Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY7C1347F-100AC

Part No.:
CY7C1347F-100AC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1347F-100AC.pdf
Description:
IC SRAM 4.5MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,503

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1347F-100AC from Cypress Semiconductor is a 4-Mb (128K × 36) pipelined synchronous SRAM optimized for zero-wait-state secondary cache in high-performance computing systems. It features 3.3V core supply, 2.5V/3.3V I/O operation, synchronous self-timed writes, user-selectable Intel Pentium® interleaved or linear burst sequences via MODE pin, and 4.5 ns clock-to-output delay at 100 MHz.

For engineers reviewing the CY7C1347F-100AC datasheet, CY7C1347F-100AC pinout, CY7C1347F-100AC application, or CY7C1347F-100AC equivalent, key selection criteria include burst mode flexibility, dual-voltage I/O compatibility, synchronous chip select architecture (CE1/CE2/CE3), asynchronous OE masking behavior during deselected-to-selected transitions, and ZZ sleep mode timing requirements.

Technical Context

The CY7C1347F-100AC implements fully registered synchronous interfaces: all inputs (address, control, data) are latched on the rising edge of CLK, and all outputs pass through output registers synchronized to CLK. Its 2-bit wraparound burst counter captures A[1:0] at ADSP/ADSC assertion and auto-increments on ADV assertion.

Burst sequencing is statically configured by MODE: tied to GND for linear (e.g., PowerPC®), floating or VDDQ for interleaved (Intel Pentium®). Write operations support both ADSP-initiated (two-cycle) and ADSC-initiated (single-cycle) modes, with GW overriding BW[A:D]/BWE for full-word writes and synchronous self-timed write circuitry eliminating external write pulse generation.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4 Mb (128K × 36 bits), enabling 576-bit wide cache line storage per access
Access Time (tCO)4.5 ns at 100 MHz - defines maximum clock-to-valid-data delay for read cycles
Core Supply3.3V ± 0.3V - powers internal logic and memory array; requires stable low-noise regulation
I/O Voltage Support2.5V or 3.3V with 3.3V tolerance when VDDQ = 2.5V - enables direct interfacing with mixed-voltage processors
Burst Mode ControlMODE pin selects Intel Pentium® interleaved or linear sequence - determines address increment pattern across four consecutive accesses
Write ArchitectureSynchronous self-timed writes with GW/BWE/BW[A:D] - eliminates need for external write strobe timing control
Sleep Mode EntryAsynchronous ZZ input with two-clock-cycle latency - reduces standby current to 40 mA while preserving data integrity

Pinout & Package

Package: 100-pin TQFP (Thin Quad Flat Package), JEDEC-standard footprint, 0.5 mm pitch, body size 14 mm × 14 mm.

Pin/TerminalCircuit RoleDesign Meaning
A[16:0]Synchronous Address InputLatched on rising CLK edge when ADSP or ADSC active; A[1:0] seeds 2-bit burst counter
CLKSystem Clock InputSingle-edge-triggered master timing reference for all synchronous registers and burst counter
ADSP / ADSCAddress Strobe InputsADSP has priority over ADSC; both sampled synchronously to initiate address capture and burst start
ADVBurst Address AdvanceAsserted LOW on CLK rise to increment burst counter - controls sequential address progression
CE1, CE2, CE3Synchronous Chip EnablesCE1 (active LOW), CE2 (active HIGH), CE3 (active LOW); all three must be valid to enable device
OEAsynchronous Output EnableActive LOW enables outputs; masked during first clock after deselection to prevent bus contention
GW / BWE / BW[A:D]Write Control InputsGW forces full-word write; BWE + BW[A:D] enable byte-selective writes; all sampled synchronously
ZZAsynchronous Sleep ControlActive HIGH places device in low-power sleep; internal pull-down allows floating for normal operation
DQs / DQPsCommon I/O Data Bus36-bit bidirectional interface (DQA–DQD, DQPA–DQPD); direction controlled by OE state
VDD / VSS / VDDQ / VSSQPower & GroundSeparate 3.3V core (VDD/VSS) and I/O (VDDQ/VSSQ) rails - supports mixed-voltage signaling and noise isolation

Key Features

FeatureDesign Value
Pipelined Synchronous InterfaceFull input/output registration eliminates setup/hold timing constraints on system board traces
User-Selectable Burst OrderMODE pin configures Intel Pentium® interleaved or linear burst - matches processor-native cache line fetch patterns
Dual-Voltage I/O OperationVDDQ = 2.5V or 3.3V with 3.3V tolerance - enables seamless integration with legacy and next-gen CPU I/O standards
Synchronous Self-Timed WritesOn-chip write timing generator removes dependency on precise external write strobe alignment
Asynchronous ZZ Sleep ModeTwo-cycle entry/exit latency with 40 mA standby current - preserves cache data while cutting power during idle periods

Applications

Processor Cache InterfaceMulti-Processor Shared Memory

Use Scenario: Secondary cache buffer between Pentium-class CPU and main memory in embedded x86 systems.

IC Role / Device Role / Timing Role: Pipelined SRAM providing zero-wait-state burst reads/writes aligned to CPU clock domain via ADSP/ADV handshake.

Use Value: Eliminates glue logic for burst address generation and write timing control, reducing PCB complexity and signal routing overhead.

Use Scenario: Shared instruction/data memory for dual-CPU or CPU+DSP architectures requiring concurrent access.

IC Role / Device Role / Timing Role: Common I/O SRAM with independent CE1/CE2/CE3 bank selection and asynchronous OE masking for conflict-free arbitration.

Use Value: Enables deterministic access arbitration without external bus controllers, supporting real-time coherency protocols.

High-Speed Network BufferingIndustrial Motion Controller Memory

Use Scenario: Packet buffering in 100 Mbps Ethernet switch ASICs where deterministic latency is critical.

IC Role / Device Role / Timing Role: Burst-mode SRAM storing frame headers and payload fragments with 4.5 ns tCO guaranteeing sub-5 ns read response.

Use Value: Meets strict jitter and latency budgets for time-sensitive packet forwarding pipelines.

Use Scenario: Real-time motion profile storage and lookup in CNC or robotics controllers operating at -40°C to +85°C.

IC Role / Device Role / Timing Role: Industrial-grade SRAM with guaranteed 100 MHz operation and ZZ sleep mode for energy-constrained edge devices.

Use Value: Maintains data integrity across thermal cycling and power interruptions while minimizing average power draw.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61LV12836AL-100TQLI3.3V-only I/O (no 2.5V support); no ZZ sleep mode; identical 128K×36 density and 100 MHz speed gradeLacks voltage-flexible I/O and low-power sleep - unsuitable for mixed-voltage or battery-backed systemsSelect when cost sensitivity outweighs I/O flexibility and power management needs
AS7C312836B-100BINSupports 2.5V/3.3V I/O and ZZ mode but uses different burst control (BWS pins instead of MODE); 4.2 ns tCO at 100 MHzDifferent burst configuration method requires PCB layout and firmware adaptation; tighter tCO marginSelect when lower access latency is prioritized and burst mode reconfiguration is feasible

Compared with IS61LV12836AL-100TQLI and AS7C312836B-100BIN, the CY7C1347F-100AC uniquely combines Intel Pentium®-compatible interleaved burst selection, dual-voltage I/O tolerance, and asynchronous ZZ sleep - making it optimal for legacy x86 cache designs requiring power-aware operation.

Availability

CY7C1347F-100AC is available at Aetrix Electronics and suitable for high-speed processor cache interfaces, multi-processor shared memory subsystems, and industrial motion controller memory requiring stable component supply across extended temperature ranges.

Supply support for CY7C1347F-100AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C1347F belongs to Cypress's high-speed synchronous SRAM product line, designed specifically to replace asynchronous SRAMs in zero-wait-state cache and buffer applications where deterministic timing and burst efficiency are critical.

FAQ

What is the function of the MODE pin on CY7C1347F-100AC?

The MODE pin selects the burst sequence type: tied to GND enables linear burst order (e.g., PowerPC®), while floating or connected to VDDQ enables Intel Pentium®-compatible interleaved burst. It is a static strap pin-must remain stable during operation and is sampled only at power-up or reset. Internal pull-up ensures default interleaved mode if left unconnected.

How does the asynchronous OE masking behavior affect system timing?

When CY7C1347F-100AC transitions from deselected to selected state, OE is internally masked during the first clock cycle of the read access-forcing outputs into high-impedance regardless of OE state. This prevents bus contention during bank switching. After the first cycle, OE regains control. Designers must account for this one-cycle delay in timing budgets for systems with frequent chip select toggling.

Can CY7C1347F-100AC operate with VDDQ = 2.5V while maintaining 3.3V signal integrity on other pins?

Yes. When VDDQ = 2.5V, all DQ/DQP pins are 3.3V tolerant, allowing connection to 3.3V logic without level shifters. Core logic (VDD = 3.3V) remains unaffected. This dual-rail design permits direct interfacing with 2.5V I/O domains while preserving compatibility with 3.3V system buses and voltage references.

What is the timing relationship between ZZ assertion and data retention?

Data integrity is preserved throughout ZZ sleep mode. Two clock cycles are required to enter or exit sleep-during entry, internal clocks halt after the second CLK edge; during exit, full functionality resumes after the second CLK edge. No external refresh or backup power is needed, and all stored data remains valid across the entire industrial temperature range (-40°C to +85°C).

CY7C1347F-100AC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Bag
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.5 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1347F-100AC FAQ

1.How can I place an order for CY7C1347F-100AC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1347F-100AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1347F-100AC reliable?

The price and inventory of CY7C1347F-100AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1347F-100AC is usually 5 days.

3.What payment methods are accepted for CY7C1347F-100AC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1347F-100AC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1347F-100AC?

CY7C1347F-100AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1347F-100AC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1347F-100AC?

For technical support, including CY7C1347F-100AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1347F-100AC requirements.

6.How does Aetrix verify that CY7C1347F-100AC is sourced from the original manufacturer or authorized distributors?

All CY7C1347F-100AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1347F-100AC meets industry standards.

7.What is the process for return or replacement of CY7C1347F-100AC?

All CY7C1347F-100AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1347F-100AC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1347F-100AC part is unused and in its original packaging.

Return procedure for CY7C1347F-100AC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1347F-100AC Tags

  • CY7C1347F-100AC
  • CY7C1347F-100AC PDF
  • CY7C1347F-100AC Datasheet
  • CY7C1347F-100AC Specifications
  • CY7C1347F-100AC Images
  • Infineon Technologies
  • Infineon Technologies CY7C1347F-100AC
  • Buy CY7C1347F-100AC
  • CY7C1347F-100AC Price
  • CY7C1347F-100AC Distributor
  • CY7C1347F-100AC Supplier
  • CY7C1347F-100AC Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER