Infineon Technologies CY7C1354C-200AXI
- Part No.:
- CY7C1354C-200AXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1354C-200AXI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,294
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Product details
Overview
CY7C1354C-200AXI from Cypress Semiconductor is a 9-Mbit (256K × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems requiring zero-wait-state back-to-back read/write operations. It operates at 200 MHz with 3.2 ns clock-to-output time, supports 3.3 V core and 2.5/3.3 V I/O supplies, and features byte-write capability, JTAG boundary scan, and ZZ sleep mode - deployed in network packet buffers and telecom line cards.
For engineers reviewing the CY7C1354C-200AXI datasheet, CY7C1354C-200AXI pinout, CY7C1354C-200AXI application, or CY7C1354C-200AXI equivalent, key selection criteria include burst order configuration (linear/interleaved), synchronous self-timed write timing, CEN-controlled clock gating, and TQFP-100 package compatibility with ZBT-style interfaces.
Technical Context
The CY7C1354C-200AXI implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs pass through output registers synchronized to the same edge. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without wait states.
Burst addressing is configurable via the MODE strap pin (linear or interleaved), while write operations are controlled by four synchronous byte-write enables (BWa–BWd) and WE, all qualified by CEN. Output drivers are synchronously tristated during write data phases to prevent bus contention, and OE remains asynchronous but masked during critical transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36 organization), enabling 36-bit wide data paths for high-bandwidth interconnects. |
| Max Clock Frequency | 200 MHz - supports sustained 200 MT/s throughput with no wait states in pipelined mode. |
| Access Time | 3.2 ns - defines minimum clock-to-output delay for timing-critical synchronous read cycles. |
| Supply Voltages | VDD = 3.3 V ± 0.3 V (core); VDDQ = 2.5 V or 3.3 V (I/O) - allows mixed-voltage system integration. |
| Power Consumption | 220 mA max operating current; 40 mA CMOS standby current - enables low-idle-power buffer designs. |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, with standard JEDEC footprint and thermal profile. |
| Burst Capability | Linear or interleaved burst order, selected by MODE pin - matches legacy ZBT controller expectations. |
Pinout & Package
CY7C1354C-200AXI is housed in a 100-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch, 14 mm × 20 mm body, and 1.4 mm height. The package supports standard reflow profiles and provides full signal access for 36-bit data, 18-bit address, and dual-rail power distribution.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous Address Input | Latched on rising CLK edge; selects one of 256K addresses in 36-bit-wide memory array. |
| BWa–BWd | Synchronous Byte Write Enable | Active-low per-byte controls (DQa/DQPa, DQb/DQPb, etc.); enables partial-word writes without read-modify-write. |
| CLK, CEN | Clock & Clock Enable | CLK qualified by active-low CEN; deasserting CEN extends previous cycle without deselecting device. |
| CE1, CE2, CE3 | Chip Enable Group | Three-level synchronous enable (CE1/CE3 active-low, CE2 active-high) for multi-chip bank decoding. |
| DQa–DQd, DQPa–DQPd | Bidirectional Data I/O | 36-bit data + 4-bit parity; direction controlled by OE and internal write/read state machine. |
| OE | Asynchronous Output Enable | Active-low; masked during write data phase and first clock after deselection to ensure bus integrity. |
| ADV/LD, MODE, ZZ | Control Strap Inputs | ADV/LD advances or loads burst counter; MODE selects linear/interleaved burst; ZZ enables deep-sleep mode. |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables unlimited true back-to-back read/write operations with zero wait states - increases effective bandwidth by up to 2× vs. async SRAM. |
| Fully Registered I/O Path | All inputs and outputs synchronized to CLK rising edge - simplifies timing closure in high-speed FPGA/ASIC interfaces. |
| Synchronous Self-Timed Writes | On-chip write timing logic eliminates external write pulse width constraints - removes need for precise WE hold/setup tuning. |
| JTAG Boundary Scan (IEEE 1149.1) | Supports production test and board-level debug without additional test fixtures - reduces manufacturing test cost. |
| Flexible I/O Voltage | VDDQ supports 2.5 V or 3.3 V operation - allows direct interfacing with both older 3.3 V and newer low-voltage logic families. |
Applications
| Network Packet Buffer | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency shared memory buffer between ingress/egress MACs and traffic manager ASICs. Use Value: 200 MHz pipelined operation ensures frame metadata and payload transfers complete within single-cycle boundaries, eliminating pipeline stalls. |
Use Scenario: Holding ATM cell headers and payload segments in OC-48/192 line interface units. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as descriptor table and payload scratchpad in framer-to-processor data path. Use Value: Byte-write capability enables efficient header updates without full-cell rewrite; ZZ mode reduces idle power by >85% during low-traffic intervals. |
| Baseband Processor Cache | Radar Signal Processing Buffer |
|
Use Scenario: Serving as instruction/data cache for DSP cores in 4G/LTE baseband processing units. IC Role / Device Role / Timing Role: Low-jitter, deterministic-access memory supporting burst-mode instruction fetches and scatter-gather DMA. Use Value: Interleaved burst order (via MODE pin) aligns with DSP cache line layouts, improving prefetch efficiency by 18% over linear mode. |
Use Scenario: Capturing and buffering real-time ADC samples from phased-array radar front-ends before FFT processing. IC Role / Device Role / Timing Role: Synchronous burst SRAM acting as ping-pong buffer between ADC interface and FPGA-based FFT engine. Use Value: 3.2 ns clock-to-output and fully registered outputs meet sub-5 ns setup windows required for 200 MSPS sampling clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L15PF | 256K × 36, 15 ns access, 133 MHz max, 3.3 V only, no ZZ mode or MODE strap | Lacks burst order selection and deep-sleep; suited for simpler, lower-frequency control-plane buffers | Choose when JTAG testability and ultra-low standby power are not required and clock rate ≤133 MHz. |
| ISSI IS61WV25636B | 256K × 36, 200 MHz, 3.3 V core/I/O, no NoBL™, asynchronous OE only, no ADV/LD or MODE | Requires external write timing control; no burst counter or configurable burst order | Prefer where cost sensitivity outweighs need for pipelined zero-wait-state performance and advanced control features. |
Compared with IDT72V2115L15PF and IS61WV25636B, CY7C1354C-200AXI uniquely delivers 200 MHz zero-wait-state throughput with integrated burst control, sleep mode, and JTAG - making it optimal for latency-constrained, feature-rich telecom and networking memory subsystems.
Availability
CY7C1354C-200AXI is available at Aetrix Electronics and suitable for network packet buffers, telecom line card memory, baseband processor caches, and radar signal processing buffers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1354C-200AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
CY7C1354C belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput memory interfaces in packet-switched infrastructure and real-time signal processing systems.
FAQ
What is the function of the MODE pin on CY7C1354C-200AXI?
The MODE pin is a static strap input that configures burst address sequencing: tied HIGH for interleaved burst order (e.g., 0, 2, 4, 6… then 1, 3, 5, 7…), pulled LOW for linear order (0, 1, 2, 3…). It is sampled at power-up and must remain stable during operation; no dynamic switching is supported.
How does the ZZ (sleep) mode reduce power consumption?
In ZZ mode, internal clocks and array biasing are gated, reducing supply current to ≤10 µA typical. The device retains data but requires a minimum 200 ns recovery time before next valid access. ZZ is asserted asynchronously and does not require CEN or CLK activity to enter or exit.
Can CY7C1354C-200AXI operate with VDDQ = 2.5 V while VDD = 3.3 V?
Yes - VDDQ is independent of VDD and may be set to either 2.5 V or 3.3 V. When VDDQ = 2.5 V, all DQ and DQP pins interface with 2.5 V logic families; VDD remains at 3.3 V for core operation. This dual-rail design enables mixed-voltage system integration without level shifters.
Is the CY7C1354C-200AXI pin-compatible with ZBT SRAMs?
Yes - it is explicitly designed as pin-compatible and functionally equivalent to ZBT devices (e.g., IDT 72V2115). Key signals (A0–A17, DQa–DQd, BWa–BWd, CE1/CE2/CE3, CLK, CEN, WE, OE, ADV/LD) map identically, enabling drop-in replacement in existing ZBT-based designs with identical PCB layout.
CY7C1354C-200AXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.2 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1354C-200AXI FAQ
1.How can I place an order for CY7C1354C-200AXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1354C-200AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1354C-200AXI reliable?
The price and inventory of CY7C1354C-200AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1354C-200AXI is usually 5 days.
3.What payment methods are accepted for CY7C1354C-200AXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1354C-200AXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1354C-200AXI?
CY7C1354C-200AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1354C-200AXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1354C-200AXI?
For technical support, including CY7C1354C-200AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1354C-200AXI requirements.
6.How does Aetrix verify that CY7C1354C-200AXI is sourced from the original manufacturer or authorized distributors?
All CY7C1354C-200AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1354C-200AXI meets industry standards.
7.What is the process for return or replacement of CY7C1354C-200AXI?
All CY7C1354C-200AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1354C-200AXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1354C-200AXI part is unused and in its original packaging.
Return procedure for CY7C1354C-200AXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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