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Infineon Technologies CY7C1329H-166AXCT

Part No.:
CY7C1329H-166AXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1329H-166AXCT.pdf
Description:
IC SRAM 2MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,018

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Product details

Overview

CY7C1329H-166AXCT from Cypress Semiconductor is a 2-Mbit (64K × 32) pipelined synchronous SRAM with registered I/O, 3.3V core supply, 2.5V/3.3V I/O compatibility, and 3.5 ns clock-to-output delay at 166 MHz. It implements a two-bit wraparound burst counter for Intel Pentium®-compatible interleaved or linear burst sequences and supports byte-selectable writes via BWA–BWD and BWE. Used in high-speed secondary cache subsystems for embedded processors requiring deterministic timing and low-latency burst access.

For engineers reviewing the CY7C1329H-166AXCT datasheet, CY7C1329H-166AXCT pinout, CY7C1329H-166AXCT application, or CY7C1329H-166AXCT equivalent, key selection criteria include synchronous burst addressing with ADSP/ADSC strobes, ZZ sleep mode entry/exit timing (2tCYC), self-timed write control, JEDEC JESD8-5 I/O compliance, and 100-pin TQFP package mechanical compatibility.

Technical Context

The CY7C1329H-166AXCT uses a positive-edge-triggered CLK to register all synchronous inputs-including address (A0–A15), chip enables (CE1–CE3), burst controls (ADSP, ADSC, ADV), and write enables (BWA–BWD, BWE, GW). Its internal two-bit burst counter, seeded by A1/A0, generates sequential addresses for 4-word bursts under MODE pin selection (interleaved or linear).

Write operations are self-timed and support both global (GW-active) and byte-selectable (BWE + BW[A:D]) modes. Asynchronous OE controls I/O direction, while ZZ enables sleep mode with guaranteed data retention and 2-cycle entry/exit latency. All outputs are registered on CLK rise, enabling precise timing closure in high-frequency bus interfaces.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 2 Mbit (64K × 32 bits); provides full-word parallel interface for cache line storage without external multiplexing.
Max clock frequency 166 MHz; enables 166 million synchronous transactions per second with deterministic pipeline latency.
Access time (tCO) 3.5 ns; defines minimum clock-to-output delay for read data valid at next rising edge-critical for tight setup/hold budgets.
Burst capability 4-word wraparound burst with user-selectable interleaved or linear sequence; matches Pentium® and i486™ bus protocols.
Power supply 3.3V core (VDD), 2.5V/3.3V I/O (VDDQ); allows mixed-voltage system integration with legacy or low-voltage peripherals.
Sleep current (IDDZZ) 40 mA max; enables power gating during idle cycles while preserving memory contents without refresh.
Package 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch); JEDEC-standard lead-free footprint compatible with automated SMT assembly.

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC MO-140AC compliant, body size 14 mm × 14 mm, lead pitch 0.5 mm.

Pin/Terminal Circuit Role Design Meaning
CLK Synchronous clock input Positive-edge-triggered master timing reference for all registered inputs and output registers; drives burst counter increment on ADV assertion.
ADSP / ADSC Address strobe inputs Asynchronous processor/controller address latching triggers; ADSP takes priority when both asserted-enables dual-bus architecture support.
ADV Burst advance control Active-low synchronous signal that increments internal 2-bit burst counter on CLK rise-determines burst address progression.
BWA–BWD, BWE, GW Byte write controls Enable selective 1–4 byte writes per cycle; BWE qualifies BW[A:D], while GW overrides all for full-word write-reduces bus traffic and power.
OE Asynchronous output enable Tri-states DQ pins immediately when HIGH; masks first-cycle output during deselected-to-selected transitions to prevent bus contention.
ZZ Asynchronous sleep enable Places device in low-power retention mode with 2-clock-cycle entry/exit latency; internal pull-down ensures safe default LOW state.
DQA–DQD Common I/O data bus 32-bit bidirectional data path (4 × 8-bit bytes); direction controlled by OE; automatically tri-stated during any write cycle regardless of OE state.
CE1, CE2, CE3 Synchronous chip enables Three-level decode for bank selection; CE1 active-low, CE2 active-high, CE3 active-low-supports hierarchical memory mapping with minimal glue logic.

Key Features

Feature Design Value
Registered pipelined I/O Input and output registers synchronized to CLK eliminate asynchronous timing hazards and simplify PCB layout for >100 MHz operation.
User-selectable burst order MODE pin configures interleaved (Pentium®) or linear burst sequence at power-up-no firmware configuration required.
Synchronous self-timed write On-chip write timing logic eliminates external write pulse generation; supports single-cycle (ADSC) or two-cycle (ADSP) write initiation.
JEDEC JESD8-5 I/O compatibility Ensures interoperability with 2.5V and 3.3V LVTTL/LVCMOS buses without level shifters-reduces BOM count and signal integrity risk.
ZZ sleep mode with data retention Reduces standby current to 40 mA while preserving all 2 Mbit contents; recovery requires only 2 clock cycles-ideal for burst-idle power management.

Applications

Processor Cache Interface Network Packet Buffer

Use Scenario: Secondary cache between ARM9 or MIPS-based SoC and external memory controller in real-time industrial controllers.

IC Role / Device Role / Timing Role: Pipelined synchronous SRAM providing deterministic 3.5 ns tCO reads and burst-aligned writes to match CPU bus timing.

Use Value: Eliminates wait states in cache refill cycles; 4-word burst mode reduces bus arbitration overhead by 75% vs. single-word transfers.

Use Scenario: Temporary packet buffering in Gigabit Ethernet switch fabric ASICs handling variable-length frames.

IC Role / Device Role / Timing Role: High-throughput common-I/O SRAM storing ingress/egress headers and payload fragments with byte-selectable writes.

Use Value: BWA–BWD enables partial writes of 1–4 byte fields (e.g., TTL, checksum) without overwriting adjacent packet data-reducing memory bandwidth pressure.

Industrial PLC Memory Expansion Test Equipment Pattern Memory

Use Scenario: Deterministic data logging buffer in programmable logic controllers requiring timestamped I/O snapshots every 100 µs.

IC Role / Device Role / Timing Role: Synchronous SRAM with ZZ sleep mode used to pause logging during maintenance windows while retaining last 64K samples.

Use Value: 40 mA sleep current extends battery-backed operation; 166 MHz clock supports 100 ns sample intervals across full 32-bit word width.

Use Scenario: Vector pattern storage in automated test equipment generating 166 MHz stimulus sequences for ASIC validation.

IC Role / Device Role / Timing Role: Low-jitter pipelined SRAM delivering preloaded test vectors with sub-ns timing precision to ATE pin electronics.

Use Value: Registered outputs ensure <3.5 ns clock-to-output skew across all 32 bits-critical for simultaneous multi-pin launch accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV204832BLL-166BLI 2-Mbit (64K × 32), 3.3V core, 166 MHz, but lacks ADSP/ADSC dual strobe and ZZ sleep mode. Requires external burst address generation logic; unsuitable for systems needing hardware-managed low-power retention. Select when cost sensitivity outweighs burst protocol flexibility and sleep-mode power savings.
AS7C3256A-166JCIN 2-Mbit (64K × 32), 3.3V, 166 MHz, supports linear burst only-no interleaved mode or MODE pin. Incompatible with Pentium®-based legacy systems requiring interleaved addressing; no ZZ pin for power gating. Choose only for new designs using linear-burst-only processors where pin count reduction is prioritized over protocol versatility.

Compared with IS61WV204832BLL-166BLI and AS7C3256A-166JCIN, the CY7C1329H-166AXCT uniquely integrates dual-address-strobe support, user-configurable burst order, and hardware sleep mode-enabling drop-in compatibility with Intel-compatible architectures and dynamic power management not available in alternatives.

Availability

CY7C1329H-166AXCT is available at Aetrix Electronics and suitable for processor cache interfaces, network packet buffers, and industrial PLC memory expansion requiring stable component supply, long-lifecycle availability, and JEDEC-compliant TQFP packaging.

Supply support for CY7C1329H-166AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, with headquarters in San Jose, CA and global R&D centers focused on timing-critical interfaces.

The CY7C1329H belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for secondary cache and burst-buffer applications in microprocessor-based systems requiring sub-4 ns access and deterministic pipeline behavior.

FAQ

What is the function of the MODE pin on CY7C1329H-166AXCT?

The MODE pin selects burst address sequencing: tied to GND for linear burst (00→01→10→11), or left floating/pulled to VDD for interleaved burst (00→01→10→11 → 01→00→11→10). It is a static strap pin sampled at power-up and must remain stable during operation to avoid burst corruption.

How does the ZZ sleep mode affect timing during wake-up?

When ZZ transitions from HIGH to LOW, the device requires exactly two clock cycles (2tCYC) before normal operation resumes. During this recovery window, CE1/CE2/CE3, ADSP, and ADSC must remain inactive; any access attempt before tZZREC completion is invalid and yields undefined data.

Can ADSP and ADSC be used simultaneously on CY7C1329H-166AXCT?

No-ADSP and ADSC are mutually exclusive address strobes. When both are asserted LOW, the device recognizes only ADSP. ADSC is ignored if ADSP is active, ensuring unambiguous address capture in mixed-processor/controller environments without arbitration logic.

What is the role of the ADV signal during non-burst operations?

ADV has no effect outside burst sequences. It is sampled only when ADSP or ADSC initiates a burst access; during single-word reads/writes, ADV is ignored. This prevents unintended address advancement and maintains deterministic single-cycle behavior for non-sequential accesses.

CY7C1329H-166AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
2Mbit
Memory Organization:
64K x 32
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1329H-166AXCT FAQ

1.How can I place an order for CY7C1329H-166AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1329H-166AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1329H-166AXCT reliable?

The price and inventory of CY7C1329H-166AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1329H-166AXCT is usually 5 days.

3.What payment methods are accepted for CY7C1329H-166AXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1329H-166AXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1329H-166AXCT?

CY7C1329H-166AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1329H-166AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1329H-166AXCT?

For technical support, including CY7C1329H-166AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1329H-166AXCT requirements.

6.How does Aetrix verify that CY7C1329H-166AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1329H-166AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1329H-166AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1329H-166AXCT?

All CY7C1329H-166AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1329H-166AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1329H-166AXCT part is unused and in its original packaging.

Return procedure for CY7C1329H-166AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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