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Infineon Technologies CY7C1329H-166AXC

Part No.:
CY7C1329H-166AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1329H-166AXC.pdf
Description:
IC SRAM 2MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,295

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Product details

Overview

CY7C1329H-166AXC from Cypress Semiconductor is a 2-Mbit (64K × 32) pipelined synchronous SRAM with registered I/O, 3.3V core supply, 2.5V/3.3V I/O compatibility, and 3.5 ns clock-to-output delay at 166 MHz. It implements a two-bit wraparound burst counter for Intel Pentium®-compatible interleaved or linear burst sequences and supports byte-write and global-write operations in high-speed cache subsystems.

For engineers reviewing the CY7C1329H-166AXC datasheet, CY7C1329H-166AXC pinout, CY7C1329H-166AXC application, or CY7C1329H-166AXC equivalent, key selection criteria include synchronous burst timing, dual-address-strobe (ADSP/ADSC) support, ZZ sleep mode entry/exit timing, JEDEC JESD8-5 I/O compliance, and TQFP-100 package mechanical constraints.

Technical Context

The CY7C1329H-166AXC uses positive-edge-triggered CLK to register all synchronous inputs-including ADSP, ADSC, ADV, CE1–CE3, BWA–BWD, BWE, GW-and latches outputs via output registers. Its internal two-bit burst counter (fed by A1,A0) generates sequential addresses during burst reads/writes under ADV control.

Burst order (interleaved or linear) is statically selected via MODE pin; interleaved mode matches Pentium® address mapping, while linear mode suits x86-compatible or custom controllers. Write cycles are self-timed and support single-cycle ADSC-initiated or two-cycle ADSP-initiated writes, with OE-controlled tri-state outputs and automatic DQ tri-state during write detection.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 2 Mbit (64K × 32), enabling 256 KB of data storage per device in common-I/O architecture
Max Clock Frequency 166 MHz - defines maximum sustained burst throughput of 664 MB/s (32-bit × 166 MHz)
Access Time (tCO) 3.5 ns - guarantees data valid at DQ within 3.5 ns after rising CLK edge for timing-critical cache interfaces
Core Supply Voltage 3.3 V ± 0.3 V - requires dedicated low-noise 3.3V rail; not compatible with 2.5V core logic
I/O Supply Range 2.5 V or 3.3 V - allows interoperability with both 2.5V and 3.3V processor buses without level shifters
Sleep Current (IDDZZ) 40 mA - measured with ZZ > VDD – 0.2 V; enables power reduction during idle cache cycles
Burst Counter Width 2-bit wraparound - generates four-address bursts (A1,A0) supporting Pentium®-aligned or linear sequences

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-standard lead-free, 14 mm × 14 mm body, 0.5 mm pitch.

Pin/Terminal Circuit Role Design Meaning
CLK Synchronous clock input Positive-edge-triggered master clock for all registered inputs/outputs; drives burst counter increment on ADV assertion
ADSP / ADSC Address strobe inputs ADSP initiates processor-originated accesses; ADSC enables controller-originated single-cycle writes; mutually exclusive priority
ADV Burst advance control Active-low signal sampled on CLK rise to auto-increment burst counter; required for multi-beat burst sequencing
BWA–BWD, BWE, GW Byte/global write controls BWA–BWD select individual 8-bit lanes; BWE enables byte-write qualification; GW overrides all and writes all 32 bits
OE Asynchronous output enable Active-low; tri-states DQ pins immediately when HIGH, overriding clock timing-critical for bus sharing
ZZ Asynchronous sleep control Active-high; places device in low-power state with data retention; requires 2-clock-cycle entry/exit latency
MODE Burst sequence selector Static strap pin: GND = linear burst, VDD/floating = interleaved (Pentium®-compatible); must remain stable during operation
DQA–DQD Common I/O data bus Four 8-bit bidirectional lanes (32-bit total); direction controlled by OE; automatically tri-stated during writes for bus integrity

Key Features

Feature Design Value
Pipelined synchronous interface Registered address/data/control inputs and output registers eliminate external latch requirements and simplify timing closure
User-selectable burst order MODE pin configures interleaved (Pentium®) or linear burst without firmware change-enables reuse across CPU families
Synchronous self-timed write On-chip write sequencer eliminates external write-strobe generation and reduces controller overhead for burst writes
Dual address strobe support Separate ADSP (processor) and ADSC (controller) inputs allow independent access arbitration in multi-master systems
JEDEC JESD8-5 I/O compatibility Ensures electrical interoperability with 2.5V and 3.3V LVTTL/LVCMOS buses without external voltage translation

Applications

Secondary Cache for x86 Processors High-Speed Network Buffer Memory

Use Scenario: Used as L2 cache between Pentium®-class CPUs and main memory in embedded industrial controllers.

IC Role / Device Role / Timing Role: Pipelined SRAM provides zero-wait-state burst reads/writes synchronized to CPU clock; interleaved burst mode matches Pentium® address mapping.

Use Value: 3.5 ns tCO and 166 MHz operation enable full-bandwidth utilization of 32-bit front-side bus without cycle stretching.

Use Scenario: Implements packet buffer in 10/100 Mbps Ethernet switch ASICs requiring deterministic latency and burst coalescing.

IC Role / Device Role / Timing Role: Acts as shared FIFO buffer with ADSC-initiated single-cycle writes and ADSP-initiated burst reads for frame assembly/disassembly.

Use Value: Byte-write capability (BWA–BWD + BWE) allows partial-frame updates without read-modify-write, reducing bus occupancy.

Real-Time DSP Data Buffer Industrial PLC Instruction Cache

Use Scenario: Stores coefficient tables and intermediate results in fixed-point DSP subsystems operating at ≤166 MHz.

IC Role / Device Role / Timing Role: Synchronous self-timed writes and ZZ sleep mode support deterministic interrupt response and low-power idle states.

Use Value: 40 mA IDDZZ and 2-clock ZZ entry/exit enable rapid power-state transitions aligned with processing task boundaries.

Use Scenario: Holds executable ladder-logic instructions in programmable logic controllers requiring nonvolatile backup and fast fetch.

IC Role / Device Role / Timing Role: Common-I/O architecture simplifies PCB routing; MODE-strapped linear burst supports sequential instruction prefetch.

Use Value: 64K × 32 organization delivers 256 KB code space with single-device footprint, reducing board area vs. multiple smaller SRAMs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV102432BLL-166TQLI Same density (64K × 32), 166 MHz, but uses single CE and lacks ADSP/ADSC dual-strobe architecture Requires external address latching for processor/controller arbitration; no native Pentium® burst mode Select when system uses unified address strobe and does not require Intel-compatible burst ordering
ON Semiconductor MC10E131FN ECL-based 32-bit latch (not SRAM); no memory array; 1.5 ns propagation, but no storage capability Only suitable for pipeline register stages-not for data retention or burst buffering Select only for pure clock-domain synchronization; not a functional replacement for CY7C1329H-166AXC memory function

Compared with IS61WV102432BLL-166TQLI, CY7C1329H-166AXC offers native dual-strobe arbitration and configurable burst modes critical for x86 cache designs; versus MC10E131FN, it provides actual 2-Mbit storage-not just signal registration-making it irreplaceable in memory-buffering roles.

Availability

CY7C1329H-166AXC is available at Aetrix Electronics and suitable for secondary cache subsystems, high-speed network buffers, and real-time DSP data buffers requiring stable component supply, long-lifecycle support, and JEDEC-compliant TQFP packaging.

Supply support for CY7C1329H-166AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.

The CY7C1329H belongs to Cypress's high-speed synchronous SRAM product line, designed specifically for low-latency, burst-capable cache and buffer applications in x86 and custom controller-based systems.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin selects burst sequence order: tied to GND for linear burst, or left floating/VDD for interleaved (Intel Pentium®-compatible) burst. It is a static strap pin-must remain unchanged during operation. Internal pull-up ensures default interleaved behavior if unconnected. Incorrect MODE configuration causes misaligned burst addressing and data corruption.

How does the ZZ sleep mode interact with ongoing memory accesses?

ZZ sleep mode requires the device to be fully deselected (CE1, CE2, CE3 inactive; ADSP/ADSC deasserted) before activation. Any pending access at ZZ assertion is invalidated and not guaranteed to complete. Entry and exit each require exactly two clock cycles (2tCYC), during which no valid accesses may occur. Data integrity is preserved throughout sleep.

Can ADSP and ADSC be asserted simultaneously, and what happens if they are?

No-ADSP and ADSC are mutually exclusive. When both are LOW, only ADSP is recognized and ADSC is ignored. This priority ensures deterministic behavior in mixed-processor/controller systems. Asserting both violates the truth table and may cause undefined address capture or burst counter initialization.

What is the timing relationship between ADV and burst address generation?

ADV must be asserted LOW synchronously with the rising edge of CLK to increment the internal 2-bit burst counter. The new address appears at the memory array inputs on the subsequent CLK edge. ADV is sampled only during active burst cycles-ignored during single-access or deselected states-and must remain stable for setup/hold relative to CLK.

CY7C1329H-166AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
2Mbit
Memory Organization:
64K x 32
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1329H-166AXC FAQ

1.How can I place an order for CY7C1329H-166AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1329H-166AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1329H-166AXC reliable?

The price and inventory of CY7C1329H-166AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1329H-166AXC is usually 5 days.

3.What payment methods are accepted for CY7C1329H-166AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1329H-166AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1329H-166AXC?

CY7C1329H-166AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1329H-166AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1329H-166AXC?

For technical support, including CY7C1329H-166AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1329H-166AXC requirements.

6.How does Aetrix verify that CY7C1329H-166AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1329H-166AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1329H-166AXC meets industry standards.

7.What is the process for return or replacement of CY7C1329H-166AXC?

All CY7C1329H-166AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1329H-166AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1329H-166AXC part is unused and in its original packaging.

Return procedure for CY7C1329H-166AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1329H-166AXC Tags

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