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Infineon Technologies CY7C1339G-133AXE

Part No.:
CY7C1339G-133AXE
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1339G-133AXE.pdf
Description:
IC SRAM 4MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,551

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Product details

Overview

CY7C1339G-133AXE from Cypress Semiconductor is a 4-Mbit (128K × 32) pipelined synchronous SRAM with registered I/O, 133-MHz operation, 4.0 ns clock-to-output delay, 3.3V core / 2.5V–3.3V I/O supply support, and user-selectable Intel Pentium®-compatible interleaved or linear burst sequences - deployed in high-speed L2 cache subsystems for embedded x86-compatible controllers.

For engineers reviewing the CY7C1339G-133AXE datasheet, CY7C1339G-133AXE pinout, CY7C1339G-133AXE application, or CY7C1339G-133AXE equivalent, key selection criteria include burst mode configuration (MODE pin), synchronous self-timed write timing, byte-write granularity (BWA–BWD + BWE), ZZ sleep entry/exit latency, and TQFP-100 package compatibility with JEDEC JESD8-5 I/O voltage levels.

Technical Context

The CY7C1339G-133AXE implements a two-bit wraparound burst counter fed by A1/A0, synchronized to CLK rising edges, enabling deterministic address progression during burst reads/writes. All synchronous inputs - including ADSP, ADSC, CE1–CE3, BW[A:D], BWE, GW, and ADV - are registered on the CLK edge, while OE and ZZ operate asynchronously.

Burst sequencing is statically selected via the MODE pin (interleaved when floating/VDD, linear when grounded), and advance control is handled exclusively by the synchronous ADV signal. Write operations are self-timed and support both global (GW-active) and byte-selective (BWE + BW[A:D]) modes, with automatic DQ tristating during writes regardless of OE state.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 Mbit (128K × 32 bits) - supports 32-bit data bus width without external multiplexing in cache or buffer applications.
Max Clock Frequency 133 MHz - defines maximum sustained burst throughput; access time tCO = 4.0 ns at this rate.
Core Supply Voltage 3.3 V ± 0.3 V - powers internal logic and memory array; requires stable low-noise regulation.
I/O Supply Range 2.5 V or 3.3 V - enables direct interface to mixed-voltage SoCs or FPGAs without level shifters.
Burst Mode Control Static MODE pin - selects Pentium®-compatible interleaved or linear sequence; must remain static during operation.
Sleep Entry Latency 2 clock cycles (tZZS) - device enters low-power ZZ mode after two CLK edges; data retention guaranteed.
Byte Write Capability Four independent byte lanes (DQA–DQD) controlled by BWA–BWD + BWE - enables partial-word updates without read-modify-write overhead.

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), lead-free, RoHS-compliant, body size 14 mm × 14 mm, 0.5 mm pitch.

Pin Circuit Role Design Meaning
CLK Synchronous clock input Rising-edge-triggered master timing reference for all registered inputs/outputs and burst counter increment.
ADSP / ADSC Address strobe inputs ADSP prioritized over ADSC; both qualify address latching and initiate access - used for processor vs. controller arbitration.
CE1, CE2, CE3 Chip enable inputs Three-level synchronous chip select: CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW); enable bank decoding.
BWA–BWD, BWE Byte write controls Active-LOW per-byte enables qualified by BWE; allow selective 8-bit updates within 32-bit word without disturbing other bytes.
GW Global write enable Active-LOW override that forces full 32-bit write regardless of BW[A:D] states - simplifies full-word store operations.
OE Asynchronous output enable Active-LOW; tri-states DQs immediately when deasserted, but masked during first cycle after deselection.
ZZ Asynchronous sleep control Active-HIGH; places device in low-power snooze mode (IDDZZ = 40 mA) with guaranteed data retention.
DQA–DQD Common I/O data bus 32-bit bidirectional bus (4 × 8-bit bytes); direction controlled by OE; automatically tristated during writes.
MODE Burst sequence selector Strap pin: GND = linear burst, floating/VDD = interleaved (Pentium®); internal pull-up; must be static.
VDD / VSS Core power / ground 3.3 V core supply; separate VDDQ/VSSQ required for I/O domain - enables mixed-voltage interfacing.

Key Features

Feature Design Value
Registered pipelined I/O Eliminates external latch requirements and ensures deterministic setup/hold timing across temperature/voltage.
Synchronous self-timed writes Removes external write pulse timing constraints - internal logic completes write within fixed clock cycles.
User-selectable burst order Hardware-mode burst sequencing (interleaved/linear) matches legacy x86 or custom processor bus protocols.
Independent byte-write control Enables atomic 8-bit updates in multi-processor or DMA-coherent systems without full-word read-modify-write.
Asynchronous ZZ sleep mode Reduces standby current to 40 mA with zero software overhead and guaranteed data retention during idle periods.

Applications

Embedded x86 Cache Subsystem Industrial Motion Controller Buffer

Use Scenario: Secondary cache for Intel-compatible microcontrollers in CNC or PLC systems requiring deterministic burst response.

IC Role / Device Role / Timing Role: Pipelined SRAM acting as L2 cache with synchronous burst reads aligned to processor clock domain.

Use Value: 4.0 ns tCO and 133-MHz clock support enable sub-cycle data delivery to match 133-MHz front-side bus timing.

Use Scenario: Real-time motion profile buffering in servo drives where position/velocity data must be updated per servo cycle.

IC Role / Device Role / Timing Role: High-bandwidth data buffer with byte-write capability for incremental parameter updates without full-frame overwrite.

Use Value: Independent BWA–BWD control allows single-byte updates to motion parameters while preserving adjacent trajectory data.

Telecom Line Card Packet Buffer Avionics Data Acquisition FIFO

Use Scenario: Temporary packet storage in Ethernet or TDM line cards handling variable-length frames at line rate.

IC Role / Device Role / Timing Role: Synchronous SRAM used as depth-expansible FIFO with CE2/CE3 for bank switching across multiple devices.

Use Value: Three-level chip enable (CE1/CE2/CE3) supports seamless expansion beyond 128K depth using daisy-chained address strobes.

Use Scenario: Buffered sensor data capture in DO-254-compliant flight control units with strict power budget limits.

IC Role / Device Role / Timing Role: Low-latency, deterministic memory for time-stamped ADC samples with guaranteed data integrity during power transitions.

Use Value: ZZ sleep mode reduces quiescent current to 40 mA while preserving sampled data - critical for battery-backed avionics.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61LV25616AL-10TLI 256K × 16, 10 ns async access, no burst counter or pipelined I/O - purely asynchronous interface. Lacks burst mode, clocked registers, and byte-write granularity; suited only for non-pipelined control-plane buffers. Select only if system lacks clock-synchronous bus architecture and tolerates higher access latency.
AS7C3256B-133JCIN 256K × 16, 133-MHz sync interface, but no MODE-selectable burst order or ZZ sleep mode. Supports pipelined reads but omits Pentium®-interleaved addressing and low-power sleep - limits x86 compatibility. Choose when burst sequence is fixed and power gating is unnecessary; verify ADV/ADSP timing against controller.

Compared with IS61LV25616AL-10TLI and AS7C3256B-133JCIN, the CY7C1339G-133AXE uniquely delivers 128K × 32 density with configurable burst order, true pipelined I/O, and hardware sleep - making it irreplaceable in x86-derived embedded cache designs requiring deterministic timing and low-power idle states.

Availability

CY7C1339G-133AXE is available at Aetrix Electronics and suitable for embedded x86 cache subsystems, industrial motion controller buffers, and telecom line card packet buffers requiring stable component supply, long-lifecycle support, and RoHS-compliant TQFP packaging.

Supply support for CY7C1339G-133AXE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C1339G belongs to Cypress's high-speed synchronous SRAM product line, designed specifically for low-latency, burst-capable cache and buffer applications in clock-synchronous embedded systems with strict timing predictability requirements.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin selects burst address sequence: tied to GND for linear burst, or left floating/VDD for Intel Pentium®-compatible interleaved burst. It is a strap pin with internal pull-up, and must remain static during operation - dynamic switching invalidates burst behavior and may cause address misalignment.

How does the ZZ sleep mode affect timing and data retention?

Asserting ZZ HIGH initiates sleep mode in exactly two clock cycles (tZZS). Data is retained indefinitely while in sleep, and recovery (tZZREC) requires CE1/CE2/CE3/ADSP/ADSC to remain inactive for two full clock cycles after ZZ returns LOW. No pending accesses are completed upon entry.

Can ADSP and ADSC be asserted simultaneously, and what happens?

Yes, ADSP and ADSC may be asserted together, but the device recognizes only ADSP - ADSC is ignored when ADSP is active. This priority scheme enables clean arbitration between processor-initiated and controller-initiated accesses without external logic.

What is the role of ADV during burst operations, and when is it sampled?

ADV is sampled synchronously on the rising edge of CLK and, when LOW, increments the internal two-bit burst counter to generate the next address in sequence. It is ignored during single-access cycles and only active during burst-read or burst-write sequences initiated by ADSP or ADSC.

CY7C1339G-133AXE Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4Mbit
Memory Organization:
128K x 32
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1339G-133AXE FAQ

1.How can I place an order for CY7C1339G-133AXE through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1339G-133AXE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1339G-133AXE reliable?

The price and inventory of CY7C1339G-133AXE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1339G-133AXE is usually 5 days.

3.What payment methods are accepted for CY7C1339G-133AXE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1339G-133AXE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1339G-133AXE?

CY7C1339G-133AXE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1339G-133AXE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1339G-133AXE?

For technical support, including CY7C1339G-133AXE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1339G-133AXE requirements.

6.How does Aetrix verify that CY7C1339G-133AXE is sourced from the original manufacturer or authorized distributors?

All CY7C1339G-133AXE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1339G-133AXE meets industry standards.

7.What is the process for return or replacement of CY7C1339G-133AXE?

All CY7C1339G-133AXE units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1339G-133AXE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1339G-133AXE part is unused and in its original packaging.

Return procedure for CY7C1339G-133AXE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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