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Infineon Technologies CY7C1329H-133AXCT

Part No.:
CY7C1329H-133AXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1329H-133AXCT.pdf
Description:
IC SRAM 2MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,015

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Product details

Overview

CY7C1329H-133AXCT from Cypress Semiconductor is a 2-Mbit (64K × 32) pipelined synchronous SRAM with registered I/O, 3.3 V core supply, 2.5 V/3.3 V I/O compatibility, and 4.0 ns clock-to-output delay at 133 MHz. It supports Intel Pentium®-compatible interleaved or linear burst sequences and is used in high-speed secondary cache subsystems for embedded processors and communications controllers.

For engineers reviewing the CY7C1329H-133AXCT datasheet, CY7C1329H-133AXCT pinout, CY7C1329H-133AXCT application, or CY7C1329H-133AXCT equivalent, key selection factors include synchronous burst timing, byte-write granularity via BW[A:D]/BWE/GW controls, dual address strobe support (ADSP/ADSC), ZZ sleep mode, and JEDEC-standard 100-pin TQFP packaging.

Technical Context

The CY7C1329H-133AXCT implements a two-bit synchronous wraparound burst counter fed by A1:A0, enabling programmable interleaved or linear burst addressing per MODE pin configuration. All synchronous inputs-including address, data, CE1/CE2/CE3, ADSP/ADSC/ADV, and write controls-are registered on the rising edge of CLK.

It features pipelined read/write paths with separate processor (ADSP) and controller (ADSC) address strobes, asynchronous OE and ZZ controls, and on-chip self-timed write circuitry. Byte writes are enabled via BWE and BW[A:D], while GW provides global write override-both sampled synchronously on CLK rise.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 2 Mbit (64K × 32) - supports 32-bit wide data path for cache line transfers
Max Clock Frequency 133 MHz - enables 3-1-1-1 access rate for high-throughput burst reads/writes
Access Time (tCO) 4.0 ns - defines minimum clock-to-output delay for timing-critical cache interfaces
Core Supply Voltage 3.3 V ± 0.3 V - powers internal logic and memory array; requires dedicated low-noise regulation
I/O Supply Voltage 2.5 V or 3.3 V - allows direct interfacing with mixed-voltage SoCs or FPGAs
Burst Mode Control MODE pin strap - selects Intel Pentium®-interleaved or linear sequence; static during operation
Sleep Mode ZZ input (asynchronous, active HIGH) - reduces standby current to ≤40 mA while preserving data

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), JEDEC-standard lead-free, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A0–A15 Synchronous Address Input Sampled on CLK rise when ADSP or ADSC active; A1:A0 feed burst counter
DQA–DQD Common I/O Data Bus (32-bit) Bidirectional; direction controlled by OE; tri-stated automatically during writes
CE1, CE2, CE3 Synchronous Chip Enable CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW); enable bank selection with timing control
ADSP / ADSC Address Strobe (Processor / Controller) ADSP takes priority; both sampled on CLK rise to latch address and initiate access
ADV Address Advance Control Active LOW on CLK rise increments burst address; required for multi-cycle burst sequences
BWA–BWD, BWE, GW Byte Write Controls BWE enables byte writes; BW[A:D] select individual 8-bit lanes; GW overrides all for full-word write
OE Asynchronous Output Enable Active LOW enables output drivers; masked during first cycle after deselection
ZZ Asynchronous Sleep Input Active HIGH places device in low-power sleep; internal pull-down; no external bias needed

Key Features

Feature Design Value
Registered pipelined I/O Eliminates external latch requirements and simplifies timing closure for 133 MHz system clocks
User-selectable burst order MODE pin configures interleaved (Pentium®) or linear burst without firmware change or reconfiguration
Synchronous self-timed write Removes need for external write pulse generation; write completion is internally managed per clock cycle
Independent ADSP/ADSC strobes Enables coexistence of processor and memory controller in shared-bus architectures without arbitration logic
Asynchronous ZZ sleep mode Reduces power to ≤40 mA while retaining data integrity-critical for battery-backed or low-duty-cycle systems

Applications

Network Router Cache Industrial PLC Memory Buffer

Use Scenario: High-speed packet forwarding engine requiring deterministic latency for L2 cache lookups.

IC Role / Device Role / Timing Role: Secondary cache SRAM providing 32-bit burst reads at 133 MHz with 4.0 ns tCO for pipeline-aligned fetches.

Use Value: Enables consistent sub-5 ns read response under sustained traffic load, reducing packet jitter in QoS-sensitive routing.

Use Scenario: Real-time motion control module buffering encoder position data and servo command streams.

IC Role / Device Role / Timing Role: Synchronous buffer with ADSC-triggered single-cycle writes and ADSP-initiated burst reads for deterministic I/O handshaking.

Use Value: Guarantees atomic 32-bit updates and burst-aligned reads across multiple axes without software overhead or bus contention.

Telecom Baseband Processor Avionics Data Acquisition Unit

Use Scenario: FPGA-based digital signal processing subsystem handling TDMA frame buffers and FFT coefficient tables.

IC Role / Device Role / Timing Role: Pipelined SRAM interfaced to FPGA fabric via 2.5 V I/O banks, using linear burst for sequential coefficient access.

Use Value: Matches FPGA register-to-memory timing budget with zero external wait states, improving FFT throughput by ≥18% vs. async SRAM.

Use Scenario: DO-254-compliant flight data recorder capturing sensor telemetry at 10 kHz with nonvolatile backup.

IC Role / Device Role / Timing Role: High-reliability cache holding last 2 seconds of raw sensor samples before EEPROM dump; ZZ mode minimizes power between bursts.

Use Value: Maintains data integrity during brown-out events via ZZ sleep retention, meeting RTCA/DO-160 Section 21 surge immunity requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV102432BLL-133TQLI Same density (64K × 32), 133 MHz, but uses single CE and lacks ADSP/ADSC dual strobe architecture Requires external address latching logic for processor/controller separation; no native burst counter Prefer when system uses unified address strobe and simpler control logic is acceptable
Micron MT55LSD12832D-133:J 133 MHz, 64K × 32, but only supports linear burst; no MODE pin or interleaved option Not compatible with Pentium®-based legacy designs requiring interleaved addressing Select only for new designs committed to linear-only burst and simplified pinout

Compared with IS61WV102432BLL-133TQLI and MT55LSD12832D-133:J, the CY7C1329H-133AXCT uniquely delivers dual-address-strobe support, hardware-configurable burst order, and integrated ZZ sleep-making it irreplaceable in legacy Pentium®-compatible or mixed-controller architectures where timing determinism and low-power retention are mandatory.

Availability

CY7C1329H-133AXCT is available at Aetrix Electronics and suitable for network router cache, industrial PLC memory buffer, and avionics data acquisition requiring stable component supply, long-lifecycle support, and traceable sourcing.

Supply support for CY7C1329H-133AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, with focus on reliability, timing precision, and industrial longevity.

The CY7C1329H belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for deterministic cache and buffer applications in telecom, industrial control, and aerospace systems demanding sub-5 ns access and robust burst sequencing.

FAQ

What is the function of the MODE pin on CY7C1329H-133AXCT?

The MODE pin is a static configuration input that selects burst address sequence: tied to GND for linear burst (sequential A0–A15 increment), or left floating/tied to VDD for Intel Pentium®-compatible interleaved burst. It must remain stable during operation and is sampled only at power-up or reset-not dynamically reconfigurable.

Can CY7C1329H-133AXCT operate with 2.5 V I/O while using 3.3 V core supply?

Yes. The device supports independent VDDQ (2.5 V or 3.3 V) and VDD (3.3 V) supplies. VDDQ powers only the I/O buffers and must be decoupled separately; mixing 2.5 V I/O with 3.3 V core is fully compliant per JESD8-5 and verified in the datasheet's electrical characteristics table.

How does ADSP differ from ADSC in timing behavior?

ADSP initiates a two-cycle write (address latched on first CLK, data written on second), while ADSC enables single-cycle writes. Both trigger address registration on CLK rise, but ADSP ignores ADV during the first cycle and requires explicit GW/BWE assertion on the second edge-critical for processor-driven cache fills.

Is the ZZ sleep mode compatible with asynchronous OE deassertion?

Yes. ZZ (asynchronous, active HIGH) and OE (asynchronous, active LOW) operate independently: ZZ reduces core current to ≤40 mA while preserving data, while OE controls I/O driver state. Both can be asserted simultaneously-OE HIGH tri-states outputs, ZZ HIGH disables core clocks-enabling lowest possible standby power without data loss.

CY7C1329H-133AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
2Mbit
Memory Organization:
64K x 32
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1329H-133AXCT FAQ

1.How can I place an order for CY7C1329H-133AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1329H-133AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1329H-133AXCT reliable?

The price and inventory of CY7C1329H-133AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1329H-133AXCT is usually 5 days.

3.What payment methods are accepted for CY7C1329H-133AXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1329H-133AXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1329H-133AXCT?

CY7C1329H-133AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1329H-133AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1329H-133AXCT?

For technical support, including CY7C1329H-133AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1329H-133AXCT requirements.

6.How does Aetrix verify that CY7C1329H-133AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1329H-133AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1329H-133AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1329H-133AXCT?

All CY7C1329H-133AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1329H-133AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1329H-133AXCT part is unused and in its original packaging.

Return procedure for CY7C1329H-133AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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