Infineon Technologies CY7C1350G-200AXCT

Overview

CY7C1350G-200AXCT from Infineon Technologies (formerly Cypress) is a 4-Mbit (128K × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom infrastructure. It operates at 3.3 V core supply (VDD), 2.5/3.3 V I/O supply (VDDQ), delivers 2.8 ns clock-to-output delay at 200 MHz, supports linear/interleaved burst modes, and features byte-write capability with four independent write-enable signals (BWA–BWD).

For engineers reviewing the CY7C1350G-200AXCT datasheet, CY7C1350G-200AXCT pinout, CY7C1350G-200AXCT application, or CY7C1350G-200AXCT equivalent, key selection criteria include its NoBL™ zero-wait-state back-to-back read/write performance, synchronous self-timed writes, ZZ sleep mode, 100-pin TQFP package compatibility, and support for depth expansion via three chip enables (CE1/CE2/CE3).

Technical Context

The CY7C1350G-200AXCT implements a fully synchronous, pipelined memory interface where all inputs (address, control, data) are registered on the rising edge of CLK, and all outputs are registered on the same edge. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write operations without wait states, supported by internal burst counters and ADV/LD-controlled address loading.

It uses dual power domains (VDD = 3.3 V for core logic, VDDQ = 2.5/3.3 V for I/O), includes asynchronous OE for output tristate control, and provides a dedicated ZZ input for non-time-critical sleep mode with data retention - requiring external grounding per errata. The MODE pin selects linear or interleaved burst order.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), lead-free, RoHS-compliant. Pinout validated per Cypress document 38-05524 Rev. *S (April 2019), including errata requiring ZZ (Pin 64) to be externally grounded.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with IDT72V2115L15PF and IS61WV102436B, the CY7C1350G-200AXCT uniquely delivers 2.8 ns tCO with true NoBL™ back-to-back operation and configurable burst order - critical for latency-constrained telecom and test equipment designs where every nanosecond impacts system-level throughput.

Availability

CY7C1350G-200AXCT is available at Aetrix Electronics and suitable for packet buffering in network switches, line card memory in telecom routers, backplane interface buffering, and high-speed test equipment requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1350G-200AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains the full legacy product portfolio, including high-performance SRAMs developed under the Cypress brand.

The CY7C1350G belongs to Cypress' NoBL™ SRAM product line, engineered specifically for zero-latency, high-frequency memory subsystems in networking, telecom, and test instrumentation where deterministic burst performance is mandatory.

FAQ

What is the required connection for the ZZ pin on CY7C1350G-200AXCT?

The ZZ pin (Pin 64 in TQFP) must be externally connected to ground per documented errata on page 19 of datasheet 38-05524 Rev. *S. Although internally pulled down, grounding ensures reliable entry into and exit from sleep mode and prevents spurious wake-up events during voltage transients.

How does the ADV/LD pin function during burst operations?

ADV/LD controls whether the internal burst counter advances (HIGH) or loads a new base address (LOW). During burst reads/writes, it must remain HIGH to increment the counter; it must be driven LOW after device deselection to latch the next starting address for subsequent access.

Can CY7C1350G-200AXCT operate with mixed VDDQ voltages on the same device?

No - VDDQ is a single I/O supply rail. All DQ and DQP pins share the same VDDQ voltage, which must be set to either 2.5 V or 3.3 V (not both simultaneously). The device supports interface to either logic family, but not mixed-voltage signaling on one part.

Is the CY7C1350G-200AXCT pin-compatible with ZBT™ SRAMs?

Yes - the datasheet explicitly states pin compatibility and functional equivalence with industry-standard ZBT™ devices (e.g., IDT72V2115), enabling drop-in replacement in existing ZBT-based designs without PCB redesign or firmware changes.