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Infineon Technologies CY7C1338B-100AC
- Part No.:
- CY7C1338B-100AC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1338B-100AC.pdf
- Description:
- IC SRAM 4MBIT PAR 100TQFP
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
CY7C1338B-100AC from Cypress Semiconductor is a 3.3V, 128K × 32 synchronous flow-through cache SRAM with JEDEC-standard 100-pin TQFP packaging, 8.0 ns clock-to-output access time, synchronous self-timed write, and dual address strobe support (ADSP/ADSC) for direct interfacing with Pentium-class microprocessors in zero-wait-state cache subsystems.
For engineers reviewing the CY7C1338B-100AC datasheet, CY7C1338B-100AC pinout, CY7C1338B-100AC application, or CY7C1338B-100AC equivalent, key selection criteria include burst mode configuration (linear vs. interleaved), synchronous chip enable timing, byte-write granularity (BW0–BW3), ZZ sleep mode recovery (2tCYC), and 3.3V I/O compatibility with legacy high-speed CPU buses.
Technical Context
The CY7C1338B-100AC implements a synchronous, flow-through architecture with a 2-bit on-chip wraparound burst counter that captures A[1:0] at access initiation and auto-increments for linear or interleaved sequences based on the MODE pin state. All synchronous inputs-including ADSP, ADSC, ADV, CE1–CE3, BWE, GW, and BW[3:0]-are registered on the rising edge of CLK.
It supports both processor-initiated (ADSP) and controller-initiated (ADSC) burst accesses, with separate address strobes enabling glueless integration into split-cache architectures. Output enable (OE) is asynchronous, while ZZ sleep entry/exit requires two full clock cycles and guarantees data retention without external refresh.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 32 bits (4-Mbit total); common I/O architecture enables bidirectional data transfer on DQ[31:0]. |
| Access Time (tCDV) | 8.0 ns max at 100 MHz; defines maximum delay from CLK rise to valid output data under worst-case timing conditions. |
| Burst Mode Control | MODE pin selects interleaved (HIGH) or linear (LOW) 4-word burst sequence; defaults to interleaved if floating due to internal pull-up. |
| Write Architecture | Synchronous self-timed write: GW overrides BWE/BW[3:0]; byte writes require BWE + one active BWx signal per enabled byte lane. |
| Sleep Mode | Asynchronous ZZ input (active HIGH); enters low-power snooze mode in 2tCYC; ICCZZ ≤ 10 mA; data retained during sleep. |
| Supply & I/O | VDD = 3.3 V ± 0.3 V (core); VDDQ = 3.3 V ± 0.3 V (I/O); VSS/VSSQ = ground; supports 3.3V/2.5V-compatible I/O levels. |
| Operating Temperature | Commercial grade: 0 °C to +70 °C; industrial grade also available; validated for stable operation across full range. |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), 14 mm × 14 mm, 0.5 mm pitch, JEDEC-standard footprint compatible with automated PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Rising-edge-triggered master timing reference for all registered inputs and internal address/data latching. |
| ADSP / ADSC | Synchronous address strobes | ADSP initiates processor-originated bursts; ADSC enables controller-originated bursts; ADSP takes priority when both asserted. |
| ADV | Burst address advance control | Active LOW advances internal 2-bit counter during burst; determines sequential address progression within burst window. |
| CE1, CE2, CE3 | Synchronous chip enables | Three-level decode: CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW); required together for device selection. |
| BW[3:0], BWE, GW | Byte write controls | BWx selects byte lanes (DQ[7:0] to DQ[31:24]); BWE enables byte write; GW forces global write regardless of BWx/BWE state. |
| OE | Asynchronous output enable | Active LOW enables DQ[31:0] outputs; HIGH places pins in high-impedance state; overridden automatically during writes. |
| ZZ | Asynchronous sleep control | Active HIGH forces low-power snooze mode; data retained; requires 2tCYC recovery before next valid access. |
| MODE | Burst sequence selector | HIGH = interleaved (Pentium/i486 compatible); LOW = linear; internal pull-up defaults to interleaved if unconnected. |
Key Features
| Feature | Design Value |
|---|---|
| Zero-wait-state cache interface | Enables direct connection to 100 MHz Pentium-class CPUs without external wait-state generation logic. |
| Dual-address-strobe architecture | Separate ADSP and ADSC inputs allow independent coordination between CPU and cache controller in split-bus systems. |
| Configurable burst ordering | Hardware-selectable linear or interleaved 4-word burst via MODE pin-no firmware or register programming required. |
| Synchronous self-timed write | Eliminates need for external write pulse timing control; internal logic manages write duration based on clock frequency. |
| Low-power snooze mode | Reduces standby current to ≤10 mA while preserving memory contents; entered/exited asynchronously with deterministic 2-cycle latency. |
Applications
| Desktop CPU Cache Subsystem | Pentium-Based Embedded Controller |
|---|---|
|
Use Scenario: Secondary cache buffer between Pentium P54C processor and main memory in legacy desktop motherboards. IC Role / Device Role / Timing Role: Synchronous flow-through SRAM acting as L2 cache with interleaved burst mode aligned to Pentium's 4-word burst protocol. Use Value: Delivers 8.0 ns tCDV access time to sustain 100 MHz CPU bus bandwidth without wait states or glue logic. |
Use Scenario: High-speed instruction/data cache in industrial motion controllers using i486DX-based SoM modules. IC Role / Device Role / Timing Role: Common-I/O cache RAM providing burst-coherent read/write access synchronized to system clock and external cache controller. Use Value: Enables deterministic 4-word burst transfers with MODE-configurable interleaving, reducing average memory latency by >35% vs. non-burst DRAM. |
| Legacy Workstation Memory Expansion | Test Equipment Pattern Memory |
|
Use Scenario: Expandable cache module in SPARCstation 20 or AlphaServer DS10 workstations requiring JEDEC-compliant TQFP SRAM. IC Role / Device Role / Timing Role: Pin-compatible replacement for obsolete 128K×32 cache RAMs; supports both linear and interleaved burst modes via MODE pin. Use Value: Maintains system-level timing compliance with existing board layout and FPGA glue logic while extending product lifecycle. |
Use Scenario: Pattern storage buffer in automated test equipment (ATE) for high-speed digital I/O vector generation. IC Role / Device Role / Timing Role: Synchronous SRAM used as deep pattern memory with deterministic clock-to-output timing and burst-access efficiency. Use Value: Supports repeatable 100 MHz pattern streaming with ZZ sleep mode enabling power-gated idle periods between test sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous cache RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1338B-117AC | 7.5 ns tCDV (vs. 8.0 ns); higher ICC (350 mA vs. 325 mA); same pinout, timing model, and feature set. | Required for 117 MHz CPU interfaces; not suitable for 100 MHz designs where lower power is prioritized. | Select -117AC only when system clock exceeds 100 MHz and timing margin is constrained. |
| IS61LV12832AL-100TQLI | 100 MHz async SRAM; no burst counter, MODE, ADSP/ADSC, or ZZ sleep; 3.3V-only, 100-pin TQFP. | Lacks synchronous flow-through architecture; cannot replace CY7C1338B-100AC in burst-driven cache systems without redesign. | Only viable for non-burst, non-snooze applications where simplified control and lower cost outweigh timing performance loss. |
Compared with CY7C1338B-117AC, the -100AC trades 0.5 ns speed for 25 mA lower operating current; compared with IS61LV12832AL-100TQLI, it provides burst sequencing, dual strobes, and sleep mode-critical for CPU cache integration but incompatible with pure async memory controllers.
Availability
CY7C1338B-100AC is available at Aetrix Electronics and suitable for desktop CPU cache subsystems, Pentium-based embedded controllers, legacy workstation memory expansion, and test equipment pattern memory requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1338B-100AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for computing and industrial applications.
The CY7C1338B belongs to Cypress's synchronous cache SRAM product line, designed specifically to serve as zero-wait-state secondary cache buffers for Intel Pentium and i486-class microprocessors in high-reliability embedded and legacy computing platforms.
FAQ
What burst modes does CY7C1338B-100AC support, and how is selection implemented?
The CY7C1338B-100AC supports both interleaved and linear 4-word burst sequences. Selection is controlled solely by the MODE pin: HIGH configures interleaved mode (compatible with Pentium and i486 processors), LOW selects linear mode. The pin has an internal pull-up, so leaving it unconnected defaults to interleaved operation without external biasing.
How does the ZZ sleep mode interact with ongoing memory operations?
Asserting ZZ HIGH places the device into snooze mode after two clock cycles, halting all internal activity while retaining data. Any access pending at entry is invalidated and not guaranteed to complete. Before entering sleep, the device must be deselected (CE1/CE2/CE3 inactive), and CE1, CE2, CE3, ADSP, and ADSC must remain inactive for tZZREC (2tCYC) after ZZ returns LOW to ensure reliable wake-up.
Can CY7C1338B-100AC perform byte writes and global writes simultaneously?
No. Global write (GW active LOW) overrides all byte write controls (BWE and BW[3:0]) and forces data onto all four 8-bit lanes (DQ[31:0]). Byte writes require BWE LOW plus exactly one active BWx signal (BW0–BW3) to target a specific byte lane; simultaneous activation of multiple BWx signals with BWE LOW results in undefined behavior per datasheet timing constraints.
Is the CY7C1338B-100AC pin-compatible with other speeds in the same family?
Yes. All speed grades of the CY7C1338B (e.g., -117AC, -100AC, -85AC) share identical 100-pin TQFP packaging, pin assignments, electrical interface, and functional logic. Timing parameters differ (e.g., tCDV, ICC), but PCB layout, firmware, and system-level integration remain unchanged across speed variants.
CY7C1338B-100AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4Mbit
- Memory Organization:
- 128K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.15V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1338B-100AC FAQ
1.How can I place an order for CY7C1338B-100AC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1338B-100AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1338B-100AC reliable?
The price and inventory of CY7C1338B-100AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1338B-100AC is usually 5 days.
3.What payment methods are accepted for CY7C1338B-100AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1338B-100AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1338B-100AC?
CY7C1338B-100AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1338B-100AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1338B-100AC?
For technical support, including CY7C1338B-100AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1338B-100AC requirements.
6.How does Aetrix verify that CY7C1338B-100AC is sourced from the original manufacturer or authorized distributors?
All CY7C1338B-100AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1338B-100AC meets industry standards.
7.What is the process for return or replacement of CY7C1338B-100AC?
All CY7C1338B-100AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1338B-100AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1338B-100AC part is unused and in its original packaging.
Return procedure for CY7C1338B-100AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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