Infineon Technologies CY7C1350G-133AXI

Overview

CY7C1350G-133AXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (128K × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 133 MHz with 4.0 ns clock-to-output delay, supports 3.3 V core supply (VDD) and 2.5/3.3 V I/O supply (VDDQ), and enables true back-to-back read/write operations without wait states in burst or single-access modes.

For engineers reviewing the CY7C1350G-133AXI datasheet, CY7C1350G-133AXI pinout, CY7C1350G-133AXI application, or CY7C1350G-133AXI equivalent, key selection considerations include its 100-pin TQFP package, synchronous self-timed write control, byte-write capability via BW[A:D], ZZ sleep mode, and linear/interleaved burst ordering controlled by the MODE strap pin.

Technical Context

The CY7C1350G-133AXI implements a fully pipelined synchronous interface with all inputs registered on the rising edge of CLK and all outputs registered on the same edge. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles with data valid every clock - critical for packet buffering and real-time switching fabric applications.

It uses three synchronous chip enables (CE1 active LOW, CE2 active HIGH, CE3 active LOW) for bank selection, asynchronous OE for output tristate control, and CEN to gate clock recognition without deselecting the device. The ZZ pin places the device in low-power sleep mode while preserving data integrity, requiring external grounding per errata.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with CY7C1350D-133AXC and AS7C34098B-133JCIN, the CY7C1350G-133AXI uniquely combines industrial temperature rating, hardware-configurable burst order, and errata-managed ZZ sleep functionality - making it optimal for carrier-grade infrastructure requiring reliability, flexibility, and power-aware operation.

Availability

CY7C1350G-133AXI is available at Aetrix Electronics and suitable for packet buffering in network switches, line card memory subsystems, protocol processing engines, and real-time traffic shapers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY7C1350G-133AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains the full portfolio of high-performance memory and programmable solutions originally developed by Cypress.

The CY7C1350G belongs to Cypress' NoBL™ SRAM product line, engineered specifically for zero-wait-state, high-throughput memory interfacing in telecom, networking, and real-time embedded systems demanding deterministic timing and burst efficiency.

FAQ

What is the required external connection for the ZZ pin on CY7C1350G-133AXI?

The ZZ pin (Pin 64 in TQFP) must be externally connected to ground per documented errata (page 19, Rev. *S). Although the pin has an internal pull-down, grounding ensures reliable disablement of sleep mode during normal operation and prevents unintended entry into low-power state that could disrupt memory access sequencing.

How does the MODE pin affect burst addressing behavior?

The MODE pin selects burst order: tied to GND enables linear burst (0,1,2,3), while tied to VDD or left floating enables interleaved burst (0,2,1,3). This setting determines how A[1:0] increments during ADV/LD-driven burst sequences and directly impacts cache line alignment efficiency in protocol processing applications.

Can CY7C1350G-133AXI operate with 2.5 V VDDQ while using 3.3 V VDD?

Yes - the device supports independent 3.3 V VDD (core) and 2.5 V VDDQ (I/O) supplies. This allows direct interfacing with 2.5 V FPGA I/O banks while maintaining full 133 MHz operation and 4.0 ns tCO, provided VDDQ stability and decoupling meet datasheet AC specifications (±3% tolerance, <100 mV ripple).

Is the CY7C1350G-133AXI pin-compatible with ZBT™ SRAMs?

Yes - it is explicitly designed to be pin-compatible and functionally equivalent to industry-standard ZBT™ devices (e.g., IDT 72V223, Integrated Device Technology), enabling drop-in replacement in existing ZBT™-based designs while adding NoBL™ latency advantages and enhanced power management features.