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Infineon Technologies CY7C1338G-100AXCT

Part No.:
CY7C1338G-100AXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1338G-100AXCT.pdf
Description:
IC SRAM 4MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,753

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Product details

Overview

CY7C1338G-100AXCT from Cypress Semiconductor is a 4-Mbit (128K × 32) flow-through synchronous SRAM with 100-MHz clock support, 8.0 ns clock-to-output delay, 3.3 V core supply (VDD), and dual-voltage I/O (2.5 V/3.3 V VDDQ), designed for secondary cache interfacing in high-speed microprocessor systems including Pentium-class architectures.

For engineers reviewing the CY7C1338G-100AXCT datasheet, CY7C1338G-100AXCT pinout, CY7C1338G-100AXCT application, or CY7C1338G-100AXCT equivalent, key selection criteria include burst mode configuration (linear vs. interleaved), synchronous self-timed write capability, separate ADSP/ADSC address strobes, ZZ sleep mode behavior, and TQFP-100 package compatibility with JEDEC JESD8-5 I/O standards.

Technical Context

The device implements a 2-bit on-chip wraparound burst counter fed by A[1:0], enabling automatic address increment during burst reads/writes. All synchronous inputs-including addresses, CE1/CE2/CE3, ADSP/ADSC, ADV, GW, BWE, and BW[A:D]-are registered on the rising edge of CLK.

Asynchronous controls include OE (tri-state output enable) and ZZ (sleep mode input, requiring external ground per errata). MODE is a static strap pin selecting linear (LOW) or interleaved (HIGH) burst sequences, directly supporting Intel Pentium™ and i486™ processor timing protocols.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 Mbit (128K × 32) - provides full-word cache line storage for 32-bit processors without external data bus widening.
Access Time (tC0) 8.0 ns - maximum clock-to-output delay at 100 MHz, enabling tight timing closure in high-frequency cache subsystems.
Core Supply Voltage 3.3 V (VDD) - matches standard logic rail for integration with 3.3 V microprocessor buses and controllers.
I/O Supply Voltage 2.5 V or 3.3 V (VDDQ) - supports mixed-voltage system interfacing while maintaining JEDEC JESD8-5 compatibility.
Burst Mode Control MODE pin-selectable linear or interleaved - enables direct alignment with Pentium™ (interleaved) or custom controller (linear) burst addressing.
Write Architecture Synchronous self-timed write - eliminates external write pulse timing constraints and simplifies controller design.
Power Management ZZ sleep mode with data retention - reduces standby current to 40 mA while preserving memory contents during idle cycles.

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), 14 mm × 20 mm × 1.4 mm body, lead-free (Pb-free) construction.

Pin/Terminal Circuit Role Design Meaning
CLK Clock input Positive-edge-triggered master clock synchronizing all register captures and burst counter advancement.
ADSP / ADSC Address strobe inputs Separate processor (ADSP) and controller (ADSC) strobes allow flexible cache coherency arbitration and hierarchical memory control.
ADV Address advance control Asserted on rising CLK edge to increment internal burst counter and sequence through burst addresses.
MODE Burst order selector Static strap pin determining linear (GND) or interleaved (VDD/floating) burst sequence; must remain stable during operation.
ZZ Asynchronous sleep input Active-HIGH sleep enable; per errata (p.20), must be externally tied to ground to avoid undefined behavior.
OE Asynchronous output enable Tri-states DQ pins when HIGH; masked during first read cycle after deselection to prevent bus contention.
VDDQ / VSSQ I/O power and ground Isolated 2.5 V/3.3 V I/O domain enabling voltage translation between core and peripheral logic domains.

Key Features

Feature Design Value
Flow-through synchronous architecture Eliminates pipeline latency between address capture and data output, delivering deterministic 8.0 ns tC0 at 100 MHz.
User-selectable burst sequencing Hardware-mode (MODE pin) selection between Pentium™-compatible interleaved and linear burst patterns without firmware overhead.
Four independent byte-write controls BWA–BWD + BWE enable granular 8-bit writes to DQA–DQD lanes, reducing bus traffic and power in partial-word updates.
Three-level chip enable (CE1/CE2/CE3) Supports depth expansion across multiple SRAMs with hierarchical bank decoding and reduced address decode logic.
Synchronous self-timed write On-chip write timing generation removes need for external write pulse generators or precise controller write strobe alignment.

Applications

Intel Pentium™ Cache Subsystem Industrial Real-Time Controller Cache

Use Scenario: Secondary cache buffer between Pentium™ processor and main memory in embedded industrial PCs.

IC Role / Device Role / Timing Role: Flow-through sync SRAM providing 100-MHz burst reads with interleaved addressing and sub-8 ns tC0.

Use Value: Matches Pentium™ burst protocol natively, eliminating glue logic and reducing cache access latency by 3.2 ns versus async SRAM alternatives.

Use Scenario: Deterministic instruction/data cache for real-time motion controllers requiring guaranteed worst-case memory access timing.

IC Role / Device Role / Timing Role: Synchronous SRAM with fixed 8.0 ns clock-to-output and self-timed write ensuring bounded execution cycles.

Use Value: Enables hard real-time scheduling with known memory latency; eliminates variable async access jitter affecting servo loop stability.

Telecom Line Card Buffer Avionics Data Acquisition Module

Use Scenario: Packet buffering in high-throughput telecom line cards handling OC-48/STM-16 traffic.

IC Role / Device Role / Timing Role: 32-bit-wide common I/O SRAM supporting burst transfers aligned to network frame boundaries.

Use Value: Dual-voltage I/O (2.5 V/3.3 V) allows seamless interface to both legacy 3.3 V PHYs and newer 2.5 V switch fabrics.

Use Scenario: Radiation-tolerant data capture buffer in flight control computers acquiring sensor telemetry at 10 kHz.

IC Role / Device Role / Timing Role: ZZ-mode low-power sleep with data retention preserves critical telemetry during periodic processor hibernation.

Use Value: Reduces standby current to 40 mA while retaining integrity of last captured sensor snapshot during power-constrained phases.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61LV12832AL-100TQLI 100-MHz async SRAM (not synchronous); no burst counter, no ADSP/ADSC, no ZZ mode; 3.3 V only. Lacks flow-through sync architecture and burst control - requires external sequencer logic for Pentium™ compatibility. Select only if system uses asynchronous controller and does not require burst or low-power sleep features.
MT48LC16M32B2-75:G SDRAM (not SRAM); 75 MHz clock; requires refresh, command decoding, and mode registers; 3.3 V only. Higher density but introduces non-deterministic latency due to refresh and precharge; incompatible with cache timing models. Choose only for cost-sensitive, non-real-time applications where deterministic access is not required.

Compared with IS61LV12832AL-100TQLI and MT48LC16M32B2-75:G, CY7C1338G-100AXCT delivers guaranteed 8.0 ns tC0, native burst support, and hardware-controlled sleep-critical for cache subsystems demanding zero-jitter, low-latency, and power-aware operation.

Availability

CY7C1338G-100AXCT is available at Aetrix Electronics and suitable for Intel Pentium™-based embedded computing, industrial real-time controllers, telecom line card buffers, and avionics data acquisition modules requiring stable component supply and long-lifecycle support.

Supply support for CY7C1338G-100AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, with expertise in timing-critical SRAM, PSoC® platforms, and automotive-grade ICs.

CY7C1338G belongs to Cypress's legacy synchronous SRAM product line, engineered specifically for secondary cache applications in high-speed microprocessor systems requiring deterministic timing, burst efficiency, and low-power sleep modes.

FAQ

What is the correct connection for the ZZ pin on CY7C1338G-100AXCT?

The ZZ pin (Pin 64) must be externally connected to ground per documented errata (page 20 of Rev. *P datasheet). Although described as active-HIGH sleep input, leaving it floating or pulling it HIGH causes undefined behavior. Internal pull-down ensures safe default, but grounding is mandatory for reliable operation.

Can CY7C1338G-100AXCT operate with 2.5 V I/O while using 3.3 V core supply?

Yes. The device supports independent VDD (3.3 V) and VDDQ (2.5 V or 3.3 V) supplies. VDDQ powers only the I/O circuitry and DQ pins, allowing direct interface to 2.5 V logic families while maintaining full 3.3 V core functionality and timing performance.

How does the MODE pin affect burst addressing behavior?

MODE is a static strap pin sampled at power-up or reset. When LOW (tied to GND), it configures linear burst order (0,1,2,3); when HIGH (tied to VDD or left floating), it selects interleaved order (0,2,1,3) matching Intel Pentium™ processors. It must remain stable during operation to avoid burst corruption.

What is the role of ADSP versus ADSC in cache control?

ADSP (processor address strobe) initiates accesses driven by the CPU; ADSC (controller address strobe) enables cache coherency logic or DMA controllers to initiate bursts independently. When both are asserted, ADSP takes priority. CE1 must be active for either to function, and ADSP is ignored if CE1 is deasserted.

CY7C1338G-100AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4Mbit
Memory Organization:
128K x 32
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1338G-100AXCT FAQ

1.How can I place an order for CY7C1338G-100AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1338G-100AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1338G-100AXCT reliable?

The price and inventory of CY7C1338G-100AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1338G-100AXCT is usually 5 days.

3.What payment methods are accepted for CY7C1338G-100AXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1338G-100AXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1338G-100AXCT?

CY7C1338G-100AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1338G-100AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1338G-100AXCT?

For technical support, including CY7C1338G-100AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1338G-100AXCT requirements.

6.How does Aetrix verify that CY7C1338G-100AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1338G-100AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1338G-100AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1338G-100AXCT?

All CY7C1338G-100AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1338G-100AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1338G-100AXCT part is unused and in its original packaging.

Return procedure for CY7C1338G-100AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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