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Infineon Technologies CY7C1352B-133AC
- Part No.:
- CY7C1352B-133AC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1352B-133AC.pdf
- Description:
- IC SRAM 4.5MBIT 133MHZ 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,085
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Product details
Overview
CY7C1352B-133AC from Cypress Semiconductor is a 3.3V, 256K × 18 synchronous pipelined SRAM with NoBL™ architecture, supporting true back-to-back read/write operations at 133 MHz with zero wait states. It features 4.2 ns clock-to-output delay, byte-write capability via BWS[1:0], and JEDEC-standard 100-pin TQFP packaging. Used in high-throughput memory subsystems of network switches and telecom line cards where deterministic latency and burst efficiency are critical.
For engineers reviewing the CY7C1352B-133AC datasheet, CY7C1352B-133AC pinout, CY7C1352B-133AC application, or CY7C1352B-133AC equivalent, this page delivers verified timing parameters, validated pin functions, confirmed burst behavior (linear/interleaved), real-world use cases in packet buffering, and functionally matched alternatives for seamless migration from ZBT-compatible designs.
Technical Context
The CY7C1352B-133AC implements fully registered synchronous I/O with rising-edge clock sampling for all control, address, and data signals. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write transfers on every clock cycle without external OE management.
Burst operation is controlled by ADV/LD and MODE pins, supporting both linear and interleaved sequences up to four words per burst. Write cycles use on-chip self-timed logic, and byte writes are enabled via BWS[1:0] with independent control of DQ[7:0]/DP0 and DQ[15:8]/DP1 - preserving unselected bytes during partial writes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 18 (4.5 Mbit), common I/O architecture with parity lines DP[1:0] |
| Max Clock Frequency | 133 MHz - enables sustained 133 MT/s throughput with no wait states |
| tCO (Clock-to-Output) | 4.2 ns - guarantees data valid within 4.2 ns after rising clock edge, critical for tight setup timing |
| Supply Voltage | 3.3 V ± 0.3 V - single-supply operation compatible with LVTTL and SSTL-2 interfaces |
| Burst Capability | Linear or interleaved 4-word burst - reduces address bus toggling and improves bandwidth efficiency |
| Byte Write Control | BWS[1:0] + WE - allows selective write to DQ[7:0]/DP0, DQ[15:8]/DP1, or full 18-bit word |
| Standby Current | 5 mA (commercial temp) - low-power retention mode for power-sensitive systems |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), 14 mm × 14 mm, 0.5 mm pitch, JEDEC standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Rising-edge sampled; qualified by CEN - defines all timing boundaries for register capture and output release |
| A[17:0] | Synchronous address inputs | 18-bit address latched on CLK rise; supports 262,144 locations (256K) |
| DQ[15:0], DP[1:0] | Bidirectional data/parity I/O | Common I/O with automatic three-state during write data phase - prevents bus contention without OE coordination |
| BWS[1:0], WE | Byte write control | WE active-low + BWS[1:0] selects DQ[7:0]/DP0, DQ[15:8]/DP1, or full 18-bit write - enables atomic Read-Modify-Write |
| CE1, CE2, CE3 | Synchronous chip enables | Three-input decode (CE1=L, CE2=H, CE3=L) required for access - supports depth expansion with bank selection |
| ADV/LD, MODE | Burst control | ADV/LD=H advances internal counter; MODE=H selects interleaved burst order - determines sequential address generation |
| OE | Asynchronous output enable | Active-low; masked during write data phase - ensures safe bidirectional I/O switching without external timing constraints |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) architecture | Enables guaranteed back-to-back read/write transitions on every clock - eliminates pipeline stalls in burst-intensive traffic |
| Fully registered I/O path | All inputs and outputs synchronized to CLK rising edge - simplifies PCB layout and timing closure in high-speed designs |
| Synchronous self-timed writes | On-chip write sequencing removes external write pulse width constraints - reduces controller logic complexity |
| Configurable burst order | MODE pin selects linear or interleaved 4-word burst - matches legacy cache line or DRAM controller addressing patterns |
| Low-latency clock-to-output | 4.2 ns tCO at 133 MHz - meets sub-7.5 ns setup window for 133 MHz system clocks with margin |
Applications
| Packet Buffering in Switch ASICs | Line Card Memory Subsystem |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switch fabric ASICs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer with deterministic 4.2 ns read response. Use Value: Enables zero-wait-state header lookups and parallel write/read during packet classification, increasing forwarding rate by >15% vs. asynchronous SRAM. |
Use Scenario: Serving as shared memory between DSPs and FPGA-based traffic managers on telecom line cards. IC Role / Device Role / Timing Role: Pipelined Burst SRAM providing synchronized 133 MT/s data exchange between heterogeneous processors. Use Value: Eliminates handshake overhead between DSP and FPGA, allowing continuous data streaming without interlock cycles. |
| Backplane Interface Controller Cache | Protocol Accelerator Look-up Table |
|
Use Scenario: Acting as descriptor cache for PCI Express or RapidIO backplane interface controllers handling DMA bursts. IC Role / Device Role / Timing Role: Burst-capable SRAM storing scatter-gather descriptors with linear burst alignment to PCIe TLP sizes. Use Value: Reduces descriptor fetch latency by 3.8 ns per access, improving DMA engine utilization and reducing CPU intervention. |
Use Scenario: Hosting TCP/IP or MPLS label look-up tables in hardware-accelerated protocol engines. IC Role / Device Role / Timing Role: Synchronous SRAM delivering match results within one clock cycle of address assertion for wire-speed processing. Use Value: Supports 133 million look-ups/sec with consistent 4.2 ns latency - meets OC-192 line-rate requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCM63Z819 | Pin/functionally identical ZBT SRAM; same 256K×18 organization, 133 MHz speed grade, and 100-pin TQFP package | Legacy IDT part with identical timing but discontinued production status and limited long-term availability | Select when maintaining legacy board compatibility with existing ZBT footprint and timing margins |
| MT55L256L18P | Same 256K×18, 133 MHz spec; identical NoBL™-equivalent architecture but different burst counter reset behavior on CE deassertion | Used in older Motorola/Freescale baseband platforms; requires validation of ADV/LD recovery timing after deselect | Prefer for cost-sensitive designs where MT55L256L18P remains in active production and meets CE recovery timing budget |
Compared with MCM63Z819 and MT55L256L18P, the CY7C1352B-133AC offers superior lifecycle support, documented NoBL™ latency guarantees, and tighter tCO specification (4.2 ns vs. 4.5 ns typical for alternatives), making it the recommended choice for new designs requiring long-term supply assurance and deterministic timing.
Availability
CY7C1352B-133AC is available at Aetrix Electronics and suitable for packet buffering in network switches, line card memory subsystems, backplane interface controllers, and protocol accelerator look-up tables requiring stable component supply across extended product lifecycles.
Supply support for CY7C1352B-133AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic devices.
The CY7C1352B belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, burst-oriented memory subsystems in networking, telecom, and high-speed data acquisition systems.
FAQ
What is the exact tCO value for CY7C1352B-133AC at 133 MHz?
The guaranteed maximum clock-to-output delay (tCO) for CY7C1352B-133AC is 4.2 ns, measured from the rising edge of CLK to valid data on DQ[15:0]/DP[1:0] under commercial temperature conditions with VDD = 3.3 V. This value is specified in the device's preliminary datasheet revision dated May 26, 2000, and applies to all 133-MHz speed-binned units.
Does CY7C1352B-133AC support both linear and interleaved burst modes?
Yes - burst order is selected by the MODE pin: tied HIGH for interleaved burst (e.g., addresses 0x00, 0x02, 0x01, 0x03), pulled LOW for linear burst (e.g., addresses 0x00, 0x01, 0x02, 0x03). The MODE pin must remain static during operation; floating defaults to HIGH (interleaved).
How does byte write functionality work on CY7C1352B-133AC?
Byte write is controlled by BWS[1:0] and WE: BWS0 enables DQ[7:0]/DP0, BWS1 enables DQ[15:8]/DP1. With WE=LOW, asserting BWS[1:0] = 01 writes only DQ[7:0]/DP0; 10 writes only DQ[15:8]/DP1; 00 writes all 18 bits. Unselected bytes retain prior contents - enabling efficient Read-Modify-Write without full-word reread.
Is CY7C1352B-133AC pin-compatible with ZBT SRAMs?
Yes - CY7C1352B-133AC is pin- and functionally compatible with ZBT SRAMs MCM63Z819 and MT55L256L18P, sharing identical 100-pin TQFP footprint, signal naming, and timing behavior. However, its NoBL™ architecture provides stricter tCO guarantees and simplified OE handling compared to classic ZBT implementations.
CY7C1352B-133AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1352B-133AC FAQ
1.How can I place an order for CY7C1352B-133AC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1352B-133AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1352B-133AC reliable?
The price and inventory of CY7C1352B-133AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1352B-133AC is usually 5 days.
3.What payment methods are accepted for CY7C1352B-133AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1352B-133AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1352B-133AC?
CY7C1352B-133AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1352B-133AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1352B-133AC?
For technical support, including CY7C1352B-133AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1352B-133AC requirements.
6.How does Aetrix verify that CY7C1352B-133AC is sourced from the original manufacturer or authorized distributors?
All CY7C1352B-133AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1352B-133AC meets industry standards.
7.What is the process for return or replacement of CY7C1352B-133AC?
All CY7C1352B-133AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1352B-133AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1352B-133AC part is unused and in its original packaging.
Return procedure for CY7C1352B-133AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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