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Infineon Technologies CY7C1354C-166AXCT

Part No.:
CY7C1354C-166AXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1354C-166AXCT.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,935

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Product details

Overview

CY7C1354C-166AXCT from Cypress Semiconductor is a 9-Mbit (256K × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It operates at 166 MHz with zero wait states, supports 3.3 V VDD and 2.5 V/3.3 V VDDQ I/O, and delivers 3.5 ns clock-to-output access time.

For engineers reviewing the CY7C1354C-166AXCT datasheet, CY7C1354C-166AXCT pinout, CY7C1354C-166AXCT application, or CY7C1354C-166AXCT equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write select mapping (BWa–BWd), synchronous self-timed write timing, and TQFP-100 package compatibility with ZBT-style interfaces.

Technical Context

The CY7C1354C-166AXCT implements fully registered synchronous operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs pass through output registers synchronized to CLK. Its NoBL™ logic eliminates bus latency by enabling true back-to-back read/write cycles without wait states.

Burst capability is configurable via the MODE pin (linear or interleaved), while internal self-timed output buffer control removes dependency on asynchronous OE for tristate management. Byte write is controlled by four independent BW signals (BWa–BWd), each governing one 9-bit data/parity group (DQa/DQPa through DQd/DQPd).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 9 Mbit (256K × 36 organization), enabling full-word parallel access for 36-bit datapaths.
Max Clock Frequency 166 MHz - supports sustained 166 MT/s throughput with no cycle gaps between consecutive accesses.
Access Time 3.5 ns - defines minimum CLK-to-DQ valid delay under worst-case 166 MHz operation.
VDD Supply 3.3 V ±0.3 V - core logic voltage; requires stable low-noise regulation for timing integrity.
VDDQ Supply 2.5 V or 3.3 V - independently configurable I/O voltage, allowing interface compatibility with 2.5 V ASICs or 3.3 V FPGAs.
Burst Order Configurable via MODE pin - linear (sequential) or interleaved addressing per JEDEC standards.
Byte Write Control Four independent BWa–BWd inputs - enable selective 9-bit writes without read-modify-write overhead.

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, RoHS-compliant, with exposed thermal pad.

Pin/Terminal Circuit Role Design Meaning
CLK Clock input Synchronous edge-trigger for all register transfers; qualified by CEN - only active when CEN = LOW.
CEN Clock enable Active-LOW signal that gates CLK recognition; suspends operation without deselecting device or disrupting pipeline state.
BWa–BWd Byte write selects Active-LOW per-byte controls: BWa → DQa/DQPa, BWb → DQb/DQPb, BWc → DQc/DQPc, BWd → DQd/DQPd.
ADV/LD Address counter control HIGH advances internal burst counter; LOW loads new address - critical for burst sequence initialization and restart.
MODE Burst order strap Static input: HIGH = interleaved burst, LOW = linear burst - sets addressing pattern before first access.
ZZ Deep sleep control Active-LOW entry into low-power sleep mode; reduces standby current to ≤40 mA while preserving data.

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) architecture Enables unlimited back-to-back read/write operations with zero wait states - eliminates pipeline stalls in burst-intensive traffic.
Fully registered I/O All inputs and outputs synchronized to CLK rising edge - ensures deterministic timing closure in high-speed PCB layouts.
Synchronous self-timed writes On-chip write timing control eliminates external write pulse width constraints - simplifies controller design and improves reliability.
IEEE 1149.1 JTAG boundary scan Supports in-system testability and interconnect verification without requiring additional test fixtures or probes.
Flexible I/O voltage (VDDQ) 2.5 V or 3.3 V selectable - enables direct interfacing with mixed-voltage SoCs and FPGA I/O banks without level shifters.

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/3 switches with strict latency budgets.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer providing concurrent read/write access for ingress/egress pipelines.

Use Value: 166 MHz zero-wait-state operation sustains 5.9 Gbps aggregate bandwidth (36-bit × 166 MHz), meeting 10G Ethernet line-rate requirements.

Use Scenario: Frame assembly/disassembly in SONET/SDH add-drop multiplexers requiring deterministic burst access.

IC Role / Device Role / Timing Role: Synchronous burst memory supporting interleaved addressing for efficient ATM cell handling and pointer management.

Use Value: Configurable MODE pin allows matching of hardware burst order to SONET pointer alignment logic, eliminating software address translation.

Baseband Processor Cache Radar Signal Processing Buffer

Use Scenario: Temporary storage of decoded channel symbols in 4G/LTE baseband ASICs during turbo decoding iterations.

IC Role / Device Role / Timing Role: Pipelined SRAM acting as dual-port scratchpad memory with byte-selectable writes for partial symbol updates.

Use Value: Four independent BWa–BWd signals allow selective 9-bit writes - avoids full-word overwrites and preserves adjacent symbol integrity.

Use Scenario: Real-time buffering of ADC samples in phased-array radar front-ends prior to FFT processing.

IC Role / Device Role / Timing Role: Low-jitter, fully registered memory interface synchronizing sample capture and processing clocks.

Use Value: 3.5 ns clock-to-output time and synchronous OE masking ensure glitch-free data handoff between ADC interface and DSP core.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L16PF 512K × 18 organization, 166 MHz, 3.3 V only (no VDDQ flexibility), no ZZ sleep mode. Lacks deep-sleep power savings and dual-voltage I/O - less suitable for portable or thermally constrained systems. Select when footprint compatibility with legacy IDT designs is required and VDDQ flexibility is unnecessary.
ISSI IS61WV102436BLL-166TQLI Same 256K × 36 density and 166 MHz speed, but uses standard QDR-II interface (not NoBL™), requiring separate read/write clocks. Requires dual-clock controller support and lacks burst-order configurability - increases FPGA resource usage. Select when migrating from QDR-II-based systems and NoBL™ zero-wait-state behavior is not mandatory.

Compared with IDT72V2115L16PF and IS61WV102436BLL-166TQLI, the CY7C1354C-166AXCT uniquely combines NoBL™ zero-wait-state throughput, MODE-configurable burst order, and dual-voltage VDDQ - making it optimal for new designs demanding maximum interface simplicity and power-aware operation.

Availability

CY7C1354C-166AXCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processor cache, and radar signal processing applications requiring stable component supply across extended production lifecycles.

Supply support for CY7C1354C-166AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.

The CY7C1354C belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, high-bandwidth memory interfacing in packet-switched infrastructure where bus latency directly impacts system throughput.

FAQ

What is the function of the MODE pin on CY7C1354C-166AXCT?

The MODE pin is a static configuration input that determines burst addressing order: pulled HIGH for interleaved burst (e.g., 0, 2, 4, 6… then 1, 3, 5, 7…), or LOW for linear burst (0, 1, 2, 3…). It must be set before initial access and remains latched throughout operation - no dynamic reconfiguration is supported.

Does CY7C1354C-166AXCT support 2.5 V-only I/O operation?

Yes - VDDQ may be supplied at 2.5 V ±0.2 V while VDD remains at 3.3 V ±0.3 V. This allows direct connection to 2.5 V FPGA I/O banks or ASIC interfaces without level-shifting circuitry, provided VDDQ stability meets datasheet ripple specifications (≤30 mV peak-to-peak).

How does the ZZ pin affect power consumption?

Asserting ZZ LOW places the device in deep sleep mode, reducing CMOS standby current to ≤40 mA (typical) regardless of clock activity. Data retention is maintained, and exit latency is one clock cycle after ZZ returns HIGH - enabling rapid wake-up for burst-oriented traffic patterns.

Can CE2 be used as an active-HIGH chip select without external inversion?

Yes - CE2 is natively active HIGH and sampled synchronously on the rising edge of CLK when CEN is LOW. It is designed to pair with CE1 and CE3 (both active LOW) for three-level chip select decoding, enabling direct use with controllers that provide complementary chip enable signals.

CY7C1354C-166AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1354C-166AXCT FAQ

1.How can I place an order for CY7C1354C-166AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1354C-166AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1354C-166AXCT reliable?

The price and inventory of CY7C1354C-166AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1354C-166AXCT is usually 5 days.

3.What payment methods are accepted for CY7C1354C-166AXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1354C-166AXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1354C-166AXCT?

CY7C1354C-166AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1354C-166AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1354C-166AXCT?

For technical support, including CY7C1354C-166AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1354C-166AXCT requirements.

6.How does Aetrix verify that CY7C1354C-166AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1354C-166AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1354C-166AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1354C-166AXCT?

All CY7C1354C-166AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1354C-166AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1354C-166AXCT part is unused and in its original packaging.

Return procedure for CY7C1354C-166AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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