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Infineon Technologies CY7C1354C-166AXIT
- Part No.:
- CY7C1354C-166AXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1354C-166AXIT.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,867
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Product details
Overview
CY7C1354C-166AXIT from Cypress Semiconductor is a 9-Mbit (256K × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in networking and telecom data paths. It operates at 166 MHz with zero wait states, supports 3.3 V core supply and 2.5/3.3 V I/O, and delivers 3.5 ns clock-to-output access time in a Pb-free 100-pin TQFP package.
For engineers reviewing the CY7C1354C-166AXIT datasheet, CY7C1354C-166AXIT pinout, CY7C1354C-166AXIT application, or CY7C1354C-166AXIT equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write granularity across four 9-bit data groups, synchronous self-timed write control, and JTAG boundary-scan support for system-level testability.
Technical Context
The CY7C1354C-166AXIT implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs pass through output registers synchronized to the same edge. Its NoBL™ logic eliminates bus latency by enabling back-to-back read/write cycles without wait states.
Burst addressing is controlled by the MODE strap pin (linear vs. interleaved) and ADV/LD signal, while write operations are qualified by WE and four independent byte-write enables (BWa–BWd), each controlling one 9-bit data/parity pair (DQa/DQPa through DQd/DQPd). The device supports IEEE 1149.1 JTAG boundary scan and includes ZZ sleep mode for low-power standby.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36 organization) |
| Max Clock Frequency | 166 MHz - enables sustained 166 MT/s throughput with no wait states |
| Access Time | 3.5 ns - defines minimum clock-to-output delay for timing-critical read paths |
| VDD Supply | 3.3 V ± 0.3 V - single-core rail simplifies power delivery in 3.3 V systems |
| VDDQ Supply | 2.5 V or 3.3 V - allows I/O voltage matching to host interface (e.g., ASIC/FPGA) |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm) - surface-mount, RoHS-compliant, thermal performance validated for industrial ambient |
| Standby Current | 40 mA max - determines static power budget in low-activity buffer modes |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), Pb-free, body size 14 mm × 20 mm × 1.4 mm, standard JEDEC MO-140 footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Input | 18-bit synchronous address bus sampled on rising CLK edge; selects one of 256K locations |
| BWa–BWd | Byte Write Enable | Four active-low synchronous controls; each enables write to one 9-bit DQ/DQP group (e.g., BWa → DQa/DQPa) |
| CLK | Clock Input | Rising-edge-triggered master clock; qualified by CEN; drives all internal registers |
| CEN | Clock Enable | Active-low synchronous gate; suspends CLK recognition without deselecting device, extending previous cycle |
| CE1, CE3 | Chip Enable (Low) | Synchronous active-low enables; used with CE2 (active-high) for multi-chip bank decoding |
| OE | Output Enable | Asynchronous active-low control; tristates outputs during write data phase regardless of OE state |
| DQa–DQd / DQPa–DQPd | Data I/O (with Parity) | 36-bit bidirectional data + 4-bit parity; direction managed by OE and internal logic; automatically tristated during writes |
| ADV/LD | Burst Address Control | High = advance internal counter; Low = load new address; required LOW after deselection to reload |
| MODE | Burst Order Strap | Static input: HIGH = interleaved burst; LOW = linear burst; sets address increment pattern |
| ZZ | Deep Sleep Mode | Active-low entry into ultra-low-power state; reduces current to <100 µA; retains memory contents |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables true back-to-back read/write operations with zero wait states, maximizing effective bandwidth in burst-intensive applications |
| Four Independent Byte-Write Enables | Allows granular 9-bit writes without masking or read-modify-write cycles, reducing bus traffic and latency in packet header updates |
| Synchronous Self-Timed Writes | On-chip write timing logic eliminates external write-pulse width constraints and simplifies timing closure with FPGA/ASIC controllers |
| JTAG Boundary Scan (IEEE 1149.1) | Supports board-level interconnect test and debug without requiring additional test pads or fixtures |
| Flexible I/O Voltage (VDDQ) | 2.5 V or 3.3 V operation enables direct interfacing with mixed-voltage SoCs and FPGAs without level shifters |
Applications
| Telecom Line Card Buffering | Network Packet Switching |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switching ASICs with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency FIFO buffer between ingress parser and egress scheduler, operating at line rate. Use Value: 166 MHz pipelined operation and zero-wait-state reads/writes ensure deterministic frame buffering with sub-10 ns jitter in data path timing. |
Use Scenario: Temporary storage of IP packet headers and metadata during classification and QoS lookup in multi-gigabit routers. IC Role / Device Role / Timing Role: Synchronous burst-access scratchpad memory for parallel header processing pipelines. Use Value: Four-byte-write capability enables atomic update of 36-bit header fields (e.g., TTL, checksum, priority bits) without full-word overwrite overhead. |
| Baseband Processing in Wireless Infrastructure | Industrial Real-Time Data Acquisition |
|
Use Scenario: Interfacing between digital front-end (DFE) and baseband processor in LTE/5G remote radio units requiring deterministic memory access. IC Role / Device Role / Timing Role: Dual-port-like shared memory for time-aligned sample buffering with precise clock-domain crossing control. Use Value: Fully registered inputs/outputs and CEN-based clock gating enable clean synchronization across multiple clock domains in RF subsystems. |
Use Scenario: High-reliability buffering of sensor fusion data streams (IMU, ADC, encoder) in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Deterministic latency memory for real-time motion control loops requiring guaranteed worst-case access time. Use Value: 3.5 ns access time and ZZ sleep mode support meet <10 µs loop timing requirements while minimizing idle power consumption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L16PF | 256K × 36, 166 MHz, 3.3 V only (no VDDQ flexibility), no ZZ sleep mode | Lacks deep-sleep capability; requires external power management for low-duty-cycle systems | Select when VDDQ voltage matching is unnecessary and JTAG is not required |
| ISSI IS61WV25636B | 256K × 36, 166 MHz, 3.3 V core/I/O, no burst mode or MODE pin, no JTAG | Fixed linear burst only; no interleaved option; no boundary scan support | Select for cost-sensitive designs where burst configurability and testability are not needed |
Compared with IDT72V2115L16PF and IS61WV25636B, the CY7C1354C-166AXIT provides unique VDDQ voltage flexibility, hardware-configurable burst order, and integrated JTAG-critical for telecom and industrial systems requiring mixed-voltage interoperability, field-upgradable burst behavior, and production test coverage.
Availability
CY7C1354C-166AXIT is available at Aetrix Electronics and suitable for telecom line cards, network packet switches, wireless baseband subsystems, and industrial real-time controllers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1354C-166AXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
The CY7C1354C belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, burst-capable memory buffering in high-speed data-path applications such as packet switching, baseband processing, and real-time control.
FAQ
What is the function of the MODE pin on CY7C1354C-166AXIT?
The MODE pin is a static strap input that configures burst address sequencing: pulled HIGH for interleaved burst order (e.g., 0, 2, 4, 6, 1, 3, 5, 7), or LOW for linear burst (e.g., 0, 1, 2, 3, 4, 5, 6, 7). It must be set before initialization and remains fixed during operation; no dynamic reconfiguration is supported.
How does the ZZ (sleep) mode reduce power consumption?
When ZZ is asserted LOW, the device enters deep sleep mode, reducing ICC standby current to less than 100 µA while retaining all memory contents. This mode disables internal clocks and output drivers but maintains SRAM cell bias, enabling fast wake-up (<100 ns) upon ZZ deassertion without data loss.
Can CY7C1354C-166AXIT operate with 2.5 V I/O while using 3.3 V core supply?
Yes. VDD is fixed at 3.3 V ± 0.3 V for core logic, while VDDQ may be independently supplied at either 2.5 V or 3.3 V to match the host interface voltage. This dual-rail design eliminates level-shifting components when interfacing with 2.5 V FPGAs or ASICs.
Is the JTAG boundary scan feature enabled by default?
No. JTAG is implemented per IEEE 1149.1 but requires explicit activation via the TAP controller state machine; it is disabled by default and does not interfere with normal memory operation. Boundary scan functionality is accessible only when TMS, TCK, TDI, and TDO pins are driven per JTAG protocol sequences.
CY7C1354C-166AXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1354C-166AXIT FAQ
1.How can I place an order for CY7C1354C-166AXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1354C-166AXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1354C-166AXIT reliable?
The price and inventory of CY7C1354C-166AXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1354C-166AXIT is usually 5 days.
3.What payment methods are accepted for CY7C1354C-166AXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1354C-166AXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1354C-166AXIT?
CY7C1354C-166AXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1354C-166AXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1354C-166AXIT?
For technical support, including CY7C1354C-166AXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1354C-166AXIT requirements.
6.How does Aetrix verify that CY7C1354C-166AXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1354C-166AXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1354C-166AXIT meets industry standards.
7.What is the process for return or replacement of CY7C1354C-166AXIT?
All CY7C1354C-166AXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1354C-166AXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1354C-166AXIT part is unused and in its original packaging.
Return procedure for CY7C1354C-166AXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1354C-166AXIT Tags
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M24C02-WMN6TP
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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