Infineon Technologies CY7C1329H-133AXCT
- Part No.:
- CY7C1329H-133AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1329H-133AXCT.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,015
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Product details
Overview
CY7C1329H-133AXCT from Cypress Semiconductor is a 2-Mbit (64K × 32) pipelined synchronous SRAM with registered I/O, 3.3 V core supply, 2.5 V/3.3 V I/O compatibility, and 4.0 ns clock-to-output delay at 133 MHz. It supports Intel Pentium®-compatible interleaved or linear burst sequences and is used in high-speed secondary cache subsystems for embedded processors and communications controllers.
For engineers reviewing the CY7C1329H-133AXCT datasheet, CY7C1329H-133AXCT pinout, CY7C1329H-133AXCT application, or CY7C1329H-133AXCT equivalent, key selection factors include synchronous burst timing, byte-write granularity via BW[A:D]/BWE/GW controls, dual address strobe support (ADSP/ADSC), ZZ sleep mode, and JEDEC-standard 100-pin TQFP packaging.
Technical Context
The CY7C1329H-133AXCT implements a two-bit synchronous wraparound burst counter fed by A1:A0, enabling programmable interleaved or linear burst addressing per MODE pin configuration. All synchronous inputs-including address, data, CE1/CE2/CE3, ADSP/ADSC/ADV, and write controls-are registered on the rising edge of CLK.
It features pipelined read/write paths with separate processor (ADSP) and controller (ADSC) address strobes, asynchronous OE and ZZ controls, and on-chip self-timed write circuitry. Byte writes are enabled via BWE and BW[A:D], while GW provides global write override-both sampled synchronously on CLK rise.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Mbit (64K × 32) - supports 32-bit wide data path for cache line transfers |
| Max Clock Frequency | 133 MHz - enables 3-1-1-1 access rate for high-throughput burst reads/writes |
| Access Time (tCO) | 4.0 ns - defines minimum clock-to-output delay for timing-critical cache interfaces |
| Core Supply Voltage | 3.3 V ± 0.3 V - powers internal logic and memory array; requires dedicated low-noise regulation |
| I/O Supply Voltage | 2.5 V or 3.3 V - allows direct interfacing with mixed-voltage SoCs or FPGAs |
| Burst Mode Control | MODE pin strap - selects Intel Pentium®-interleaved or linear sequence; static during operation |
| Sleep Mode | ZZ input (asynchronous, active HIGH) - reduces standby current to ≤40 mA while preserving data |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), JEDEC-standard lead-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Synchronous Address Input | Sampled on CLK rise when ADSP or ADSC active; A1:A0 feed burst counter |
| DQA–DQD | Common I/O Data Bus (32-bit) | Bidirectional; direction controlled by OE; tri-stated automatically during writes |
| CE1, CE2, CE3 | Synchronous Chip Enable | CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW); enable bank selection with timing control |
| ADSP / ADSC | Address Strobe (Processor / Controller) | ADSP takes priority; both sampled on CLK rise to latch address and initiate access |
| ADV | Address Advance Control | Active LOW on CLK rise increments burst address; required for multi-cycle burst sequences |
| BWA–BWD, BWE, GW | Byte Write Controls | BWE enables byte writes; BW[A:D] select individual 8-bit lanes; GW overrides all for full-word write |
| OE | Asynchronous Output Enable | Active LOW enables output drivers; masked during first cycle after deselection |
| ZZ | Asynchronous Sleep Input | Active HIGH places device in low-power sleep; internal pull-down; no external bias needed |
Key Features
| Feature | Design Value |
|---|---|
| Registered pipelined I/O | Eliminates external latch requirements and simplifies timing closure for 133 MHz system clocks |
| User-selectable burst order | MODE pin configures interleaved (Pentium®) or linear burst without firmware change or reconfiguration |
| Synchronous self-timed write | Removes need for external write pulse generation; write completion is internally managed per clock cycle |
| Independent ADSP/ADSC strobes | Enables coexistence of processor and memory controller in shared-bus architectures without arbitration logic |
| Asynchronous ZZ sleep mode | Reduces power to ≤40 mA while retaining data integrity-critical for battery-backed or low-duty-cycle systems |
Applications
| Network Router Cache | Industrial PLC Memory Buffer |
|---|---|
|
Use Scenario: High-speed packet forwarding engine requiring deterministic latency for L2 cache lookups. IC Role / Device Role / Timing Role: Secondary cache SRAM providing 32-bit burst reads at 133 MHz with 4.0 ns tCO for pipeline-aligned fetches. Use Value: Enables consistent sub-5 ns read response under sustained traffic load, reducing packet jitter in QoS-sensitive routing. |
Use Scenario: Real-time motion control module buffering encoder position data and servo command streams. IC Role / Device Role / Timing Role: Synchronous buffer with ADSC-triggered single-cycle writes and ADSP-initiated burst reads for deterministic I/O handshaking. Use Value: Guarantees atomic 32-bit updates and burst-aligned reads across multiple axes without software overhead or bus contention. |
| Telecom Baseband Processor | Avionics Data Acquisition Unit |
|
Use Scenario: FPGA-based digital signal processing subsystem handling TDMA frame buffers and FFT coefficient tables. IC Role / Device Role / Timing Role: Pipelined SRAM interfaced to FPGA fabric via 2.5 V I/O banks, using linear burst for sequential coefficient access. Use Value: Matches FPGA register-to-memory timing budget with zero external wait states, improving FFT throughput by ≥18% vs. async SRAM. |
Use Scenario: DO-254-compliant flight data recorder capturing sensor telemetry at 10 kHz with nonvolatile backup. IC Role / Device Role / Timing Role: High-reliability cache holding last 2 seconds of raw sensor samples before EEPROM dump; ZZ mode minimizes power between bursts. Use Value: Maintains data integrity during brown-out events via ZZ sleep retention, meeting RTCA/DO-160 Section 21 surge immunity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102432BLL-133TQLI | Same density (64K × 32), 133 MHz, but uses single CE and lacks ADSP/ADSC dual strobe architecture | Requires external address latching logic for processor/controller separation; no native burst counter | Prefer when system uses unified address strobe and simpler control logic is acceptable |
| Micron MT55LSD12832D-133:J | 133 MHz, 64K × 32, but only supports linear burst; no MODE pin or interleaved option | Not compatible with Pentium®-based legacy designs requiring interleaved addressing | Select only for new designs committed to linear-only burst and simplified pinout |
Compared with IS61WV102432BLL-133TQLI and MT55LSD12832D-133:J, the CY7C1329H-133AXCT uniquely delivers dual-address-strobe support, hardware-configurable burst order, and integrated ZZ sleep-making it irreplaceable in legacy Pentium®-compatible or mixed-controller architectures where timing determinism and low-power retention are mandatory.
Availability
CY7C1329H-133AXCT is available at Aetrix Electronics and suitable for network router cache, industrial PLC memory buffer, and avionics data acquisition requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for CY7C1329H-133AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, with focus on reliability, timing precision, and industrial longevity.
The CY7C1329H belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for deterministic cache and buffer applications in telecom, industrial control, and aerospace systems demanding sub-5 ns access and robust burst sequencing.
FAQ
What is the function of the MODE pin on CY7C1329H-133AXCT?
The MODE pin is a static configuration input that selects burst address sequence: tied to GND for linear burst (sequential A0–A15 increment), or left floating/tied to VDD for Intel Pentium®-compatible interleaved burst. It must remain stable during operation and is sampled only at power-up or reset-not dynamically reconfigurable.
Can CY7C1329H-133AXCT operate with 2.5 V I/O while using 3.3 V core supply?
Yes. The device supports independent VDDQ (2.5 V or 3.3 V) and VDD (3.3 V) supplies. VDDQ powers only the I/O buffers and must be decoupled separately; mixing 2.5 V I/O with 3.3 V core is fully compliant per JESD8-5 and verified in the datasheet's electrical characteristics table.
How does ADSP differ from ADSC in timing behavior?
ADSP initiates a two-cycle write (address latched on first CLK, data written on second), while ADSC enables single-cycle writes. Both trigger address registration on CLK rise, but ADSP ignores ADV during the first cycle and requires explicit GW/BWE assertion on the second edge-critical for processor-driven cache fills.
Is the ZZ sleep mode compatible with asynchronous OE deassertion?
Yes. ZZ (asynchronous, active HIGH) and OE (asynchronous, active LOW) operate independently: ZZ reduces core current to ≤40 mA while preserving data, while OE controls I/O driver state. Both can be asserted simultaneously-OE HIGH tri-states outputs, ZZ HIGH disables core clocks-enabling lowest possible standby power without data loss.
CY7C1329H-133AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 2Mbit
- Memory Organization:
- 64K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4 ns
- Voltage - Supply:
- 3.15V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1329H-133AXCT FAQ
1.How can I place an order for CY7C1329H-133AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1329H-133AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1329H-133AXCT reliable?
The price and inventory of CY7C1329H-133AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1329H-133AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1329H-133AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1329H-133AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1329H-133AXCT?
CY7C1329H-133AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1329H-133AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1329H-133AXCT?
For technical support, including CY7C1329H-133AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1329H-133AXCT requirements.
6.How does Aetrix verify that CY7C1329H-133AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1329H-133AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1329H-133AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1329H-133AXCT?
All CY7C1329H-133AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1329H-133AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1329H-133AXCT part is unused and in its original packaging.
Return procedure for CY7C1329H-133AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1329H-133AXCT Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C08C-STUM-T
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