Infineon Technologies CY7C1350G-200AXC

Overview

CY7C1350G-200AXC from Infineon Technologies (formerly Cypress) is a 4-Mbit (128K × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 3.3 V core supply, 2.5 V/3.3 V I/O supply, delivers 2.8 ns clock-to-output delay at 200 MHz, supports linear/interleaved burst modes, and features byte-write capability with four independent write-enable signals (BWA–BWD).

For engineers reviewing the CY7C1350G-200AXC datasheet, CY7C1350G-200AXC pinout, CY7C1350G-200AXC application, or CY7C1350G-200AXC equivalent, key selection criteria include pipelined read/write timing, ZZ sleep mode implementation, burst address sequencing control via MODE pin, and compatibility with ZBT™-based system designs requiring zero wait-state transitions.

Technical Context

The device implements fully synchronous, rising-edge-triggered input registration and output registration, with all control signals (CE1/CE2/CE3, WE, BW[A:D], ADV/LD, CEN) sampled on CLK's rising edge. Its NoBL™ logic eliminates bus latency by enabling back-to-back read/write operations without wait states, supported by on-chip self-timed write circuitry and synchronous burst counter.

It supports two burst orders-linear or interleaved-selected by the MODE strap pin, and includes asynchronous OE for output tristating and asynchronous ZZ input for non-time-critical sleep mode (with internal pull-down and mandatory external grounding per errata). All DQ and DQP lines are bidirectional and synchronously registered.

Key Specifications

Pinout & Package

Available in Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and 119-ball BGA (14 × 22 × 2.4 mm) packages. Pin functions validated per Cypress document 38-05524 Rev. *S, including errata-driven grounding requirement for ZZ pin (Pin 64 in TQFP, Ball T7 in BGA).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with IDT72V2115L15PF and IS61WV102436B, CY7C1350G-200AXC provides superior throughput via 200 MHz operation and true NoBL™ pipelining, retains data integrity in low-power sleep mode, and offers finer-grained byte-write control essential for protocol-aware buffering.

Availability

CY7C1350G-200AXC is available at Aetrix Electronics and suitable for packet buffering in network switches, line card memory in telecom routers, frame assembly in media gateways, and PCIe endpoint buffering requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1350G-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader focused on power systems, automotive, industrial, and IoT applications, formed through the acquisition of Cypress Semiconductor in 2020.

CY7C1350G belongs to Infineon's legacy high-performance synchronous SRAM product line, originally developed by Cypress to address zero-latency memory needs in high-speed communications infrastructure and real-time embedded systems.

FAQ

What is the correct handling of the ZZ pin for CY7C1350G-200AXC?

The ZZ pin must be externally connected to ground (GND) in all operating conditions, per documented errata on page 19 of datasheet 38-05524 Rev. *S. Although internally pulled down, failure to tie ZZ to GND risks undefined sleep-mode behavior and potential data retention issues. This applies identically to both TQFP (Pin 64) and BGA (Ball T7) packages.

How does the MODE pin affect burst addressing behavior?

The MODE pin selects burst order: tied to GND enables linear burst (0,1,2,3), while tied to VDD or left floating enables interleaved burst (0,2,4,6). The burst counter uses A[1:0] as LSBs and wraps within the 128K address space. This setting is sampled at power-up and remains static until reset or power cycle.

Can CY7C1350G-200AXC operate with 2.5 V VDDQ while using 3.3 V VDD?

Yes - the device supports independent 3.3 V VDD (core) and 2.5 V VDDQ (I/O) supplies. This allows direct interfacing with 2.5 V FPGAs or ASICs while maintaining full 200 MHz performance and 2.8 ns tCO. VDDQ must be stable before VDD during power-up, and both supplies must meet respective voltage tolerance specs (±5% for VDD, ±10% for VDDQ).

Is the CY7C1350G-200AXC pin-compatible with ZBT™ devices?

Yes - it is explicitly designed as pin-compatible and functionally equivalent to industry-standard ZBT™ SRAMs (e.g., IDT ZBT series), sharing identical pinouts, signal definitions, and timing protocols. This enables drop-in replacement in existing ZBT-based designs without PCB or firmware changes, provided VDDQ voltage and ZZ grounding requirements are met.