Infineon Technologies CY7C1347G-166AXCT

Overview

CY7C1347G-166AXCT from Infineon Technologies (formerly Cypress) is a 4-Mbit (128K × 36) pipelined synchronous SRAM optimized for zero-wait-state secondary cache in high-performance computing systems. It operates with 3.3 V core supply (VDD), 2.5 V/3.3 V I/O supply (VDDQ), supports 166 MHz clock frequency (tCO = 3.5 ns), and features fully registered inputs/outputs, Intel Pentium–compatible interleaved or linear burst modes, and synchronous self-timed writes.

For engineers reviewing the CY7C1347G-166AXCT datasheet, CY7C1347G-166AXCT pinout, CY7C1347G-166AXCT application, or CY7C1347G-166AXCT equivalent, key selection criteria include burst mode flexibility (MODE pin), dual address strobe support (ADSP/ADSC), synchronous chip enables (CE1–CE3), ZZ sleep mode, and 100-pin TQFP packaging with 2.5 V/3.3 V I/O tolerance.

Technical Context

The device implements a synchronous, pipelined architecture where all inputs-including address, control, and data-are latched on the rising edge of CLK, and all outputs are registered to the same edge, enabling deterministic timing and eliminating external latch requirements. Its 2-bit wraparound burst counter captures A[1:0] at burst initiation and auto-increments for subsequent accesses within the 36-bit-wide data path.

Burst sequencing is statically selected via the MODE pin (GND = linear; VDDQ/floating = interleaved), and access initiation is decoupled between processor (ADSP) and controller (ADSC) paths-both sampled synchronously but prioritized (ADSP overrides ADSC). Write operations use either byte-select (BWA–BWD + BWE) or global write (GW), with all writes executed via on-chip self-timed circuitry independent of external timing constraints.

Key Specifications

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), 14 mm × 20 mm × 1.4 mm body, lead-free (Pb-free), RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Compared with AS7C34096A-166JCIN and IS61WV102436B-166TQLI, the CY7C1347G-166AXCT uniquely delivers parity support, dual-voltage I/O, configurable burst order, and hardware sleep-making it optimal for mission-critical cache and buffer applications demanding configurability and reliability.

Availability

CY7C1347G-166AXCT is available at Aetrix Electronics and suitable for high-speed CPU cache subsystems, network packet buffering, industrial PLC memory modules, and avionics data recorders requiring stable component supply, long-term lifecycle support, and industrial temperature compliance.

Supply support for CY7C1347G-166AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive microcontrollers, and memory solutions. Following its acquisition of Cypress Semiconductor in 2020, Infineon continues legacy Cypress product lines with full technical and supply chain continuity.

The CY7C1347G belongs to Infineon's legacy synchronous SRAM portfolio, originally designed for high-bandwidth, low-latency secondary cache and buffer applications in computing, networking, and industrial control systems where deterministic timing and burst efficiency are essential.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin selects burst sequence behavior: tied to GND for linear burst (e.g., PowerPC), or left floating/VDDQ for Intel Pentium–style interleaved burst. It is a static strap pin-must be set before operation and held stable during device use. Internal pull-up ensures default interleaved mode if unconnected.

Why must the ZZ pin be externally grounded despite being labeled "active HIGH"?

Per documented errata (page 22, Rev. *T), the ZZ pin (Pin 64) exhibits functional instability when left floating or driven HIGH. To ensure reliable sleep-mode entry and avoid unintended behavior, Infineon mandates external grounding. The internal pull-down is insufficient for robust operation under all conditions.

How does the CY7C1347G-166AXCT handle read access when transitioning from deselected to selected state?

When emerging from deselected (all CE inactive) to selected state, OE is masked during the first clock cycle of the read access-forcing outputs to tristate regardless of OE level. This prevents bus contention. From the second cycle onward, OE regains full control over I/O direction and output enable.

Can the CY7C1347G-166AXCT operate with VDDQ = 2.5 V while maintaining 3.3 V signal integrity on address/control lines?

Yes. VDDQ powers only the I/O circuitry (DQ/DQP pins), while address/control inputs (ADSP, ADSC, CE1–CE3, etc.) are referenced to VDD (3.3 V). The I/O pins are 3.3 V tolerant when VDDQ = 2.5 V, enabling safe interfacing with 2.5 V logic while retaining compatibility with 3.3 V system buses.