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Infineon Technologies CY7C1339G-133AXC

Part No.:
CY7C1339G-133AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1339G-133AXC.pdf
Description:
IC SRAM 4MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,702

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Product details

Overview

CY7C1339G-133AXC from Cypress Semiconductor is a 4-Mbit (128 K × 32) pipelined synchronous SRAM with registered I/O, 3.3 V core supply, 2.5/3.3 V I/O supply, 4.0 ns clock-to-output delay, and support for Intel Pentium™-compatible interleaved or linear burst sequences - used in high-speed secondary cache subsystems for embedded processors and networking controllers.

For engineers reviewing the CY7C1339G-133AXC datasheet, CY7C1339G-133AXC pinout, CY7C1339G-133AXC application, or CY7C1339G-133AXC equivalent, key selection criteria include burst mode configuration (MODE pin), byte-write granularity (BWA–BWD + BWE), synchronous self-timed write timing, and dual-strobe address capture (ADSP/ADSC).

Technical Context

The device implements a two-bit on-chip wraparound burst counter synchronized to CLK, enabling automatic address increment during burst reads/writes. All synchronous inputs - including A[1:0], CE1–CE3, ADSP, ADSC, ADV, GW, BWE, and BW[A:D] - are registered on the rising edge of CLK, while OE and ZZ operate asynchronously.

It supports common I/O architecture with bidirectional DQ[0:31] lines, JEDEC JESD8-5-compatible voltage levels, and separate VDD (3.3 V) and VDDQ (2.5 V or 3.3 V) supplies. Write operations are self-timed and qualified by BWE and byte-select signals, with GW overriding all byte controls for full-word writes.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4 Mbit (128 K × 32 bits) - provides 512 KB of fast, low-latency cache storage per device.
Access Time (tCO)4.0 ns at 133 MHz - defines maximum clock-to-output delay for read data registration.
Core Supply Voltage3.3 V ± 0.3 V - powers internal logic and memory array; requires stable low-noise regulation.
I/O Supply Voltage2.5 V or 3.3 V - selectable to match host processor I/O voltage domain without level shifters.
Burst Mode ControlMODE pin (GND = linear, VDD/floating = interleaved) - configures address sequence for compatibility with Pentium/i486 or linear-burst CPUs.
Write Enable LogicGW (global) + BWE + BW[A:D] - enables full-word or selective byte writes (1–4 bytes) with no external timing control.
Asynchronous ControlsOE (output enable) and ZZ (sleep) - allow immediate output tri-state and low-power retention without clock dependency.

Pinout & Package

Available in lead-free 100-pin TQFP (14 × 20 × 1.4 mm) package. Pin functions validated per Cypress Document Number 38-05520 Rev. *J.

Pin/TerminalCircuit RoleDesign Meaning
CLKSynchronous clock inputRising-edge-triggered master clock for all registered inputs/outputs and burst counter increment.
ADSP / ADSCAddress strobe inputsSeparate processor (ADSP) and controller (ADSC) strobes enable dual-bus system integration without arbitration logic.
ADVBurst advance controlActive-low signal that triggers on-chip address increment during burst cycles; eliminates external address generation.
BWA–BWD, BWEByte write controlsFour independent byte masks + enable - allows partial-word writes without read-modify-write overhead.
GWGlobal write enableOverrides all byte selects to write all 32 bits simultaneously - simplifies full-word store operations.
OEAsynchronous output enableTri-states DQ bus immediately on deassertion; decouples output control from clock domain.
ZZAsynchronous sleep inputPlaces device in low-ICC retention mode (≤40 mA standby) while preserving data; no clock required.
DQ[0:31]Common I/O data bus32-bit bidirectional interface shared for reads and writes; direction controlled solely by OE state.

Key Features

FeatureDesign Value
Pipelined synchronous interfaceRegistered address/data/control inputs reduce setup/hold timing constraints on host bus, enabling higher clock rates.
Configurable burst addressingMODE pin selects Intel Pentium™-interleaved or linear sequence - ensures drop-in compatibility across CPU generations.
Synchronous self-timed writesOn-chip write sequencing eliminates external write pulse generation and timing margining.
Independent ADSP/ADSC strobesEnables concurrent access arbitration between CPU and DMA controller without external glue logic.
Low-voltage I/O flexibilityVDDQ supports 2.5 V or 3.3 V operation - matches legacy or modern processor I/O rails without level translation.

Applications

Processor Cache InterfaceNetwork Packet Buffer

Use Scenario: Secondary cache for MIPS-based network processors requiring deterministic burst latency and low power.

IC Role / Device Role / Timing Role: Pipelined SRAM acting as L2 cache with 4.0 ns tCO and interleaved burst mode aligned to CPU fetch pattern.

Use Value: Eliminates wait states during instruction/data prefetch; reduces average memory access time by 35% vs. asynchronous SRAM.

Use Scenario: Temporary packet buffering in Gigabit Ethernet switch fabric ASICs with dual-bus DMA engines.

IC Role / Device Role / Timing Role: Shared-memory buffer accessed concurrently via ADSP (CPU) and ADSC (DMA), with byte-write isolation per packet header/tail.

Use Value: Enables zero-copy packet forwarding by allowing independent read/write access to overlapping memory regions without bus contention.

Industrial Motion Controller MemoryMedical Imaging Frame Store

Use Scenario: Real-time trajectory buffer in servo drive controllers where deterministic access timing prevents jitter in position updates.

IC Role / Device Role / Timing Role: Synchronous SRAM providing jitter-free 133 MHz burst reads for motion profile interpolation engine.

Use Value: Guarantees ≤4.0 ns output delay variation across temperature, ensuring sub-microsecond timing repeatability in closed-loop control loops.

Use Scenario: Dual-port frame buffer in ultrasound imaging systems requiring simultaneous acquisition (write) and display (read) paths.

IC Role / Device Role / Timing Role: Common-I/O SRAM used with external multiplexing logic to emulate dual-port behavior via ADSP/ADSC separation.

Use Value: Supports concurrent 30 fps image capture and real-time DICOM rendering without frame loss or pipeline stalls.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV12832ALL-133BLI3.3 V only I/O (no VDDQ flexibility); 4.5 ns tCO; no MODE-selectable burst order.Lacks Pentium-compatible interleaved burst; requires fixed linear addressing in host firmware.Select when VDDQ voltage matching is unnecessary and burst sequence is fixed in system design.
AS7C3128A-133JCINAsynchronous interface; no pipelining; 12 ns access time; no ADSP/ADSC dual-strobe support.Requires external wait-state insertion and address generation logic for burst transfers.Select only for cost-sensitive, non-real-time applications where timing determinism is not required.

Compared with IS61WV12832ALL-133BLI and AS7C3128A-133JCIN, the CY7C1339G-133AXC uniquely delivers configurable burst modes, dual-address-strobe arbitration, and VDDQ voltage flexibility - making it the only option supporting mixed-voltage, low-jitter, multi-master cache interfaces without external timing glue.

Availability

CY7C1339G-133AXC is available at Aetrix Electronics and suitable for high-speed processor cache, network packet buffering, industrial motion control, and medical imaging frame storage requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1339G-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, with focus on reliability, low power, and interface flexibility.

The CY7C1339G belongs to Cypress's pipelined synchronous SRAM product line, engineered specifically for deterministic, low-latency cache and buffer applications in CPU-, DSP-, and ASIC-based systems operating above 100 MHz.

FAQ

What is the function of the MODE pin on CY7C1339G-133AXC?

The MODE pin selects burst address sequence: tied to GND for linear burst (sequential addresses), or to VDD/floating for Intel Pentium™-compatible interleaved burst (A0–A1 bit-swapped order). It is a static strap pin - must remain unchanged during operation and has an internal pull-up resistor.

Can CY7C1339G-133AXC operate with 2.5 V I/O while using 3.3 V core supply?

Yes. VDD is fixed at 3.3 V for core logic and memory array, while VDDQ accepts either 2.5 V or 3.3 V to match the host processor's I/O voltage. This eliminates need for external level shifters and supports mixed-voltage system designs.

How does the ADSP/ADSC dual-strobe architecture improve system design?

ADSP and ADSC provide independent, synchronous address capture paths - allowing CPU and DMA controller to access the same SRAM without bus arbitration logic. When both are active, ADSP takes priority, enabling clean priority-based resource sharing in real-time systems.

Is the ZZ pin required to be actively driven for sleep mode entry?

No. The ZZ pin has an internal pull-down; leaving it unconnected results in LOW (normal operation). To enter sleep mode, drive ZZ HIGH. In sleep, core current drops to ≤40 mA while data is retained - no clock or refresh needed.

CY7C1339G-133AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4Mbit
Memory Organization:
128K x 32
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1339G-133AXC FAQ

1.How can I place an order for CY7C1339G-133AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1339G-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1339G-133AXC reliable?

The price and inventory of CY7C1339G-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1339G-133AXC is usually 5 days.

3.What payment methods are accepted for CY7C1339G-133AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1339G-133AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1339G-133AXC?

CY7C1339G-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1339G-133AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1339G-133AXC?

For technical support, including CY7C1339G-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1339G-133AXC requirements.

6.How does Aetrix verify that CY7C1339G-133AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1339G-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1339G-133AXC meets industry standards.

7.What is the process for return or replacement of CY7C1339G-133AXC?

All CY7C1339G-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1339G-133AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1339G-133AXC part is unused and in its original packaging.

Return procedure for CY7C1339G-133AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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