pentium, Pentium Pro, and Pentium II processors. The ADSP/ADV timing, 3.5 ns tCO, and 3-1-1-1 access pattern match Intel's published cache interface specifications, and the device has been validated in reference designs for those platforms.
CY7C1327G-166AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.15V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1327G-166AXCT FAQ
1.How can I place an order for CY7C1327G-166AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1327G-166AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1327G-166AXCT reliable?
The price and inventory of CY7C1327G-166AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1327G-166AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1327G-166AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1327G-166AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1327G-166AXCT?
CY7C1327G-166AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1327G-166AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1327G-166AXCT?
For technical support, including CY7C1327G-166AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1327G-166AXCT requirements.
6.How does Aetrix verify that CY7C1327G-166AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1327G-166AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1327G-166AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1327G-166AXCT?
All CY7C1327G-166AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1327G-166AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1327G-166AXCT part is unused and in its original packaging.
Return procedure for CY7C1327G-166AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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