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Infineon Technologies CY7C1354CV25-166BZC
- Part No.:
- CY7C1354CV25-166BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1354CV25-166BZC.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,971
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Product details
Overview
CY7C1354CV25-166BZC from Infineon Technologies (formerly Cypress) is a 2.5 V, 256K × 36 pipelined synchronous SRAM with NoBL™ architecture, supporting zero-wait-state 166 MHz bus operation, 3.5 ns maximum access time, and byte-write capability. It serves as high-throughput data buffer in network packet processors requiring back-to-back read/write transitions.
For engineers reviewing the CY7C1354CV25-166BZC datasheet, CY7C1354CV25-166BZC pinout, CY7C1354CV25-166BZC application, or CY7C1354CV25-166BZC equivalent, key selection criteria include synchronous self-timed write timing, 100-pin TQFP package compatibility, IEEE 1149.1 JTAG support, and ZBT™ functional equivalence for legacy interface migration.
Technical Context
The device implements fully registered pipelined I/O with rising-edge clock synchronization on all inputs and outputs, enabling deterministic timing across consecutive cycles. Its NoBL™ logic eliminates bus latency by allowing immediate read-after-write without wait states, supported by internal burst address generation for linear or interleaved sequences.
Three synchronous chip enables (CE1–CE3) and asynchronous OE provide flexible bank selection and output control, while synchronous tri-state of output drivers during write avoids bus contention. The ZZ sleep mode reduces standby current to 40 mA without clock stop requirement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 (9-Mbit total), enabling 36-bit wide data paths for parallel bus architectures |
| Max Clock Frequency | 166 MHz - supports sustained 166 MT/s throughput with no wait states |
| Access Time | 3.5 ns - defines minimum clock-to-output delay for timing budgeting in high-speed interfaces |
| Supply Voltage | 2.5 V ± 0.2 V - single-rail operation compatible with 2.5 V I/O standards and low-power system design |
| Operating Current | 180 mA max at 166 MHz - determines thermal and power delivery requirements for PCB layout |
| Standby Current | 40 mA max - sets baseline power consumption during idle or ZZ sleep mode |
| Burst Capability | Linear or interleaved - matches CPU or DMA controller burst patterns without address reissuing |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), 14 × 20 × 1.4 mm, lead-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge synchronized control signal qualifying all register transfers and timing references |
| CEN | Clock enable | Active-low input suspending clock domain operation without resetting internal state |
| CE1, CE2, CE3 | Synchronous chip enables | Three-level decode for multi-bank memory mapping; all must be asserted for access |
| WE | Write enable | Active-low synchronous control initiating self-timed write sequence with byte-select gating |
| BWa–BWd | Byte write selects | Four independent 9-bit write masks enabling granular 36-bit word updates without read-modify-write |
| DQa–DQd | Data I/O buses | Four 9-bit bidirectional data groups (36-bit total), each with dedicated output registers and drivers |
| OE | Output enable | Asynchronous control for tri-stating DQ outputs-used for bus sharing or hot-swap isolation |
| ZZ | Deep sleep mode | Active-low entry into low-power state reducing ICC to 40 mA while retaining data |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ architecture | Enables true back-to-back read/write operations on every clock cycle, eliminating pipeline stalls in burst-intensive systems |
| Synchronous self-timed writes | Removes external write pulse timing constraints-internal circuitry guarantees setup/hold compliance regardless of clock skew |
| IEEE 1149.1 JTAG boundary scan | Supports automated PCB test and interconnect verification without requiring additional test points or fixtures |
| Byte-write capability (BWa–BWd) | Allows partial-word updates to 9-bit subfields within 36-bit words, reducing bus traffic and memory wear in protocol stacks |
| Pb-free 100-pin TQFP | Meets RoHS Directive 2011/65/EU and facilitates reflow-compatible assembly in standard SMT lines |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with real-time latency constraints. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as frame buffer between MAC and switching fabric, synchronized to 166 MHz system clock. Use Value: Zero-wait-state operation ensures full 166 MT/s throughput across mixed read/write bursts, preventing frame loss during congestion. |
Use Scenario: Holding configuration tables and real-time statistics in carrier-grade DSLAM line cards operating under strict thermal limits. IC Role / Device Role / Timing Role: Pipelined SRAM serving as shared memory for multiple DSP cores accessing lookup tables and counters via common bus. Use Value: Byte-write capability allows individual counter updates without disturbing adjacent fields, minimizing bus arbitration overhead. |
| Baseband Processor Cache | Industrial PLC Data Logging |
|
Use Scenario: Acting as instruction/data cache for FPGA-based baseband processors in LTE small-cell radio units. IC Role / Device Role / Timing Role: Burst-capable SRAM interfacing directly to FPGA's embedded memory controller with linear burst addressing. Use Value: 3.5 ns access time meets tight setup windows for FPGA I/O registers, enabling reliable 166 MHz clock domain crossing. |
Use Scenario: Buffering sensor acquisition data streams in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Reliable, non-volatile-buffered memory storing timestamped analog channel samples before transfer to flash storage. Use Value: ZZ sleep mode reduces average power to <50 mA during idle periods, extending uptime in battery-backed systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C361024B-166BIN | 2.5 V, 256K × 36, 166 MHz, but uses standard sync SRAM timing (not NoBL™); requires external OE management | Lacks zero-wait-state back-to-back operation; suitable only where burst depth is shallow and latency tolerance >5 ns | Select if migrating from legacy designs without NoBL™ dependency and cost sensitivity outweighs throughput gain |
| IS61WV25636BLL-166TQLI | 2.5 V, 256K × 36, 166 MHz, supports NoBL™-like pipelining but lacks JTAG and ZZ sleep mode | Missing IEEE 1149.1 testability and deep-sleep power reduction-limits use in field-serviceable telecom hardware | Prefer when JTAG test coverage is not required and thermal envelope permits higher standby current |
Compared with AS7C361024B-166BIN and IS61WV25636BLL-166TQLI, CY7C1354CV25-166BZC uniquely delivers guaranteed zero-wait-state throughput, integrated JTAG for production test, and ZZ sleep mode-making it optimal for high-reliability, high-throughput, and field-upgradable systems.
Availability
CY7C1354CV25-166BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial PLC data logging requiring stable component supply across extended product lifecycles.
Supply support for CY7C1354CV25-166BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, focusing on industrial, automotive, and communications infrastructure solutions.
CY7C1354CV25 belongs to the NoBL™ SRAM product line, engineered specifically for applications demanding deterministic, high-bandwidth memory access in packet-switched and real-time control systems.
FAQ
Is CY7C1354CV25-166BZC pin-compatible with ZBT™ devices?
Yes, it is pin-compatible and functionally equivalent to industry-standard ZBT™ SRAMs such as IDT72V2221. This allows drop-in replacement in existing ZBT-based designs without PCB or firmware changes, preserving timing margins and interface logic.
What is the role of the MODE pin on CY7C1354CV25-166BZC?
The MODE pin selects burst order: logic high configures linear burst, logic low selects interleaved burst. This matches the addressing pattern expected by host processors (e.g., PowerPC or ARM AMBA buses), ensuring correct sequential data alignment during burst reads/writes.
Does CY7C1354CV25-166BZC support JTAG boundary scan in-system?
Yes, it implements IEEE 1149.1 JTAG with TCK, TMS, TDI, and TDO pins. Boundary scan supports interconnect testing of all 100 TQFP pins, including DQ, address, and control signals, enabling automated manufacturing test without physical probe access.
How does the ZZ sleep mode affect data retention?
When ZZ is asserted, the device enters deep sleep with 40 mA max standby current while maintaining full data integrity across the entire 256K × 36 array. Data retention is guaranteed over the full industrial temperature range (–40°C to +85°C) without external refresh or backup power.
CY7C1354CV25-166BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1354CV25-166BZC FAQ
1.How can I place an order for CY7C1354CV25-166BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1354CV25-166BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1354CV25-166BZC reliable?
The price and inventory of CY7C1354CV25-166BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1354CV25-166BZC is usually 5 days.
3.What payment methods are accepted for CY7C1354CV25-166BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1354CV25-166BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1354CV25-166BZC?
CY7C1354CV25-166BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1354CV25-166BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1354CV25-166BZC?
For technical support, including CY7C1354CV25-166BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1354CV25-166BZC requirements.
6.How does Aetrix verify that CY7C1354CV25-166BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1354CV25-166BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1354CV25-166BZC meets industry standards.
7.What is the process for return or replacement of CY7C1354CV25-166BZC?
All CY7C1354CV25-166BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1354CV25-166BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1354CV25-166BZC part is unused and in its original packaging.
Return procedure for CY7C1354CV25-166BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1354CV25-166BZC Tags
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M24C02-WMN6TP
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