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Infineon Technologies CY7C1339G-133AXI

Part No.:
CY7C1339G-133AXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1339G-133AXI.pdf
Description:
IC SRAM 4MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,450

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Product details

Overview

CY7C1339G-133AXI from Cypress Semiconductor is a 4-Mbit (128K × 32) pipelined synchronous SRAM with registered I/O, 133-MHz operation, 4.0 ns clock-to-output delay, 3.3V core / 2.5V–3.3V I/O supply support, and user-selectable linear or interleaved burst mode. It serves as high-speed secondary cache in embedded processor systems requiring deterministic timing and byte-granular write control.

For engineers reviewing the CY7C1339G-133AXI datasheet, CY7C1339G-133AXI pinout, CY7C1339G-133AXI application, or CY7C1339G-133AXI equivalent, key selection criteria include burst sequence compatibility (Pentium®-interleaved vs. linear), synchronous self-timed write architecture, ZZ sleep mode timing (tZZREC = 2tCYC), and 100-pin TQFP package mechanical fit for legacy board layouts.

Technical Context

The CY7C1339G-133AXI implements a two-bit on-chip wraparound burst counter fed by A1/A0, enabling four-word bursts with programmable order via the MODE pin. All synchronous inputs-including address, CE1/CE2/CE3, ADSP/ADSC, ADV, BW[A:D], BWE, and GW-are registered on the rising edge of CLK.

It supports dual-address-strobe initiation (ADSP for two-cycle writes, ADSC for single-cycle writes), asynchronous OE and ZZ controls, and synchronous self-timed writes with byte-write granularity controlled by BWE + BW[A:D]. Output drivers are registered and JEDEC JESD8-5 compliant for 2.5V/3.3V I/O interfacing.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 Mbit (128K × 32) - provides 512 KB of fast, low-latency storage for cache or buffer applications.
Max Clock Frequency 133 MHz - defines maximum sustained burst throughput of 532 MB/s (32-bit bus × 133 MHz).
tCO (Clock-to-Output) 4.0 ns - guarantees deterministic read data valid window at system clock edge, critical for synchronous pipeline alignment.
VDD / VDDQ 3.3V core / 2.5V or 3.3V I/O - enables interoperability with mixed-voltage SoC interfaces while maintaining core stability.
Burst Mode Control MODE pin-strapped (GND = linear, VDD/floating = interleaved) - directly maps to Pentium® or generic processor burst protocol requirements.
Write Architecture Synchronous self-timed with BWE + BW[A:D] + GW - eliminates external write timing constraints and supports per-byte or full-word updates in one cycle.
ZZ Sleep Recovery tZZREC = 2tCYC - requires two clock cycles to resume operation after exit from low-power snooze mode, preserving data integrity.

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), lead-free, 14 mm × 14 mm body, 0.5 mm pitch.

Pin Circuit Role Design Meaning
CLK Synchronous clock input Rising-edge-triggered master timing reference for all registered inputs/outputs and burst counter increment.
ADSP / ADSC Address strobe inputs ADSP initiates processor-style two-cycle writes; ADSC enables controller-style single-cycle writes-both qualify address registration.
ADV Burst advance control Active-low signal that increments internal two-bit counter to generate next burst address on rising CLK edge.
BW[A:D], BWE, GW Byte write controls BWE enables byte-write mode; BW[A:D] selects DQA–DQD lanes; GW overrides all to enable full 32-bit write regardless of BW state.
OE Asynchronous output enable Active-low tri-state control for bidirectional DQ pins-overrides register output during write detection for safety.
ZZ Asynchronous sleep input Active-high entry into low-power snooze mode; internal pull-down ensures safe default LOW state for normal operation.

Key Features

Feature Design Value
Registered pipelined I/O Input and output registers synchronized to CLK eliminate setup/hold timing violations across PCB traces and simplify timing closure.
User-selectable burst order MODE pin configures interleaved (Pentium®-compatible) or linear burst addressing-no firmware or external logic required.
Synchronous self-timed writes On-chip write sequencer automates write pulse width and timing, removing dependency on precise external write strobe generation.
Byte-write granularity Independent control of DQA–DQD via BW[A:D] + BWE allows partial-word updates without read-modify-write overhead.
Dual-voltage I/O support VDDQ configurable for 2.5V or 3.3V enables direct interface to both legacy and modern processor I/O domains.

Applications

Intel Pentium®-Based Cache Subsystem Industrial Motion Controller Buffer

Use Scenario: Secondary cache memory in x86-compatible industrial PCs using Pentium® processors with interleaved burst protocol.

IC Role / Device Role / Timing Role: Pipelined SRAM providing deterministic 4-word burst reads/writes aligned to processor ADSP/ADV timing.

Use Value: Eliminates glue logic for burst address generation and guarantees tCO ≤ 4.0 ns to meet Pentium® 133-MHz bus timing budgets.

Use Scenario: Real-time motion profile buffering in servo drive controllers requiring deterministic access to trajectory data.

IC Role / Device Role / Timing Role: High-reliability, low-jitter memory for storing interpolated position/velocity commands between FPGA and motor driver.

Use Value: Synchronous self-timed writes ensure command updates complete within one clock cycle, preventing jitter in closed-loop execution.

Communications Line Card Packet Buffer Avionics Data Acquisition Module

Use Scenario: Temporary packet staging in telecom line cards handling multiple Gigabit Ethernet streams.

IC Role / Device Role / Timing Role: Common-I/O SRAM acting as shared buffer between MAC-layer logic and packet scheduler ASICs.

Use Value: Byte-write capability enables efficient header-only updates without overwriting payload data, reducing bandwidth pressure.

Use Scenario: High-integrity sensor data capture in DO-254-compliant avionics modules operating under EMI-rich environments.

IC Role / Device Role / Timing Role: Radiation-tolerant (by design heritage), ZZ-enabled low-power memory for periodic ADC sample buffering.

Use Value: Snooze mode reduces standby current to 40 mA while preserving data-critical for battery-backed or power-constrained flight systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61LV12832AL-133TQLI 3.3V-only I/O (no VDDQ flexibility); no ZZ sleep mode; identical 128K×32 density and 133-MHz speed. Lacks power-gating capability; unsuitable where intermittent low-power operation is required. Select when cost sensitivity outweighs sleep-mode need and I/O voltage is fixed at 3.3V.
AS7C312832B-133BIN Supports 2.5V/3.3V I/O and ZZ mode but uses different burst control (no MODE pin-fixed linear only); same tCO spec. Incompatible with Pentium®-interleaved burst sequences; requires redesign of burst address logic. Choose only for new designs targeting linear-burst-only processors and requiring second-source availability.

Compared with IS61LV12832AL-133TQLI and AS7C312832B-133BIN, the CY7C1339G-133AXI uniquely combines programmable burst order, dual-voltage I/O, and guaranteed data-retentive sleep-making it the sole option for legacy Pentium®-based systems needing power-aware caching.

Availability

CY7C1339G-133AXI is available at Aetrix Electronics and suitable for Intel Pentium®-based industrial PCs, real-time motion controllers, telecom line card buffers, and avionics data acquisition modules requiring stable component supply and long-lifecycle support.

Supply support for CY7C1339G-133AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C1339G belongs to Cypress's legacy synchronous SRAM product line, designed specifically for deterministic, low-latency cache and buffer applications in x86 and real-time embedded systems requiring burst-mode efficiency and robust timing predictability.

FAQ

What burst modes does CY7C1339G-133AXI support, and how is selection implemented?

The device supports both interleaved (Pentium®-compatible) and linear burst sequences. Selection is performed via the MODE pin: tying MODE to GND selects linear mode; connecting it to VDD or leaving it floating selects interleaved mode. This is a static configuration-MODE must remain stable during operation and is sampled only at power-up or reset.

How does the ZZ sleep mode function, and what timing constraints apply?

Asserting ZZ HIGH places the device in snooze mode, reducing standby current to 40 mA while preserving memory contents. Entry and exit each require two full clock cycles (tZZS = tZZREC = 2tCYC). The device must be fully deselected (CE1/CE2/CE3 inactive) before asserting ZZ, and CE/ADSP/ADSC must remain inactive for tZZREC after ZZ returns LOW.

Can CY7C1339G-133AXI perform byte writes and full-word writes in the same access cycle?

No-byte writes and global writes are mutually exclusive per access cycle. When GW is LOW, all four bytes (DQA–DQD) are written regardless of BW[A:D] states. When GW is HIGH, byte writes are enabled only if BWE is LOW and at least one BW[A:D] is LOW. The device does not support simultaneous partial and full writes in one cycle.

What is the functional difference between ADSP and ADSC address strobes?

ADSP initiates processor-style two-cycle writes: address latched on first CLK, data written on second CLK. ADSC enables controller-style single-cycle writes: address and data latched and written in one CLK cycle. ADSP takes priority-if both ADSP and ADSC are active, only ADSP is recognized. ADSP is ignored if CE1 is HIGH.

CY7C1339G-133AXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4Mbit
Memory Organization:
128K x 32
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1339G-133AXI FAQ

1.How can I place an order for CY7C1339G-133AXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1339G-133AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1339G-133AXI reliable?

The price and inventory of CY7C1339G-133AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1339G-133AXI is usually 5 days.

3.What payment methods are accepted for CY7C1339G-133AXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1339G-133AXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1339G-133AXI?

CY7C1339G-133AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1339G-133AXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1339G-133AXI?

For technical support, including CY7C1339G-133AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1339G-133AXI requirements.

6.How does Aetrix verify that CY7C1339G-133AXI is sourced from the original manufacturer or authorized distributors?

All CY7C1339G-133AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1339G-133AXI meets industry standards.

7.What is the process for return or replacement of CY7C1339G-133AXI?

All CY7C1339G-133AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1339G-133AXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1339G-133AXI part is unused and in its original packaging.

Return procedure for CY7C1339G-133AXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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