Infineon Technologies CY7C1347F-100AC
- Part No.:
- CY7C1347F-100AC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1347F-100AC.pdf
- Description:
- IC SRAM 4.5MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,503
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Product details
Overview
CY7C1347F-100AC from Cypress Semiconductor is a 4-Mb (128K × 36) pipelined synchronous SRAM optimized for zero-wait-state secondary cache in high-performance computing systems. It features 3.3V core supply, 2.5V/3.3V I/O operation, synchronous self-timed writes, user-selectable Intel Pentium® interleaved or linear burst sequences via MODE pin, and 4.5 ns clock-to-output delay at 100 MHz.
For engineers reviewing the CY7C1347F-100AC datasheet, CY7C1347F-100AC pinout, CY7C1347F-100AC application, or CY7C1347F-100AC equivalent, key selection criteria include burst mode flexibility, dual-voltage I/O compatibility, synchronous chip select architecture (CE1/CE2/CE3), asynchronous OE masking behavior during deselected-to-selected transitions, and ZZ sleep mode timing requirements.
Technical Context
The CY7C1347F-100AC implements fully registered synchronous interfaces: all inputs (address, control, data) are latched on the rising edge of CLK, and all outputs pass through output registers synchronized to CLK. Its 2-bit wraparound burst counter captures A[1:0] at ADSP/ADSC assertion and auto-increments on ADV assertion.
Burst sequencing is statically configured by MODE: tied to GND for linear (e.g., PowerPC®), floating or VDDQ for interleaved (Intel Pentium®). Write operations support both ADSP-initiated (two-cycle) and ADSC-initiated (single-cycle) modes, with GW overriding BW[A:D]/BWE for full-word writes and synchronous self-timed write circuitry eliminating external write pulse generation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mb (128K × 36 bits), enabling 576-bit wide cache line storage per access |
| Access Time (tCO) | 4.5 ns at 100 MHz - defines maximum clock-to-valid-data delay for read cycles |
| Core Supply | 3.3V ± 0.3V - powers internal logic and memory array; requires stable low-noise regulation |
| I/O Voltage Support | 2.5V or 3.3V with 3.3V tolerance when VDDQ = 2.5V - enables direct interfacing with mixed-voltage processors |
| Burst Mode Control | MODE pin selects Intel Pentium® interleaved or linear sequence - determines address increment pattern across four consecutive accesses |
| Write Architecture | Synchronous self-timed writes with GW/BWE/BW[A:D] - eliminates need for external write strobe timing control |
| Sleep Mode Entry | Asynchronous ZZ input with two-clock-cycle latency - reduces standby current to 40 mA while preserving data integrity |
Pinout & Package
Package: 100-pin TQFP (Thin Quad Flat Package), JEDEC-standard footprint, 0.5 mm pitch, body size 14 mm × 14 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[16:0] | Synchronous Address Input | Latched on rising CLK edge when ADSP or ADSC active; A[1:0] seeds 2-bit burst counter |
| CLK | System Clock Input | Single-edge-triggered master timing reference for all synchronous registers and burst counter |
| ADSP / ADSC | Address Strobe Inputs | ADSP has priority over ADSC; both sampled synchronously to initiate address capture and burst start |
| ADV | Burst Address Advance | Asserted LOW on CLK rise to increment burst counter - controls sequential address progression |
| CE1, CE2, CE3 | Synchronous Chip Enables | CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW); all three must be valid to enable device |
| OE | Asynchronous Output Enable | Active LOW enables outputs; masked during first clock after deselection to prevent bus contention |
| GW / BWE / BW[A:D] | Write Control Inputs | GW forces full-word write; BWE + BW[A:D] enable byte-selective writes; all sampled synchronously |
| ZZ | Asynchronous Sleep Control | Active HIGH places device in low-power sleep; internal pull-down allows floating for normal operation |
| DQs / DQPs | Common I/O Data Bus | 36-bit bidirectional interface (DQA–DQD, DQPA–DQPD); direction controlled by OE state |
| VDD / VSS / VDDQ / VSSQ | Power & Ground | Separate 3.3V core (VDD/VSS) and I/O (VDDQ/VSSQ) rails - supports mixed-voltage signaling and noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Synchronous Interface | Full input/output registration eliminates setup/hold timing constraints on system board traces |
| User-Selectable Burst Order | MODE pin configures Intel Pentium® interleaved or linear burst - matches processor-native cache line fetch patterns |
| Dual-Voltage I/O Operation | VDDQ = 2.5V or 3.3V with 3.3V tolerance - enables seamless integration with legacy and next-gen CPU I/O standards |
| Synchronous Self-Timed Writes | On-chip write timing generator removes dependency on precise external write strobe alignment |
| Asynchronous ZZ Sleep Mode | Two-cycle entry/exit latency with 40 mA standby current - preserves cache data while cutting power during idle periods |
Applications
| Processor Cache Interface | Multi-Processor Shared Memory |
|---|---|
Use Scenario: Secondary cache buffer between Pentium-class CPU and main memory in embedded x86 systems. IC Role / Device Role / Timing Role: Pipelined SRAM providing zero-wait-state burst reads/writes aligned to CPU clock domain via ADSP/ADV handshake. Use Value: Eliminates glue logic for burst address generation and write timing control, reducing PCB complexity and signal routing overhead. | Use Scenario: Shared instruction/data memory for dual-CPU or CPU+DSP architectures requiring concurrent access. IC Role / Device Role / Timing Role: Common I/O SRAM with independent CE1/CE2/CE3 bank selection and asynchronous OE masking for conflict-free arbitration. Use Value: Enables deterministic access arbitration without external bus controllers, supporting real-time coherency protocols. |
| High-Speed Network Buffering | Industrial Motion Controller Memory |
Use Scenario: Packet buffering in 100 Mbps Ethernet switch ASICs where deterministic latency is critical. IC Role / Device Role / Timing Role: Burst-mode SRAM storing frame headers and payload fragments with 4.5 ns tCO guaranteeing sub-5 ns read response. Use Value: Meets strict jitter and latency budgets for time-sensitive packet forwarding pipelines. | Use Scenario: Real-time motion profile storage and lookup in CNC or robotics controllers operating at -40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-grade SRAM with guaranteed 100 MHz operation and ZZ sleep mode for energy-constrained edge devices. Use Value: Maintains data integrity across thermal cycling and power interruptions while minimizing average power draw. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV12836AL-100TQLI | 3.3V-only I/O (no 2.5V support); no ZZ sleep mode; identical 128K×36 density and 100 MHz speed grade | Lacks voltage-flexible I/O and low-power sleep - unsuitable for mixed-voltage or battery-backed systems | Select when cost sensitivity outweighs I/O flexibility and power management needs |
| AS7C312836B-100BIN | Supports 2.5V/3.3V I/O and ZZ mode but uses different burst control (BWS pins instead of MODE); 4.2 ns tCO at 100 MHz | Different burst configuration method requires PCB layout and firmware adaptation; tighter tCO margin | Select when lower access latency is prioritized and burst mode reconfiguration is feasible |
Compared with IS61LV12836AL-100TQLI and AS7C312836B-100BIN, the CY7C1347F-100AC uniquely combines Intel Pentium®-compatible interleaved burst selection, dual-voltage I/O tolerance, and asynchronous ZZ sleep - making it optimal for legacy x86 cache designs requiring power-aware operation.
Availability
CY7C1347F-100AC is available at Aetrix Electronics and suitable for high-speed processor cache interfaces, multi-processor shared memory subsystems, and industrial motion controller memory requiring stable component supply across extended temperature ranges.
Supply support for CY7C1347F-100AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
The CY7C1347F belongs to Cypress's high-speed synchronous SRAM product line, designed specifically to replace asynchronous SRAMs in zero-wait-state cache and buffer applications where deterministic timing and burst efficiency are critical.
FAQ
What is the function of the MODE pin on CY7C1347F-100AC?
The MODE pin selects the burst sequence type: tied to GND enables linear burst order (e.g., PowerPC®), while floating or connected to VDDQ enables Intel Pentium®-compatible interleaved burst. It is a static strap pin-must remain stable during operation and is sampled only at power-up or reset. Internal pull-up ensures default interleaved mode if left unconnected.
How does the asynchronous OE masking behavior affect system timing?
When CY7C1347F-100AC transitions from deselected to selected state, OE is internally masked during the first clock cycle of the read access-forcing outputs into high-impedance regardless of OE state. This prevents bus contention during bank switching. After the first cycle, OE regains control. Designers must account for this one-cycle delay in timing budgets for systems with frequent chip select toggling.
Can CY7C1347F-100AC operate with VDDQ = 2.5V while maintaining 3.3V signal integrity on other pins?
Yes. When VDDQ = 2.5V, all DQ/DQP pins are 3.3V tolerant, allowing connection to 3.3V logic without level shifters. Core logic (VDD = 3.3V) remains unaffected. This dual-rail design permits direct interfacing with 2.5V I/O domains while preserving compatibility with 3.3V system buses and voltage references.
What is the timing relationship between ZZ assertion and data retention?
Data integrity is preserved throughout ZZ sleep mode. Two clock cycles are required to enter or exit sleep-during entry, internal clocks halt after the second CLK edge; during exit, full functionality resumes after the second CLK edge. No external refresh or backup power is needed, and all stored data remains valid across the entire industrial temperature range (-40°C to +85°C).
CY7C1347F-100AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bag
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.5 ns
- Voltage - Supply:
- 3.15V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1347F-100AC FAQ
1.How can I place an order for CY7C1347F-100AC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1347F-100AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1347F-100AC reliable?
The price and inventory of CY7C1347F-100AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1347F-100AC is usually 5 days.
3.What payment methods are accepted for CY7C1347F-100AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1347F-100AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1347F-100AC?
CY7C1347F-100AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1347F-100AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1347F-100AC?
For technical support, including CY7C1347F-100AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1347F-100AC requirements.
6.How does Aetrix verify that CY7C1347F-100AC is sourced from the original manufacturer or authorized distributors?
All CY7C1347F-100AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1347F-100AC meets industry standards.
7.What is the process for return or replacement of CY7C1347F-100AC?
All CY7C1347F-100AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1347F-100AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1347F-100AC part is unused and in its original packaging.
Return procedure for CY7C1347F-100AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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