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Infineon Technologies CY7C1354CV25-166AXC

Part No.:
CY7C1354CV25-166AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1354CV25-166AXC.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:144

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Product details

Overview

CY7C1354CV25-166AXC from Infineon Technologies (formerly Cypress) is a 2.5 V, 256K × 36 pipelined synchronous SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in network packet buffers and telecom line cards. It supports 166 MHz bus operation with zero wait states, 3.5 ns maximum access time, 180 mA max operating current, and features fully registered I/O, byte write capability, and JTAG boundary scan.

For engineers reviewing the CY7C1354CV25-166AXC datasheet, CY7C1354CV25-166AXC pinout, CY7C1354CV25-166AXC application, or CY7C1354CV25-166AXC equivalent, key selection criteria include burst mode support (linear/interleaved), synchronous self-timed writes, clock enable (CEN) control, ZZ sleep mode, and compatibility with ZBT™-based system designs.

Technical Context

This SRAM implements a true pipelined read/write architecture using rising-edge-triggered input and output registers, enabling back-to-back operations without latency penalties. Its NoBL™ logic eliminates bus turnaround delays by synchronizing all address, data, and control signals to CLK, while internal self-timed output buffer control removes dependency on asynchronous OE timing.

The device supports two burst orders (linear and interleaved), three chip enables (CE1–CE3) for bank selection, four byte write enables (BWa–BWd), and IEEE 1149.1 JTAG boundary scan for system-level testability. Sleep mode (ZZ) and stop-clock operation reduce power during idle cycles without losing data integrity.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density9 Mbit (256K × 36 configuration)
Max Clock Frequency166 MHz - enables sustained 166 MT/s throughput with no wait states
Access Time3.5 ns - defines minimum CLK-to-DQ valid delay under worst-case conditions
Supply Voltage2.5 V ±0.2 V - single-rail operation compatible with 2.5 V logic families
Operating Current180 mA max - determines thermal design margin and power delivery requirements
Standby Current40 mA max - sets quiescent power budget during low-activity periods
Burst OrderLinear or interleaved - matches legacy ZBT™ controller addressing schemes

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), lead-free, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CLKClock inputRising-edge synchronized timing reference for all register transfers
CENClock enableActive-low signal that gates CLK propagation to internal registers
WEWrite enableControls initiation of synchronous self-timed write cycles
BWa–BWdByte write selectsIndividually mask 9-bit data nibbles during 36-bit writes
CE1–CE3Chip enablesThree-level decode for multi-bank memory expansion
OEOutput enableAsynchronous tri-state control for output drivers
ZZDeep sleep modeReduces standby current to <100 µA when asserted
ADV/LDAddress valid/loadQualifies address latching and initiates burst sequence
MODEBurst order selectConfigures linear vs. interleaved burst addressing

Key Features

FeatureDesign Value
No Bus Latency™ architectureEnables consecutive read/write transitions with zero cycle penalty - critical for packet buffering in switch fabric ASICs
Fully registered I/OAll inputs and outputs are edge-triggered, eliminating setup/hold violations in high-speed PCB layouts
Synchronous self-timed writesRemoves external write pulse timing constraints - simplifies controller interface logic
JTAG boundary scan (IEEE 1149.1)Supports automated board-level test and interconnect verification without additional test fixtures
Byte write capabilityAllows partial-word updates without read-modify-write cycles - improves efficiency in protocol header manipulation

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing variable-length Ethernet frames in Layer 2 switches with real-time ingress/egress arbitration.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as primary frame buffer with deterministic 166 MT/s throughput.

Use Value: Eliminates pipeline stalls during rapid read/write alternation, sustaining full wire-rate forwarding at 1 Gbps+.

Use Scenario: Holding ATM cell headers and payload segments in OC-48 SONET framer modules.

IC Role / Device Role / Timing Role: Synchronous burst memory interfacing directly with framer ASIC's ZBT-compatible bus.

Use Value: Matches ZBT™ timing models to avoid redesign of existing controller firmware and PCB layout.

Baseband Processing CacheIndustrial Protocol Gateway

Use Scenario: Caching LTE MAC layer scheduling tables and HARQ feedback in small-cell baseband units.

IC Role / Device Role / Timing Role: Low-power, pipelined SRAM supporting burst reads/writes aligned to TD-LTE subframe boundaries.

Use Value: ZZ sleep mode reduces average current to <50 µA between subframes, extending thermal headroom.

Use Scenario: Bridging Modbus TCP and PROFIBUS DP protocols in factory-floor gateways requiring deterministic memory access.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as shared message queue between protocol stacks.

Use Value: Fully registered I/O ensures timing closure across mixed-voltage FPGA interfaces (2.5 V core, 3.3 V I/O).

Equivalent & Alternatives

The following parts are listed as comparable options for similar pipelined SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72V2115L166BG256K × 36, 166 MHz, 3.3 V supply, different pinout and burst control schemeRequires level-shifting and PCB redesign; lacks ZZ sleep modeSelect only if 3.3 V system integration is mandatory and JTAG test is not required
ISSI IS61WV25636BLL-166TQLI256K × 36, 166 MHz, 2.5 V, no JTAG, no ZZ mode, non-pipelined write pathHigher write latency; unsuitable for true back-to-back write/read sequencesConsider only for cost-sensitive applications where burst throughput is secondary to unit price

Compared with IDT72V2115L166BG and IS61WV25636BLL-166TQLI, CY7C1354CV25-166AXC uniquely delivers ZBT™-compatible timing, integrated JTAG, and deep-sleep power management - making it optimal for telecom infrastructure upgrades where firmware reuse and thermal constraints are critical.

Availability

CY7C1354CV25-166AXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and industrial protocol gateway applications requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1354CV25-166AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive MCUs, and high-performance memory solutions.

CY7C1354CV25-166AXC belongs to Infineon's legacy Cypress SRAM product line, engineered specifically for high-speed, low-latency memory subsystems in carrier-grade networking and communications equipment.

FAQ

Is CY7C1354CV25-166AXC pin-compatible with ZBT™ devices?

Yes - it is explicitly designed as pin- and functionally compatible with industry-standard ZBT™ SRAMs such as the IDT72V2115 series. The pinout, timing behavior, and control signal definitions match ZBT™ specifications, allowing drop-in replacement in existing designs without PCB or firmware changes.

What is the purpose of the ADV/LD pin?

The ADV/LD (Address Valid/Load) pin controls burst address generation and qualifies address latching. When asserted, it signals the start of a burst sequence and loads the initial address into internal counters; its timing relationship with CLK determines burst order (linear or interleaved) based on MODE pin state.

Does CY7C1354CV25-166AXC support both linear and interleaved burst modes?

Yes - burst order is selected via the MODE pin: logic high configures linear burst addressing, logic low selects interleaved. This dual-mode capability ensures compatibility with diverse memory controllers, including those used in older telecom ASICs and newer FPGA-based packet processors.

Can the ZZ (sleep) mode be used during active system operation?

Yes - ZZ mode is fully synchronous and can be asserted between any two clock cycles without data loss or timing violation. When activated, it reduces ICC to <100 µA while preserving memory contents, making it ideal for dynamic power gating in burst-oriented traffic patterns like VoIP or video streaming buffers.

CY7C1354CV25-166AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1354CV25-166AXC FAQ

1.How can I place an order for CY7C1354CV25-166AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1354CV25-166AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1354CV25-166AXC reliable?

The price and inventory of CY7C1354CV25-166AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1354CV25-166AXC is usually 5 days.

3.What payment methods are accepted for CY7C1354CV25-166AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1354CV25-166AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1354CV25-166AXC?

CY7C1354CV25-166AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1354CV25-166AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1354CV25-166AXC?

For technical support, including CY7C1354CV25-166AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1354CV25-166AXC requirements.

6.How does Aetrix verify that CY7C1354CV25-166AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1354CV25-166AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1354CV25-166AXC meets industry standards.

7.What is the process for return or replacement of CY7C1354CV25-166AXC?

All CY7C1354CV25-166AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1354CV25-166AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1354CV25-166AXC part is unused and in its original packaging.

Return procedure for CY7C1354CV25-166AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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