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Infineon Technologies CY7C1339G-133AXCT

Part No.:
CY7C1339G-133AXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1339G-133AXCT.pdf
Description:
IC SRAM 4MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,456

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Product details

Overview

CY7C1339G-133AXCT from Cypress Semiconductor is a 4-Mbit (128 K × 32) pipelined synchronous SRAM with registered I/O, 3.3 V core supply, 2.5/3.3 V I/O supply, and 4.0 ns clock-to-output delay at 133 MHz. It supports Intel Pentium™-compatible interleaved or linear burst sequences via MODE pin selection and enables high-speed secondary cache in embedded processor systems.

For engineers reviewing the CY7C1339G-133AXCT datasheet, CY7C1339G-133AXCT pinout, CY7C1339G-133AXCT application, or CY7C1339G-133AXCT equivalent, key selection criteria include burst mode configuration (MODE), byte-write granularity (BWA–BWD + BWE), synchronous self-timed write control (GW/BWE), and dual-strobe address capture (ADSP/ADSC).

Technical Context

The device implements a two-bit on-chip wraparound burst counter synchronized to CLK's rising edge, with address latching controlled by ADSP (processor strobe) or ADSC (controller strobe). Burst sequence direction-interleaved (MODE = VDD/floating) or linear (MODE = GND)-is statically configured and retained during operation.

All synchronous inputs (addresses, CE1/CE2/CE3, ADV, BW[A:D], BWE, GW) are registered on CLK rise; asynchronous OE and ZZ control output enable and sleep mode independently of clock timing. Output data is registered and delivered within tCO = 4.0 ns (133 MHz grade), with tri-state behavior enforced during deselected cycles and automatic DQ tri-state during writes regardless of OE state.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4 Mbit (128 K × 32 bits), enabling 512 KB of 32-bit-wide cache storage per device.
Access Speed4.0 ns clock-to-output (tCO) at 133 MHz, meeting timing for legacy x86 and RISC processor secondary cache interfaces.
Power Supplies3.3 V core (VDD), 2.5 V or 3.3 V I/O (VDDQ), allowing interoperability with both 2.5 V and 3.3 V logic families.
Burst ControlUser-selectable interleaved or linear burst via static MODE pin, directly supporting Pentium™ and i486™ bus protocols.
Write ArchitectureSynchronous self-timed writes with global (GW) and byte-select (BWA–BWD + BWE) control, eliminating external write timing logic.
Strobe InputsDual address strobes (ADSP for processor, ADSC for controller) with priority arbitration (ADSP overrides ADSC).
Sleep ModeAsynchronous ZZ input (active HIGH) reduces standby current to 40 mA while preserving data integrity.

Pinout & Package

Available in lead-free 100-pin TQFP (14 × 20 × 1.4 mm) package. Pin functions validated per Cypress Document Number 38-05520 Rev. *J.

Pin/TerminalCircuit RoleDesign Meaning
A0, A1, A[2:16]Address Input17-bit synchronous address bus; A1:A0 loaded into internal 2-bit burst counter at ADSP/ADSC assertion.
DQA–DQDBi-directional Data I/O32-bit common I/O bus (8 bits per byte lane); direction controlled by OE; tri-stated automatically during writes.
ADSP / ADSCAddress StrobeProcessor (ADSP) or controller (ADSC) address capture signal; ADSP has priority; both sampled synchronously on CLK rise.
ADVBurst AdvanceActive-LOW synchronous signal that increments internal burst counter; controls sequential address generation during burst reads/writes.
BWA–BWD, BWE, GWWrite ControlByte-write select (BWA–BWD), enable (BWE), and global override (GW); all synchronous, enabling flexible 1–4 byte writes without external timing logic.
OEOutput EnableAsynchronous active-LOW control of DQ output drivers; masked during first cycle after deselection to prevent bus contention.
ZZSleep ControlAsynchronous active-HIGH sleep input; places device in low-power retention mode (40 mA) with no clock dependency.
MODEBurst ConfigurationStatic strap pin (internal pull-up); GND = linear burst, VDD/floating = interleaved burst; must remain stable during operation.

Key Features

FeatureDesign Value
Registered Pipelined I/OInput and output registers synchronized to CLK ensure deterministic timing margins and eliminate setup/hold violations in high-speed bus interfaces.
Synchronous Self-timed WritesOn-chip write timing logic eliminates need for external write pulse generators or wait-state controllers in processor cache subsystems.
Dual Address Strobe SupportIndependent ADSP (processor) and ADSC (controller) inputs enable seamless integration into multi-master bus architectures with priority-based arbitration.
Configurable Burst OrderHardware-mode (MODE pin) selection between Intel Pentium™-compatible interleaved and linear burst sequences ensures drop-in compatibility across legacy CPU platforms.
Flexible I/O VoltageVDDQ supports 2.5 V or 3.3 V operation, permitting direct interface to mixed-voltage SoCs and FPGAs without level-shifting circuitry.

Applications

PC Motherboard CacheIndustrial PLC Memory Buffer

Use Scenario: Secondary cache memory for Intel Pentium™-class embedded processors in legacy PC motherboards requiring burst-compatible SRAM.

IC Role / Device Role / Timing Role: Pipelined synchronous SRAM providing 32-bit-wide burst reads/writes with 4.0 ns tCO to match CPU bus timing.

Use Value: Enables full 133 MHz bus utilization with zero-wait-state operation using interleaved burst mode and ADSP-driven address capture.

Use Scenario: High-reliability data buffering in programmable logic controller (PLC) backplanes where deterministic access latency and data retention under intermittent power are critical.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as real-time I/O register bank with ZZ sleep mode for power-gated operation during idle cycles.

Use Value: Maintains data integrity during brownouts via ZZ sleep (40 mA standby) and supports robust burst transfers using ADSC-controlled controller-initiated writes.

Network Router Packet BufferMilitary Avionics Data Logger

Use Scenario: Temporary packet storage in legacy enterprise routers with MIPS or PowerPC-based control planes requiring fast, burst-capable memory for header processing pipelines.

IC Role / Device Role / Timing Role: Common-I/O SRAM serving as pipeline stage buffer with byte-write capability (BWA–BWD + BWE) for partial packet updates.

Use Value: Reduces bus traffic by enabling selective 1–4 byte writes without full-word overwrites, improving throughput in header-modification routines.

Use Scenario: Non-volatile data logging buffer in airborne mission computers where extended temperature operation and radiation-tolerant timing stability are required.

IC Role / Device Role / Timing Role: Synchronous SRAM operating in linear burst mode (MODE = GND) for sequential sensor data capture with guaranteed 4.0 ns tCO across –40°C to +85°C.

Use Value: Delivers deterministic read latency independent of temperature drift, satisfying DO-254 timing compliance for Level A avionics software.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61LV25616AL-10TLIAsynchronous 256K × 16 SRAM; no burst counter, no ADSP/ADSC, 10 ns access, single 3.3 V supply.Lacks pipelined operation and burst support; suitable only for non-burst, low-speed control-plane memory.Select only if system lacks clock-synchronous bus architecture and requires simpler timing model.
CY7C1353G-133AXCSame family, 2-Mbit (64 K × 32); identical pinout, timing, and feature set except reduced density.Direct footprint-compatible downgrade for space-constrained designs needing <4 Mbit cache capacity.Choose when board layout rework is prohibited and 2 Mbit suffices for target cache line depth.

Compared with IS61LV25616AL-10TLI, CY7C1339G-133AXCT delivers pipelined burst performance essential for CPU cache; versus CY7C1353G-133AXC, it doubles memory depth while maintaining identical timing, power, and interface compatibility-making it optimal for bandwidth-critical upgrades.

Availability

CY7C1339G-133AXCT is available at Aetrix Electronics and suitable for PC motherboard cache, industrial PLC memory buffers, network router packet buffers, and military avionics data loggers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1339G-133AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and programmable solutions for embedded systems.

The CY7C1339G belongs to Cypress's high-speed synchronous SRAM product line, designed specifically for secondary cache and high-bandwidth buffer applications in x86, PowerPC, and MIPS-based computing platforms.

FAQ

What is the function of the MODE pin, and how must it be connected?

The MODE pin selects burst sequence type: tied to GND for linear burst, or to VDD/floating for interleaved burst. It is a static strap pin with internal pull-up; must remain stable during operation and cannot be toggled dynamically. Incorrect MODE configuration causes misaligned burst addresses and data corruption in cache line fills.

How does the CY7C1339G-133AXCT handle simultaneous ADSP and ADSC assertion?

When both ADSP and ADSC are asserted LOW, the device recognizes only ADSP and ignores ADSC. This priority scheme ensures processor-initiated accesses take precedence in multi-master systems. CE1 must also be active for ADSP to be accepted; if CE1 is HIGH, ADSP is masked regardless of ADSC state.

Can the ZZ sleep mode be entered during active burst operations?

Yes-ZZ is asynchronous and can be asserted HIGH at any time, including mid-burst. The device immediately enters sleep mode, halting all internal clocks and reducing current to 40 mA while preserving memory contents. No special handshake or timing sequence is required; data integrity remains guaranteed throughout sleep entry and exit.

What is the role of the ADV signal during a single (non-burst) access?

ADV is ignored during single-access cycles. It only affects burst operations: when ADV is asserted LOW on CLK rise, it increments the internal 2-bit burst counter to generate the next sequential or interleaved address. In single reads/writes, address advancement is disabled, and ADV has no functional impact on timing or data flow.

CY7C1339G-133AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4Mbit
Memory Organization:
128K x 32
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1339G-133AXCT FAQ

1.How can I place an order for CY7C1339G-133AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1339G-133AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1339G-133AXCT reliable?

The price and inventory of CY7C1339G-133AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1339G-133AXCT is usually 5 days.

3.What payment methods are accepted for CY7C1339G-133AXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1339G-133AXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1339G-133AXCT?

CY7C1339G-133AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1339G-133AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1339G-133AXCT?

For technical support, including CY7C1339G-133AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1339G-133AXCT requirements.

6.How does Aetrix verify that CY7C1339G-133AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1339G-133AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1339G-133AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1339G-133AXCT?

All CY7C1339G-133AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1339G-133AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1339G-133AXCT part is unused and in its original packaging.

Return procedure for CY7C1339G-133AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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