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Infineon Technologies CY7C1352G-133AXC

Part No.:
CY7C1352G-133AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1352G-133AXC.pdf
Description:
IC SRAM 4.5MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:144

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Product details

Overview

CY7C1352G-133AXC from Cypress Semiconductor is a 4-Mbit (256K × 18) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems requiring zero wait-state back-to-back read/write operations. It operates at 133 MHz with 4.0 ns clock-to-output delay, supports 3.3 V core and 2.5/3.3 V I/O supplies, and features byte write capability, linear/interleaved burst modes, and ZZ sleep mode - deployed in network packet buffers and FPGA co-processor caches.

For engineers reviewing the CY7C1352G-133AXC datasheet, CY7C1352G-133AXC pinout, CY7C1352G-133AXC application, or CY7C1352G-133AXC equivalent, key selection considerations include its 100-pin TQFP package, synchronous self-timed writes, CEN-controlled clock gating, ADV/LD-driven burst addressing, and mandatory external grounding of Pin 64 (ZZ) per errata.

Technical Context

The CY7C1352G-133AXC implements a fully pipelined synchronous interface where all inputs (address, BW[A:B], WE, CE1–CE3, ADV/LD, CEN) are registered on the rising CLK edge, and all outputs (DQs, DQP[A:B]) are edge-aligned via output registers. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without inter-cycle gaps.

Burst operation is controlled by the MODE strap (linear vs. interleaved), A0/A1-fed internal 2-bit counter, and ADV/LD signal - which loads new addresses when LOW and advances the counter when HIGH. Write sequencing uses on-chip self-timed control, with OE masked during write data capture to prevent bus contention.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 Mbit (256K × 18 bits), supporting 18-bit wide data paths without external multiplexing.
Max Clock Frequency 133 MHz - enables 133 million full-cycle operations per second in pipelined mode.
Access Time (tCO) 4.0 ns - guaranteed maximum delay from CLK rise to valid DQ output, critical for timing closure in high-speed interfaces.
VDD / VDDQ 3.3 V core supply (VDD); 2.5 V or 3.3 V I/O supply (VDDQ) - allows interoperability with both 2.5 V and 3.3 V logic families.
Burst Capability Linear or interleaved 4-word bursts - reduces address bus traffic and simplifies controller design for sequential access patterns.
Byte Write Control BW[A:B] + WE enable independent write enable for two 9-bit subwords - permits partial-word updates without read-modify-write overhead.
ZZ Sleep Mode Asynchronous active-HIGH ZZ input places device in low-power state (40 mA standby) while preserving data integrity - requires external ground connection per errata.

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), 14 mm × 20 mm × 1.4 mm body, lead-free (Pb-free) compliant.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Input 18-bit synchronous address bus; A0/A1 drive internal 2-bit burst counter for sequential accesses.
BWA, BWB Byte Write Select Active-LOW synchronous controls for 9-bit subword writes - enables granular memory updates without full-word overwrites.
CLK, CEN Clock & Enable Rising-edge-triggered clock qualified by CEN; deasserting CEN extends previous cycle without losing state or requiring re-synchronization.
CE1, CE2, CE3 Chip Enable Three synchronous enables (CE1/CE3 active-LOW, CE2 active-HIGH) allow flexible bank decoding and depth expansion with minimal glue logic.
ADV/LD Burst Address Control Drives burst counter advancement (HIGH) or new address loading (LOW); must be LOW after deselect to prepare for next access.
DQ0–DQ17, DQPA, DQPB Data I/O 18-bit bidirectional data bus + 2 parity bits; tri-stated synchronously during write data capture regardless of OE state to prevent bus contention.
OE Output Enable Asynchronous active-LOW control - overrides internal logic to force DQ/DQP into high-impedance, but masked during write data sampling.
ZZ (Pin 64) Sleep Control Asynchronous active-HIGH sleep input; per errata, must be externally grounded (not floating) to ensure reliable operation and data retention.

Key Features

Feature Design Value
NoBL™ Architecture Enables true back-to-back read/write operations with no wait states - increases effective bandwidth by up to 100% versus conventional synchronous SRAMs.
Self-Timed Output Buffer Control Eliminates need for external OE timing management - output register alignment removes setup/hold constraints on OE relative to CLK.
Synchronous Byte Write Independent control of two 9-bit subwords via BW[A:B] - avoids full-word writes and reduces power consumption in partial-update scenarios.
Configurable Burst Order MODE pin selects linear (A[1:0] increment) or interleaved (bit-reversed A[1:0]) burst sequence - matches CPU/FPGA cache line access patterns.
ZZ Sleep Mode with Data Retention Reduces standby current to 40 mA while maintaining memory contents - supports low-power idle states in telecom and embedded systems.

Applications

Network Packet Buffer FPGA Co-Processor Cache

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly with MAC controllers and switch fabric.

Use Value: 4.0 ns tCO and pipelined writes enable real-time frame buffering at 10 Gbps line rates without stall cycles.

Use Scenario: Acting as instruction/data scratchpad between FPGA fabric and soft-core processors (e.g., MicroBlaze).

IC Role / Device Role / Timing Role: Synchronous dual-port-like memory resource with burst support for tight-loop DSP or control code execution.

Use Value: Linear burst mode aligns with FPGA cache line fetches, reducing address bus toggling and improving energy efficiency per instruction.

Telecom Line Card Memory Industrial Motion Controller Buffer

Use Scenario: Holding time-division multiplexed (TDM) voice channel samples in base station line cards.

IC Role / Device Role / Timing Role: Deterministic-access memory for cyclic data streaming with strict jitter tolerance.

Use Value: CEN-gated clock and ZZ sleep support precise power-gating between TDM frames while maintaining sample integrity.

Use Scenario: Buffering position feedback and motion command streams in servo drive modules.

IC Role / Device Role / Timing Role: Real-time deterministic memory for closed-loop control algorithms requiring sub-microsecond memory access.

Use Value: Self-timed writes eliminate OE timing margins, enabling robust operation across temperature and voltage variations in factory environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V251L133PF Same 256K × 18 density and 133 MHz speed, but uses ZBT™ architecture; requires explicit OE control and lacks ZZ sleep mode. No integrated sleep mode; higher standby current (65 mA vs. 40 mA); requires external OE timing coordination. Select when legacy ZBT™ compatibility or existing board layout reuse is required - not drop-in due to OE timing and power differences.
ISSI IS61WV25618BLL-133TQLI Pin-compatible 256K × 18 NoBL™ SRAM; identical 4.0 ns tCO and 100-pin TQFP, but supports only 3.3 V I/O (no 2.5 V VDDQ option). Limited to 3.3 V I/O ecosystems; lacks NC/36M–NC/288M address expansion pins found on CY7C1352G. Choose for cost-sensitive designs where 2.5 V I/O interoperability is unnecessary and long-term ISSI supply assurance is preferred.

Compared with IDT72V251L133PF and IS61WV25618BLL-133TQLI, the CY7C1352G-133AXC uniquely combines ZZ sleep mode, dual-voltage I/O support, and errata-managed burst control - making it optimal for thermally constrained, multi-voltage, or power-cycled systems requiring guaranteed data retention.

Availability

CY7C1352G-133AXC is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, and telecom line card memory applications requiring stable component supply, long-lifecycle support, and Pb-free compliance.

Supply support for CY7C1352G-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.

The CY7C1352G belongs to Cypress's NoBL™ SRAM product line, engineered specifically to replace asynchronous and ZBT™ SRAMs in bandwidth-constrained systems where deterministic, wait-state-free memory access is essential.

FAQ

What is the correct handling for the ZZ pin on CY7C1352G-133AXC?

The ZZ pin (Pin 64) must be externally connected to ground, not left floating, as specified in the device errata (Document 38-05514 Rev. *O, page 19). Although the pin has an internal pull-down, failure to ground it externally may cause unreliable entry into or exit from sleep mode, risking data corruption during low-power transitions.

Does CY7C1352G-133AXC require an external output enable (OE) signal for normal read operation?

No - the CY7C1352G-133AXC uses internally self-timed output buffer control, eliminating dependency on OE for basic read timing. OE remains functional as an asynchronous override for tri-stating outputs, but it is masked during write data capture and first-clock post-deselect to prevent bus conflicts.

How does burst addressing work with ADV/LD and MODE pins?

When ADV/LD is HIGH, the internal 2-bit burst counter increments on each clock (regardless of CE state); when LOW, a new address is latched. MODE pin selects burst order: grounded for linear (0→1→2→3), tied to VDD for interleaved (0→2→1→3). Both modes wrap automatically using A0/A1.

Can CY7C1352G-133AXC operate with 2.5 V VDDQ while using 3.3 V VDD?

Yes - the device supports independent 3.3 V core supply (VDD) and 2.5 V or 3.3 V I/O supply (VDDQ), enabling direct interfacing with 2.5 V FPGAs or ASICs while maintaining full 133 MHz performance and 4.0 ns tCO, as verified in the Electrical Characteristics table (page 11 of datasheet 38-05514).

CY7C1352G-133AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1352G-133AXC FAQ

1.How can I place an order for CY7C1352G-133AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1352G-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1352G-133AXC reliable?

The price and inventory of CY7C1352G-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1352G-133AXC is usually 5 days.

3.What payment methods are accepted for CY7C1352G-133AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1352G-133AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1352G-133AXC?

CY7C1352G-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1352G-133AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1352G-133AXC?

For technical support, including CY7C1352G-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1352G-133AXC requirements.

6.How does Aetrix verify that CY7C1352G-133AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1352G-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1352G-133AXC meets industry standards.

7.What is the process for return or replacement of CY7C1352G-133AXC?

All CY7C1352G-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1352G-133AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1352G-133AXC part is unused and in its original packaging.

Return procedure for CY7C1352G-133AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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