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Infineon Technologies CY7C1347F-133AC

Part No.:
CY7C1347F-133AC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1347F-133AC.pdf
Description:
IC SRAM 4.5MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,138

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Product details

Overview

CY7C1347F-133AC from Cypress Semiconductor is a 4-Mb (128K × 36) pipelined synchronous SRAM optimized for zero-wait-state secondary cache in high-performance computing systems. It operates with a 3.3V core supply, 2.5V/3.3V I/O tolerance, and delivers 4.0 ns clock-to-output access time at 133 MHz. Its fully registered inputs/outputs, dual address strobes (ADSP/ADSC), and user-selectable Intel Pentium®-compatible or linear burst mode enable seamless integration with CPU/cache controllers.

For engineers reviewing the CY7C1347F-133AC datasheet, CY7C1347F-133AC pinout, CY7C1347F-133AC application, or CY7C1347F-133AC equivalent, key selection criteria include burst sequence control via MODE pin, synchronous self-timed write architecture, ZZ sleep mode support, and compatibility with depth-expanded memory banks using CE1/CE2/CE3 bank selection.

Technical Context

The CY7C1347F-133AC implements a fully synchronous, pipelined architecture where all inputs-including address, byte write enables, and chip selects-are registered on the rising edge of CLK, and all outputs pass through output registers synchronized to the same edge. Its 2-bit wraparound burst counter captures A[1:0] at burst initiation and auto-increments per ADV assertion.

Burst sequencing is statically selected via the MODE pin (GND = linear, VDDQ/floating = interleaved), supporting both Intel Pentium® and PowerPC®-style cache protocols. Write operations are either ADSP-triggered (two-cycle) or ADSC-triggered (single-cycle), with synchronous self-timed internal write timing eliminating external write pulse generation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 Mb (128K × 36 bits), enabling 576-bit-wide cache line storage per access
Access Time (tCO) 4.0 ns at 133 MHz - defines maximum clock-to-valid-data delay for read cycles
Core Supply Voltage 3.3 V ± 0.3 V - powers internal logic and memory array; requires stable low-noise regulation
I/O Voltage Support 2.5 V or 3.3 V - allows interoperability with mixed-voltage processor buses; I/O pins tolerant to 3.3 V when VDDQ = 2.5 V
Burst Mode Control Static MODE pin - selects Intel Pentium® interleaved or linear burst sequence without runtime reconfiguration
Sleep Mode Entry Asynchronous ZZ pin - reduces standby current to ≤40 mA while preserving data integrity; requires two clocks to enter/exit
Write Architecture Synchronous self-timed writes - eliminates need for external write pulse width control or timing margining

Pinout & Package

Package: 100-pin TQFP (JEDEC standard), body size 14 mm × 14 mm, 0.5 mm pitch.

Pin/Terminal Circuit Role Design Meaning
A[16:0] Synchronous Address Input 17-bit address bus sampled on CLK rise; A[1:0] load 2-bit burst counter for sequential access
ADSP / ADSC Synchronous Address Strobe ADSP prioritized over ADSC; initiates address capture and burst start; ignored if CE1 HIGH
CE1, CE2, CE3 Synchronous Chip Select Three-level bank select logic (CE1 active LOW, CE2 active HIGH, CE3 active LOW) enables multi-bank memory expansion
GW, BWE, BW[A:D] Write Control Inputs GW overrides byte writes; BWE enables byte write; BW[A:D] selects 9-bit DQ groups (DQA–DQPD) for partial writes
OE Asynchronous Output Enable Controls I/O direction; masked during first clock of read after deselection to prevent bus contention
ZZ Asynchronous Sleep Input Active HIGH entry to low-power sleep mode; internal pull-down allows floating operation for normal use

Key Features

Feature Design Value
Fully registered I/O pipeline Eliminates setup/hold timing violations on high-speed buses by aligning all signals to CLK edge
Dual address strobe support (ADSP/ADSC) Enables coexistence of processor- and controller-initiated accesses without arbitration logic
User-selectable burst order MODE pin configures interleaved (Pentium®) or linear (PowerPC®) addressing-no firmware overhead
Synchronous self-timed writes Removes external write pulse generation and timing validation burden from system design
Depth-expansion ready interface OE masking on deselect + three independent CE inputs simplify multi-SRAM bank implementation

Applications

Secondary Cache Subsystem High-Speed Network Buffer

Use Scenario: L2 cache between Pentium-class CPU and main memory in embedded industrial controllers.

IC Role / Device Role / Timing Role: Pipelined SRAM providing zero-wait-state 36-bit-wide cache lines with interleaved burst reads.

Use Value: 4.0 ns tCO and ADSP/ADSC dual-strobe support reduce cache latency to match 133 MHz front-side bus timing.

Use Scenario: Packet buffering in 10/100 Mbps Ethernet switch ASICs requiring deterministic latency.

IC Role / Device Role / Timing Role: Synchronous FIFO buffer with burst write capability for ingress/egress traffic shaping.

Use Value: Self-timed writes and OE-controlled three-state outputs prevent bus contention during concurrent read/write operations.

Multi-Processor Shared Memory Real-Time DSP Data Exchange

Use Scenario: Shared memory interconnect between dual ARM9 processors in telecom baseband modules.

IC Role / Device Role / Timing Role: Common I/O SRAM with CE1/CE2/CE3 bank decoding for processor-private and shared memory regions.

Use Value: 2.5V/3.3V I/O tolerance allows direct interfacing to heterogeneous processor voltage domains.

Use Scenario: Coefficient/data exchange buffer between TI C6000 DSP and FPGA-based accelerator.

IC Role / Device Role / Timing Role: Burst-mode SRAM supporting linear bursts for FFT frame transfers and coefficient updates.

Use Value: MODE pin configuration enables fixed linear burst alignment matching DSP DMA engine stride requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61LV12836A-133TQLI 3.3V-only I/O (no 2.5V support); no ZZ sleep mode; identical 128K×36 density and 4.0 ns tCO Lacks voltage-flexible I/O and power management - unsuitable for mixed-voltage or low-power sleep systems Select when cost sensitivity outweighs I/O voltage flexibility and sleep mode requirements
MT55LSD12836D-133:J DDR-compatible interface; differential clock input; 3.3V core only; no ADSP/ADSC dual-strobe architecture Designed for DDR-style burst streaming, not CPU-cache burst protocols - incompatible MODE/ADV control Choose only for new DDR-aligned designs; not a functional replacement for CY7C1347F-133AC's cache interface

Compared with IS61LV12836A-133TQLI and MT55LSD12836D-133:J, the CY7C1347F-133AC uniquely supports 2.5V/3.3V I/O interoperability, asynchronous ZZ sleep, and dual-address-strobe cache control-critical for legacy Pentium®-compatible and low-power industrial systems.

Availability

CY7C1347F-133AC is available at Aetrix Electronics and suitable for secondary cache subsystems, high-speed network buffers, and real-time DSP data exchange requiring stable component supply across extended product lifecycles.

Supply support for CY7C1347F-133AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C1347F belongs to Cypress's synchronous SRAM product line, engineered specifically for zero-wait-state CPU cache and high-bandwidth buffer applications demanding deterministic timing, burst flexibility, and low-latency I/O.

FAQ

What is the function of the MODE pin on CY7C1347F-133AC?

The MODE pin statically selects the burst sequence type: tied to GND for linear burst (e.g., PowerPC®), or to VDDQ/floating for Intel Pentium®-style interleaved burst. It is a strap pin-must remain static during operation and has an internal pull-up resistor. This selection determines how the 2-bit burst counter increments addresses during consecutive accesses.

How does the ZZ pin affect power consumption and timing?

The ZZ pin places the device in a low-power "sleep" mode when driven HIGH asynchronously. In this state, core current drops to ≤40 mA while retaining memory contents. Entry and exit each require two clock cycles, introducing a fixed 2-cycle latency penalty. During sleep, all outputs are three-stated and inputs are ignored except ZZ itself.

Can CY7C1347F-133AC operate with 2.5V I/O while using 3.3V core supply?

Yes. The device supports independent VDD = 3.3 V (core) and VDDQ = 2.5 V (I/O). When VDDQ = 2.5 V, all I/O pins are 3.3V-tolerant, allowing safe interfacing with 3.3V logic drivers. This dual-voltage capability enables migration from legacy 3.3V systems to lower-power 2.5V I/O domains without level-shifting.

What is the difference between ADSP and ADSC in burst operation?

ADSP (Address Strobe from Processor) and ADSC (Address Strobe from Controller) both initiate burst sequences but differ in priority and timing: ADSP is prioritized when both are asserted, and ADSP-triggered writes require two clock cycles, whereas ADSC-triggered writes complete in one cycle. This allows asymmetric control-e.g., CPU uses ADSP for cache fills, DMA controller uses ADSC for background transfers.

CY7C1347F-133AC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Bag
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1347F-133AC FAQ

1.How can I place an order for CY7C1347F-133AC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1347F-133AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1347F-133AC reliable?

The price and inventory of CY7C1347F-133AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1347F-133AC is usually 5 days.

3.What payment methods are accepted for CY7C1347F-133AC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1347F-133AC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1347F-133AC?

CY7C1347F-133AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1347F-133AC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1347F-133AC?

For technical support, including CY7C1347F-133AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1347F-133AC requirements.

6.How does Aetrix verify that CY7C1347F-133AC is sourced from the original manufacturer or authorized distributors?

All CY7C1347F-133AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1347F-133AC meets industry standards.

7.What is the process for return or replacement of CY7C1347F-133AC?

All CY7C1347F-133AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1347F-133AC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1347F-133AC part is unused and in its original packaging.

Return procedure for CY7C1347F-133AC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1347F-133AC Tags

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