Infineon Technologies CY7C1353F-100AC
- Part No.:
- CY7C1353F-100AC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1353F-100AC.pdf
- Description:
- IC SRAM 4.5MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,635
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Product details
Overview
CY7C1353F-100AC from Cypress Semiconductor is a 4-Mb (256K × 18) synchronous flow-through SRAM with NoBL™ architecture, designed for zero-wait-state back-to-back read/write operations in high-throughput memory subsystems. It operates at 100 MHz with 8.0 ns clock-to-output delay, supports 2.5V/3.3V I/O, and features byte write capability, linear/interleaved burst modes, and JEDEC-standard 100-pin TQFP packaging. Used in network packet buffers and telecom line cards requiring deterministic latency.
For engineers reviewing the CY7C1353F-100AC datasheet, CY7C1353F-100AC pinout, CY7C1353F-100AC application, or CY7C1353F-100AC equivalent, key selection criteria include burst order control via MODE pin, synchronous self-timed write timing, CEN-gated clock qualification, and ZZ sleep mode entry/exit timing compliance.
Technical Context
The CY7C1353F-100AC implements a synchronous flow-through architecture where all inputs (address, WE, BW[A:B], CE1–CE3, ADV/LD) are registered on the rising edge of CLK, qualified by CEN. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write transfers on every clock cycle without wait states.
Burst operation relies on an internal two-bit counter driven by A[1:0] and ADV/LD, with burst order (linear or interleaved) selected by the MODE pin. Write operations use synchronous self-timed circuitry, while OE remains asynchronous and masked during write data capture to prevent bus contention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mb (256K × 18 common I/O configuration) |
| Max Clock Frequency | 100 MHz - defines maximum sustained burst throughput without throttling |
| Access Time (tCDV) | 8.0 ns - clock-to-output delay under 100-MHz operation, critical for timing closure |
| I/O Voltage Support | 2.5V / 3.3V - enables interoperability with mixed-voltage ASIC/FPGA interfaces |
| Burst Capability | Linear or interleaved 4-word burst - reduces address bus toggling and improves bandwidth efficiency |
| Power Management | ZZ sleep mode with 40 mA standby current - preserves data integrity while reducing system power |
| Package | 100-pin TQFP (14 × 14 mm, 0.5 mm pitch) - JEDEC-compliant, surface-mount compatible with standard reflow profiles |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), 14 mm × 14 mm body, 0.5 mm lead pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[0:17] | Synchronous Address Input | Latched on rising CLK edge; A[1:0] drive internal burst counter for sequential access |
| BW[A:B] | Synchronous Byte Write Select | Active-low signals qualifying byte lanes during write; enable partial-word updates without read-modify-write overhead |
| WE | Synchronous Write Enable | Active-low signal latched with CLK; initiates self-timed write sequence when CE1–CE3 active |
| CE1, CE2, CE3 | Synchronous Chip Enables | Three-input decode (CE1=L, CE2=H, CE3=L) selects device; enables depth expansion with banked memory systems |
| OE | Asynchronous Output Enable | Active-low; controls I/O direction but is masked during write data capture to enforce automatic three-state |
| CEN | Synchronous Clock Enable | Active-low gate for CLK; suspends internal state progression without deselection, extending previous cycle |
| ADV/LD | Synchronous Advance/Load | Drives burst counter (HIGH) or loads new base address (LOW); must be LOW after deselect to prepare next access |
| MODE | Strap Pin | Configures burst order: GND = linear, VDD/floating = interleaved - sets address sequence for burst reads/writes |
| ZZ | Asynchronous Sleep Control | Active-high entry into low-power snooze mode; requires 2 clock cycles to enter/exit; preserves data integrity |
| DQs / DQP[A:B] | Synchronous Bidirectional I/O | 18 data + 2 parity lines; common I/O architecture; automatically three-stated during write data phase regardless of OE |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) Architecture | Enables true back-to-back read/write transitions with zero wait states, maximizing effective bandwidth in burst-intensive applications |
| Synchronous Self-Timed Writes | Eliminates external write pulse timing constraints; internal logic completes write within one clock cycle after data latch |
| Byte Write Capability | Independent BW[A:B] control allows selective update of 9-bit subwords (A or B byte), reducing bus traffic and simplifying cache-line writes |
| Configurable Burst Order | MODE pin selects linear (sequential) or interleaved (cache-friendly) addressing, matching host processor burst patterns |
| Integrated Sleep Mode (ZZ) | Reduces standby current to 40 mA while maintaining data retention; entry/exit controlled asynchronously without clock dependency |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with strict latency budgets. IC Role / Device Role / Timing Role: Flow-through SRAM acting as first-in-first-out (FIFO) buffer between MAC and switching fabric, synchronized to 100-MHz system clock. Use Value: 8.0 ns tCDV and zero-wait-state burst reads ensure frame header inspection and forwarding decisions meet sub-100 ns deadlines. |
Use Scenario: Holding ATM cell payloads and control headers in OC-48/STM-16 line interface units. IC Role / Device Role / Timing Role: Dual-port-accessible memory block supporting simultaneous ingress/egress DMA channels with burst-aligned transfers. Use Value: Linear burst mode aligns with ATM cell payload size (48 bytes), delivering full cell in four 18-bit cycles without address reissue. |
| Baseband Processor Cache | Radar Signal Processing Buffer |
|
Use Scenario: Serving as instruction/data scratchpad for DSP cores in 3G/4G baseband chipsets operating at 100 MHz. IC Role / Device Role / Timing Role: Low-latency, high-bandwidth memory extension adjacent to tightly coupled memory controllers. Use Value: Byte write capability enables efficient single-instruction updates to firmware tables without full-word overwrites or bus arbitration delays. |
Use Scenario: Capturing and staging digitized RF samples in pulsed-Doppler radar front-ends before FFT processing. IC Role / Device Role / Timing Role: Synchronous burst SRAM interfacing directly to ADC output and FPGA-based FFT engine clocked at 100 MHz. Use Value: ZZ sleep mode reduces average power during inter-pulse intervals while preserving sampled data integrity across microsecond-scale idle periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L10PF | 256K × 18, 100 MHz, 8.5 ns tAA; uses QDR-II interface with separate read/write ports | Requires dual-clock domain handling and lacks MODE-configurable burst order | Select when true simultaneous read/write is required and system supports QDR-II signaling |
| ISSI IS61WV25618BLL-10TLI | 256K × 18, 100 MHz, 10 ns tAA; no ZZ sleep mode; only linear burst support | Lower standby current (25 mA) but no power-gating option for intermittent operation | Select for cost-sensitive industrial control where sleep mode is unnecessary and timing margin >2 ns exists |
Compared with IDT72V2115L10PF and IS61WV25618BLL-10TLI, the CY7C1353F-100AC uniquely combines NoBL™ zero-latency operation, configurable burst order, and ZZ sleep mode-making it optimal for latency-critical, power-aware telecom and networking designs where deterministic timing and flexible burst alignment are mandatory.
Availability
CY7C1353F-100AC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and baseband processor cache applications requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.
Supply support for CY7C1353F-100AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC, and USB solutions for industrial, automotive, and communications markets.
The CY7C1353F belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-wait-state, high-frequency memory subsystems in networking infrastructure and real-time signal processing equipment.
FAQ
What is the function of the MODE pin on CY7C1353F-100AC?
The MODE pin selects burst address sequence: tied to GND for linear burst (00→01→10→11), or to VDD/floating for interleaved burst (00→01→10→11 becomes 00→01→10→11 → 01→00→11→10). This matches host processor burst patterns-linear for sequential streaming, interleaved for cache line access-and is sampled only at power-up or reset, not dynamically.
How does the ZZ sleep mode affect timing behavior during wake-up?
Asserting ZZ HIGH places the device in snooze mode after two clock cycles; deasserting ZZ LOW requires two additional clock cycles (tZZREC) before normal operation resumes. During this recovery window, CE1–CE3 must remain inactive, and no valid accesses are guaranteed-designs must insert idle cycles or use CEN gating to synchronize wake-up with system timing.
Can CY7C1353F-100AC perform byte writes during burst operations?
Yes-BW[A:B] signals are sampled each clock cycle during burst writes, allowing independent byte lane control per word. For example, asserting BW[A] only writes the upper 9 bits (DQPA/DQA group) while preserving lower 9 bits (DQPB/DQB group), enabling precise cache-line updates without full-word overwrites or external read-modify-write logic.
Why is OE masked during the data portion of a write cycle?
OE is masked to guarantee automatic three-state of DQs/DQP[A:B] during write data capture-preventing bus contention even if OE is accidentally asserted LOW. This hardware-enforced behavior ensures external drivers can safely present write data without requiring precise OE timing coordination, simplifying PCB layout and timing closure in high-speed systems.
CY7C1353F-100AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1353F-100AC FAQ
1.How can I place an order for CY7C1353F-100AC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1353F-100AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1353F-100AC reliable?
The price and inventory of CY7C1353F-100AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1353F-100AC is usually 5 days.
3.What payment methods are accepted for CY7C1353F-100AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1353F-100AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1353F-100AC?
CY7C1353F-100AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1353F-100AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1353F-100AC?
For technical support, including CY7C1353F-100AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1353F-100AC requirements.
6.How does Aetrix verify that CY7C1353F-100AC is sourced from the original manufacturer or authorized distributors?
All CY7C1353F-100AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1353F-100AC meets industry standards.
7.What is the process for return or replacement of CY7C1353F-100AC?
All CY7C1353F-100AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1353F-100AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1353F-100AC part is unused and in its original packaging.
Return procedure for CY7C1353F-100AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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