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Infineon Technologies CY7C1353F-100AC

Part No.:
CY7C1353F-100AC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1353F-100AC.pdf
Description:
IC SRAM 4.5MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,635

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Product details

Overview

CY7C1353F-100AC from Cypress Semiconductor is a 4-Mb (256K × 18) synchronous flow-through SRAM with NoBL™ architecture, designed for zero-wait-state back-to-back read/write operations in high-throughput memory subsystems. It operates at 100 MHz with 8.0 ns clock-to-output delay, supports 2.5V/3.3V I/O, and features byte write capability, linear/interleaved burst modes, and JEDEC-standard 100-pin TQFP packaging. Used in network packet buffers and telecom line cards requiring deterministic latency.

For engineers reviewing the CY7C1353F-100AC datasheet, CY7C1353F-100AC pinout, CY7C1353F-100AC application, or CY7C1353F-100AC equivalent, key selection criteria include burst order control via MODE pin, synchronous self-timed write timing, CEN-gated clock qualification, and ZZ sleep mode entry/exit timing compliance.

Technical Context

The CY7C1353F-100AC implements a synchronous flow-through architecture where all inputs (address, WE, BW[A:B], CE1–CE3, ADV/LD) are registered on the rising edge of CLK, qualified by CEN. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write transfers on every clock cycle without wait states.

Burst operation relies on an internal two-bit counter driven by A[1:0] and ADV/LD, with burst order (linear or interleaved) selected by the MODE pin. Write operations use synchronous self-timed circuitry, while OE remains asynchronous and masked during write data capture to prevent bus contention.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 Mb (256K × 18 common I/O configuration)
Max Clock Frequency 100 MHz - defines maximum sustained burst throughput without throttling
Access Time (tCDV) 8.0 ns - clock-to-output delay under 100-MHz operation, critical for timing closure
I/O Voltage Support 2.5V / 3.3V - enables interoperability with mixed-voltage ASIC/FPGA interfaces
Burst Capability Linear or interleaved 4-word burst - reduces address bus toggling and improves bandwidth efficiency
Power Management ZZ sleep mode with 40 mA standby current - preserves data integrity while reducing system power
Package 100-pin TQFP (14 × 14 mm, 0.5 mm pitch) - JEDEC-compliant, surface-mount compatible with standard reflow profiles

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), 14 mm × 14 mm body, 0.5 mm lead pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A[0:17] Synchronous Address Input Latched on rising CLK edge; A[1:0] drive internal burst counter for sequential access
BW[A:B] Synchronous Byte Write Select Active-low signals qualifying byte lanes during write; enable partial-word updates without read-modify-write overhead
WE Synchronous Write Enable Active-low signal latched with CLK; initiates self-timed write sequence when CE1–CE3 active
CE1, CE2, CE3 Synchronous Chip Enables Three-input decode (CE1=L, CE2=H, CE3=L) selects device; enables depth expansion with banked memory systems
OE Asynchronous Output Enable Active-low; controls I/O direction but is masked during write data capture to enforce automatic three-state
CEN Synchronous Clock Enable Active-low gate for CLK; suspends internal state progression without deselection, extending previous cycle
ADV/LD Synchronous Advance/Load Drives burst counter (HIGH) or loads new base address (LOW); must be LOW after deselect to prepare next access
MODE Strap Pin Configures burst order: GND = linear, VDD/floating = interleaved - sets address sequence for burst reads/writes
ZZ Asynchronous Sleep Control Active-high entry into low-power snooze mode; requires 2 clock cycles to enter/exit; preserves data integrity
DQs / DQP[A:B] Synchronous Bidirectional I/O 18 data + 2 parity lines; common I/O architecture; automatically three-stated during write data phase regardless of OE

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) Architecture Enables true back-to-back read/write transitions with zero wait states, maximizing effective bandwidth in burst-intensive applications
Synchronous Self-Timed Writes Eliminates external write pulse timing constraints; internal logic completes write within one clock cycle after data latch
Byte Write Capability Independent BW[A:B] control allows selective update of 9-bit subwords (A or B byte), reducing bus traffic and simplifying cache-line writes
Configurable Burst Order MODE pin selects linear (sequential) or interleaved (cache-friendly) addressing, matching host processor burst patterns
Integrated Sleep Mode (ZZ) Reduces standby current to 40 mA while maintaining data retention; entry/exit controlled asynchronously without clock dependency

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with strict latency budgets.

IC Role / Device Role / Timing Role: Flow-through SRAM acting as first-in-first-out (FIFO) buffer between MAC and switching fabric, synchronized to 100-MHz system clock.

Use Value: 8.0 ns tCDV and zero-wait-state burst reads ensure frame header inspection and forwarding decisions meet sub-100 ns deadlines.

Use Scenario: Holding ATM cell payloads and control headers in OC-48/STM-16 line interface units.

IC Role / Device Role / Timing Role: Dual-port-accessible memory block supporting simultaneous ingress/egress DMA channels with burst-aligned transfers.

Use Value: Linear burst mode aligns with ATM cell payload size (48 bytes), delivering full cell in four 18-bit cycles without address reissue.

Baseband Processor Cache Radar Signal Processing Buffer

Use Scenario: Serving as instruction/data scratchpad for DSP cores in 3G/4G baseband chipsets operating at 100 MHz.

IC Role / Device Role / Timing Role: Low-latency, high-bandwidth memory extension adjacent to tightly coupled memory controllers.

Use Value: Byte write capability enables efficient single-instruction updates to firmware tables without full-word overwrites or bus arbitration delays.

Use Scenario: Capturing and staging digitized RF samples in pulsed-Doppler radar front-ends before FFT processing.

IC Role / Device Role / Timing Role: Synchronous burst SRAM interfacing directly to ADC output and FPGA-based FFT engine clocked at 100 MHz.

Use Value: ZZ sleep mode reduces average power during inter-pulse intervals while preserving sampled data integrity across microsecond-scale idle periods.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L10PF 256K × 18, 100 MHz, 8.5 ns tAA; uses QDR-II interface with separate read/write ports Requires dual-clock domain handling and lacks MODE-configurable burst order Select when true simultaneous read/write is required and system supports QDR-II signaling
ISSI IS61WV25618BLL-10TLI 256K × 18, 100 MHz, 10 ns tAA; no ZZ sleep mode; only linear burst support Lower standby current (25 mA) but no power-gating option for intermittent operation Select for cost-sensitive industrial control where sleep mode is unnecessary and timing margin >2 ns exists

Compared with IDT72V2115L10PF and IS61WV25618BLL-10TLI, the CY7C1353F-100AC uniquely combines NoBL™ zero-latency operation, configurable burst order, and ZZ sleep mode-making it optimal for latency-critical, power-aware telecom and networking designs where deterministic timing and flexible burst alignment are mandatory.

Availability

CY7C1353F-100AC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and baseband processor cache applications requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.

Supply support for CY7C1353F-100AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC, and USB solutions for industrial, automotive, and communications markets.

The CY7C1353F belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-wait-state, high-frequency memory subsystems in networking infrastructure and real-time signal processing equipment.

FAQ

What is the function of the MODE pin on CY7C1353F-100AC?

The MODE pin selects burst address sequence: tied to GND for linear burst (00→01→10→11), or to VDD/floating for interleaved burst (00→01→10→11 becomes 00→01→10→11 → 01→00→11→10). This matches host processor burst patterns-linear for sequential streaming, interleaved for cache line access-and is sampled only at power-up or reset, not dynamically.

How does the ZZ sleep mode affect timing behavior during wake-up?

Asserting ZZ HIGH places the device in snooze mode after two clock cycles; deasserting ZZ LOW requires two additional clock cycles (tZZREC) before normal operation resumes. During this recovery window, CE1–CE3 must remain inactive, and no valid accesses are guaranteed-designs must insert idle cycles or use CEN gating to synchronize wake-up with system timing.

Can CY7C1353F-100AC perform byte writes during burst operations?

Yes-BW[A:B] signals are sampled each clock cycle during burst writes, allowing independent byte lane control per word. For example, asserting BW[A] only writes the upper 9 bits (DQPA/DQA group) while preserving lower 9 bits (DQPB/DQB group), enabling precise cache-line updates without full-word overwrites or external read-modify-write logic.

Why is OE masked during the data portion of a write cycle?

OE is masked to guarantee automatic three-state of DQs/DQP[A:B] during write data capture-preventing bus contention even if OE is accidentally asserted LOW. This hardware-enforced behavior ensures external drivers can safely present write data without requiring precise OE timing coordination, simplifying PCB layout and timing closure in high-speed systems.

CY7C1353F-100AC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Bag
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1353F-100AC FAQ

1.How can I place an order for CY7C1353F-100AC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1353F-100AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1353F-100AC reliable?

The price and inventory of CY7C1353F-100AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1353F-100AC is usually 5 days.

3.What payment methods are accepted for CY7C1353F-100AC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1353F-100AC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1353F-100AC?

CY7C1353F-100AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1353F-100AC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1353F-100AC?

For technical support, including CY7C1353F-100AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1353F-100AC requirements.

6.How does Aetrix verify that CY7C1353F-100AC is sourced from the original manufacturer or authorized distributors?

All CY7C1353F-100AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1353F-100AC meets industry standards.

7.What is the process for return or replacement of CY7C1353F-100AC?

All CY7C1353F-100AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1353F-100AC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1353F-100AC part is unused and in its original packaging.

Return procedure for CY7C1353F-100AC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1353F-100AC Tags

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