Infineon Technologies CY7C1352G-133AXCT

Overview

CY7C1352G-133AXCT from Cypress Semiconductor is a 4-Mbit (256K × 18) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput back-to-back read/write operations in networking and telecom data-path buffers. It operates on a single 3.3V core supply with 2.5V/3.3V I/O compatibility, supports linear or interleaved burst modes, and delivers 4.0 ns clock-to-output delay at 133 MHz.

For engineers reviewing the CY7C1352G-133AXCT datasheet, CY7C1352G-133AXCT pinout, CY7C1352G-133AXCT application, or CY7C1352G-133AXCT equivalent, this device serves as a low-latency, byte-write-capable burst SRAM for systems requiring deterministic timing, zero-wait-state memory access, and synchronous self-timed writes without external OE control.

Technical Context

The CY7C1352G-133AXCT implements a fully synchronous, pipelined architecture where all inputs-including address, BW[A:B], WE, CE1–CE3, ADV/LD, and CEN-are registered on the rising edge of CLK. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write transfers on every clock cycle without wait states.

It features three synchronous chip enables (CE1 active-low, CE2 active-high, CE3 active-low), asynchronous OE and ZZ controls, on-chip burst counter (2-bit, configurable via MODE pin), and synchronous self-timed write circuitry that latches data on the second clock edge after write initiation. Output drivers are synchronously tri-stated during write data capture regardless of OE state.

Key Specifications

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), lead-free, body size 14 mm × 14 mm, pitch 0.5 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with IDT72V2115L133PF and IS61WV25618BLL-133TQLI, the CY7C1352G-133AXCT uniquely combines NoBL™ zero-wait-state operation, hardware-configurable burst mode, and asynchronous sleep - making it optimal for latency-constrained, power-aware burst memory applications where controller simplicity and timing predictability are critical.

Availability

CY7C1352G-133AXCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and baseband processor cache applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for CY7C1352G-133AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C1352G belongs to Cypress's NoBL™ SRAM product line, engineered specifically to replace asynchronous and ZBT SRAMs in systems demanding deterministic, zero-latency burst memory access with simplified timing closure and reduced controller complexity.

FAQ

What is the function of the MODE pin on CY7C1352G-133AXCT?

The MODE pin is a hardware strap that selects burst address sequencing: tied to GND enables linear burst (00→01→10→11), while tied to VDD or left floating enables interleaved burst (00→01→11→10). It requires no register programming or initialization sequence, and its state is sampled at power-up or reset - making burst behavior fixed and predictable across power cycles.

How does the CY7C1352G-133AXCT handle output tri-state during write operations?

During the data portion of any write cycle - whether single or burst - the DQ and DQP outputs are automatically tri-stated by internal logic, regardless of OE state. This prevents bus contention and eliminates the need for external OE timing coordination. OE only governs output driver state during read cycles and idle periods.

Can CY7C1352G-133AXCT operate with 2.5V I/O while using 3.3V core supply?

Yes. The device supports mixed-voltage operation: VDD = 3.3V ±0.3V powers the core logic, while VDDQ = 2.5V supplies the I/O buffers. This allows direct interfacing with 2.5V FPGAs or ASICs without level shifters, and the I/O pins are 3.3V-tolerant when VDDQ = 2.5V, ensuring robust signal integrity.

What happens to pending operations when the ZZ pin is asserted?

Asserting ZZ (HIGH) forces immediate entry into sleep mode after two clock cycles, but any access initiated before ZZ assertion is not completed nor guaranteed. The device must be fully deselected (all CEs inactive) before ZZ activation; otherwise, data corruption or undefined behavior may occur. Recovery requires ZZ deassertion followed by tZZREC (≥20 ns) before re-enabling CEs.