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Infineon Technologies CY7C1354C-166BZCT

Part No.:
CY7C1354C-166BZCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1354C-166BZCT.pdf
Description:
IC SRAM 9MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,763

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Product details

Overview

CY7C1354C-166BZCT from Cypress Semiconductor is a 9-Mbit (256K × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput back-to-back read/write operations in network packet buffers and telecom line cards. It operates at 166 MHz with 3.5 ns maximum access time, supports 3.3V core supply and 2.5V/3.3V I/O supply (VDDQ), and delivers zero wait-state burst transfers using fully registered inputs/outputs.

For engineers reviewing the CY7C1354C-166BZCT datasheet, CY7C1354C-166BZCT pinout, CY7C1354C-166BZCT application, or CY7C1354C-166BZCT equivalent, key selection criteria include pipelined clock-to-output timing (tCO = 3.5 ns), synchronous byte write control (BWa–BWd), JTAG boundary-scan support, and compatibility with ZBT-style memory controllers in FPGA-based infrastructure systems.

Technical Context

This SRAM implements a fully synchronous, pipelined NoBL™ interface where all address, control, and data signals are registered on the rising edge of CLK, with CEN qualifying clock recognition. The internal burst counter supports linear or interleaved 4-word bursts controlled by the MODE strap pin and ADV/LD signal.

Write operations use on-chip self-timed circuitry synchronized to CLK, eliminating external write-strobe timing constraints; outputs are synchronously tristated during write data cycles regardless of OE state. Three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) enable flexible bank decoding without external logic.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 9 Mbit (256K × 36 organization)
Max Clock Frequency 166 MHz - defines maximum sustained bus throughput without wait states
Access Time (tCO) 3.5 ns - guaranteed clock-to-output delay for timing-critical pipeline stages
Supply Voltages VDD = 3.3 V ±0.3 V (core); VDDQ = 2.5 V or 3.3 V (I/O) - enables mixed-voltage system interfacing
Byte Write Control BWa–BWd (active-low) - enables independent 9-bit writes to DQa/DQPa through DQd/DQPd
Burst Capability Linear or interleaved 4-word burst - reduces address bus traffic in sequential access patterns
JTAG Support IEEE 1149.1 compliant - enables boundary-scan testing in dense PCB assemblies

Pinout & Package

Package: 100-pin TQFP (Pb-free), body size 14 mm × 14 mm, 0.5 mm pitch. Pinout validated per Cypress Document #38-05538 Rev. *H, Figure 1.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Synchronous Address Input Latched on rising CLK edge; selects one of 256K memory locations
BWa–BWd Synchronous Byte Write Select Active-low controls 9-bit write masking per data nibble (DQa/DQPa to DQd/DQPd)
CLK, CEN Clock & Clock Enable CEN LOW enables CLK sampling; deasserting CEN extends previous cycle without deselection
CE1, CE2, CE3 Synchronous Chip Enables Three-input decode (CE1/CE3 low, CE2 high) enables depth expansion with no glue logic
DQa–DQd, DQPa–DQPd Bidirectional Data I/O 36-bit data + 4-bit parity; direction controlled by OE and internal write/read state
ADV/LD, MODE, ZZ Control Straps ADV/LD loads or advances burst address; MODE selects linear/interleaved burst; ZZ enables low-power sleep

Key Features

Feature Design Value
No Bus Latency™ Architecture Enables true back-to-back read/write transitions with zero wait states, increasing effective bandwidth by >40% vs. asynchronous SRAMs
Fully Registered Interface All inputs and outputs clocked on rising CLK edge - eliminates setup/hold violations in high-speed FPGA interfaces
Synchronous Self-timed Writes On-chip write timing control removes dependency on external write-strobe generation and simplifies controller design
Flexible I/O Voltage VDDQ supports 2.5 V or 3.3 V operation - allows direct interfacing with both legacy and low-voltage FPGAs/ASICs
Configurable Burst Order MODE pin selects linear or interleaved 4-word burst - matches preferred access patterns of specific network processors

Applications

Network Packet Buffer Telecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with real-time latency constraints.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer between MAC and switching fabric, operating at 166 MHz with deterministic tCO ≤ 3.5 ns.

Use Value: Eliminates pipeline stalls during rapid read/write alternation, sustaining 1.33 Gbps aggregate throughput (36-bit × 166 MHz).

Use Scenario: Frame buffering in OC-48/STM-16 SONET/SDH line interface cards requiring burst-aligned access to ATM cells.

IC Role / Device Role / Timing Role: Synchronous burst SRAM interfaced to TI TMS320C64x+ DSP via EMIF, using interleaved burst mode for cell payload alignment.

Use Value: Reduces external address bus toggling by 75% during 4-cell bursts, lowering EMI and power consumption in dense line cards.

FPGA-Based Protocol Analyzer High-Speed Test Equipment Memory

Use Scenario: Capturing full-wire-rate 10G Ethernet traffic into deep memory for protocol conformance analysis.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as circular buffer with separate read/write clocks managed by Xilinx Ultrascale+ GTY transceivers.

Use Value: Fully registered interface ensures reliable capture at 166 MHz despite PCB trace skew; ZZ sleep mode cuts standby current to <40 mA during idle periods.

Use Scenario: Real-time waveform storage in digital storage oscilloscopes requiring glitch-free memory access during trigger events.

IC Role / Device Role / Timing Role: Zero-wait-state SRAM serving as acquisition memory for ADC data streams, synchronized to sample clock via dedicated CLK/CEN routing.

Use Value: 3.5 ns tCO guarantees sub-cycle timing margin for 166 MHz sampling clocks, preventing metastability in critical trigger path logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L16PF 512K × 18 organization, 166 MHz, 3.3V only (no VDDQ flexibility) Lacks byte-write granularity (18-bit wide writes only) and JTAG support Prefer when board uses fixed 18-bit data paths and does not require boundary-scan testability
ISSI IS61WV102436BLL-166TQLI 1024K × 36 organization, 166 MHz, 3.3V core/I/O, no ZZ sleep mode Higher density but larger 165-ball FBGA package; no MODE-selectable burst order Choose when >9 Mbit capacity is required and linear burst suffices for system architecture

Compared with IDT72V2115L16PF and IS61WV102436BLL-166TQLI, CY7C1354C-166BZCT uniquely combines 256K × 36 density, VDDQ voltage flexibility, four independent byte-write enables, and JTAG testability in a compact 100-pin TQFP-making it optimal for space-constrained, mixed-voltage telecom control planes.

Availability

CY7C1354C-166BZCT is available at Aetrix Electronics and suitable for network packet buffers, telecom line card memory, FPGA-based protocol analyzers, and high-speed test equipment requiring stable component supply across extended production lifecycles.

Supply support for CY7C1354C-166BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.

CY7C1354C belongs to Cypress's NoBL™ SRAM product line, engineered specifically to replace asynchronous and ZBT SRAMs in systems demanding deterministic zero-wait-state burst performance with simplified timing closure.

FAQ

What is the function of the MODE pin on CY7C1354C-166BZCT?

The MODE pin is a static strap input that selects burst order: logic HIGH configures interleaved burst mode, while logic LOW selects linear burst mode. It must be held stable during operation and defaults to HIGH if left floating, enabling interleaved access without external configuration. This setting directly determines how the internal burst counter increments A0/A1 during multi-word reads/writes.

Can CY7C1354C-166BZCT operate with VDDQ = 2.5 V while VDD = 3.3 V?

Yes - the device supports independent 3.3 V core supply (VDD) and 2.5 V I/O supply (VDDQ), allowing seamless interfacing with 2.5 V FPGAs or ASICs while maintaining full 166 MHz performance. This dual-supply capability is explicitly specified in the DC Electrical Characteristics table and requires separate decoupling for each rail.

How does the ZZ (Sleep) pin reduce power consumption?

Asserting ZZ LOW places the SRAM into low-power sleep mode, reducing CMOS standby current to ≤40 mA regardless of clock frequency or bus activity. Unlike clock gating, ZZ disables internal arrays and registers entirely, making it ideal for intermittent capture applications like protocol analyzers where memory remains idle between triggers.

Is CY7C1354C-166BZCT pin-compatible with ZBT SRAMs?

Yes - Cypress specifies CY7C1354C as pin-compatible and functionally equivalent to industry-standard ZBT SRAMs (e.g., IDT 72V2113), sharing identical pin functions, timing conventions, and control signal behavior. This allows drop-in replacement in existing ZBT-based designs without layout or firmware changes.

CY7C1354C-166BZCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1354C-166BZCT FAQ

1.How can I place an order for CY7C1354C-166BZCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1354C-166BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1354C-166BZCT reliable?

The price and inventory of CY7C1354C-166BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1354C-166BZCT is usually 5 days.

3.What payment methods are accepted for CY7C1354C-166BZCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1354C-166BZCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1354C-166BZCT?

CY7C1354C-166BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1354C-166BZCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1354C-166BZCT?

For technical support, including CY7C1354C-166BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1354C-166BZCT requirements.

6.How does Aetrix verify that CY7C1354C-166BZCT is sourced from the original manufacturer or authorized distributors?

All CY7C1354C-166BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1354C-166BZCT meets industry standards.

7.What is the process for return or replacement of CY7C1354C-166BZCT?

All CY7C1354C-166BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1354C-166BZCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1354C-166BZCT part is unused and in its original packaging.

Return procedure for CY7C1354C-166BZCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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