Infineon Technologies CY7C1354CV25-166BZCT
- Part No.:
- CY7C1354CV25-166BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1354CV25-166BZCT.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1354CV25-166BZCT from Infineon Technologies (formerly Cypress) is a 2.5 V, 256K × 36 pipelined synchronous SRAM with NoBL™ architecture, supporting zero-wait-state 166 MHz bus operation, 3.5 ns maximum access time, and synchronous self-timed writes. It serves as high-throughput buffer memory in network packet processors requiring back-to-back read/write transitions.
For engineers reviewing the CY7C1354CV25-166BZCT datasheet, CY7C1354CV25-166BZCT pinout, CY7C1354CV25-166BZCT application, or CY7C1354CV25-166BZCT equivalent, key selection criteria include burst order support (linear/interleaved), byte-write capability across four 9-bit groups, IEEE 1149.1 JTAG boundary scan compliance, and 100-pin TQFP package compatibility with ZBT™-pin-compatible systems.
Technical Context
The device implements fully registered inputs and outputs synchronized to the rising edge of CLK, with internal self-timed output buffer control eliminating asynchronous OE dependency. Three chip enables (CE1–CE3) and clock enable (CEN) provide hierarchical bank and cycle control.
Burst logic supports both linear and interleaved address sequences, while write coherency is maintained via on-chip registry and data steering. Sleep mode (ZZ) and stop-clock operation reduce standby current to 40 mA without compromising state retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36 configuration) |
| Max Clock Frequency | 166 MHz - enables sustained 166 MT/s throughput with no wait states |
| Access Time | 3.5 ns - defines minimum clock-to-output delay for timing-critical interfaces |
| Supply Voltage | 2.5 V ±0.2 V - single-rail operation compatible with 2.5 V I/O domains |
| Operating Current | 180 mA max at 166 MHz - determines thermal and power delivery requirements |
| Standby Current | 40 mA max - sets baseline power budget during ZZ sleep mode |
| Burst Order | Linear or interleaved - selects address increment pattern for cache-line-aligned transfers |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Primary clock input | Rising-edge-triggered master timing reference for all registers and burst sequencing |
| CEN | Clock enable | Asynchronous assertion suspends clock domain; extends previous cycle without resetting state |
| CE1, CE2, CE3 | Chip enable group | Three-level decode enables selective bank activation and reduces address decoding complexity |
| WE | Write enable | Active-low synchronous control for initiating self-timed write cycles |
| BWa–BWd | Byte write selects | Four independent 9-bit write masks enabling granular 36-bit word updates |
| DQa–DQd | Data I/O groups | Four 9-bit bidirectional data buses aligned to byte-write controls |
| DQPa–DQPd | Parity output pins | Four parity bits (one per 9-bit byte) for error detection in mission-critical buffers |
| ADV/LD | Address valid/load | Controls burst address generation mode (burst vs. single access) |
| ZZ | Deep sleep control | Active-low entry into low-power state with retained memory contents and fast wake-up |
| MODE | Burst order select | Configures linear or interleaved burst addressing sequence at power-up |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) architecture | Enables true back-to-back read/write operations with zero wait states, increasing effective bandwidth by >40% over conventional SRAMs |
| Synchronous self-timed writes | Eliminates external write pulse timing constraints and guarantees data capture within one clock cycle |
| IEEE 1149.1 JTAG boundary scan | Supports production testability and board-level diagnostics without additional test fixtures |
| Byte-write capability (4 × 9-bit) | Reduces bus contention and system-level write overhead when updating partial 36-bit words |
| ZZ sleep mode with fast wake-up | Reduces active standby current to 40 mA while retaining full memory state for <100 ns resume latency |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet frames in multi-gigabit switch ASICs. IC Role / Device Role / Timing Role: High-speed dual-port buffer providing simultaneous ingress/egress access with deterministic latency. Use Value: 166 MHz zero-wait-state operation ensures line-rate buffering for 10 Gbps+ traffic without packet loss under burst load. |
Use Scenario: Frame assembly/disassembly in SONET/SDH OC-192 line interface units. IC Role / Device Role / Timing Role: Synchronous pipeline memory staging payloads between framer and processor subsystems. Use Value: Linear burst mode aligns with 64-byte ATM cell or 256-byte SDH frame boundaries, minimizing address setup overhead. |
| Baseband Signal Processing | Radar Data Acquisition Buffer |
Use Scenario: Real-time FFT window storage and coefficient exchange in LTE eNodeB baseband FPGAs. IC Role / Device Role / Timing Role: Low-latency scratchpad memory interfacing directly with FPGA fabric via dedicated 36-bit bus. Use Value: Fully registered I/O eliminates setup/hold violations at 166 MHz, enabling direct connection without external timing compensation. |
Use Scenario: Capturing high-resolution chirp samples from phased-array radar ADCs before DSP processing. IC Role / Device Role / Timing Role: Burst-capable acquisition buffer synchronizing to radar pulse repetition interval (PRI) clock. Use Value: Interleaved burst mode matches radar's ping-pong memory access pattern, doubling effective bandwidth over linear mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L16PF | 3.3 V supply, 166 MHz, 288K × 18 density, no parity outputs | Lacks DQP pins; requires external parity logic for ECC-critical systems | Select when 3.3 V system integration outweighs parity requirement and density suffices |
| AS7C3256A-16JIN | 2.5 V, 166 MHz, 32K × 8 density, asynchronous interface, no burst or NoBL | Non-pipelined architecture limits throughput to ~83 MT/s; no burst or byte-write support | Choose only for cost-sensitive, low-bandwidth control-plane buffers where latency tolerance >10 ns |
Compared with IDT72V2115L16PF and AS7C3256A-16JIN, CY7C1354CV25-166BZCT uniquely delivers 256K × 36 density with integrated parity, NoBL™ zero-wait-state operation, and 100-pin TQFP compatibility-making it optimal for high-integrity, high-throughput data path buffering where timing determinism and error detection are mandatory.
Availability
CY7C1354CV25-166BZCT is available at Aetrix Electronics and suitable for network packet processors, telecom line cards, baseband signal processors, and radar acquisition systems requiring stable component supply across extended product lifecycles.
Supply support for CY7C1354CV25-166BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and long-term supply commitment for legacy Cypress memory devices.
This part belongs to the NoBL™ SRAM product line, engineered specifically for high-speed, low-latency data buffering in communications infrastructure where deterministic timing and burst efficiency are critical.
FAQ
What is the function of the MODE pin on CY7C1354CV25-166BZCT?
The MODE pin selects burst address sequence behavior at power-up: logic high configures interleaved burst order, while logic low selects linear burst order. This setting is latched internally and remains fixed until reset or power cycle. It directly affects how ADV/LD increments addresses during burst reads/writes and must match the controller's expected pattern to avoid data misalignment.
Does CY7C1354CV25-166BZCT support asynchronous output enable (OE)?
Yes, but OE operates asynchronously only to tri-state outputs; it does not gate data output timing. The device uses internally self-timed output buffer control, so data appears synchronously on the rising clock edge regardless of OE state. OE is used solely for bus contention avoidance during write cycles and does not affect access time or clock-to-output delay specifications.
Can CY7C1354CV25-166BZCT be operated at 200 MHz?
No. This specific speed grade is rated for 166 MHz maximum operation, with 3.5 ns access time and 180 mA operating current specified at that frequency. Attempting 200 MHz operation violates AC timing parameters including tCO (clock-to-output), tSU (data setup), and tH (data hold), risking metastability and data corruption. The 200 MHz variant is CY7C1354CV25-200BZCT, which has tighter internal timing margins.
How does the ZZ pin interact with CEN and clock stopping?
Asserting ZZ places the device in deep sleep mode, reducing current to 40 mA while retaining memory content; CEN remains functional but has no effect unless ZZ is deasserted first. Clock stopping (via CEN) alone maintains full functionality and current draw (~180 mA), whereas ZZ + stopped clock achieves lowest power state. Wake-up from ZZ requires ≥100 ns stabilization before first valid access.
CY7C1354CV25-166BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1354CV25-166BZCT FAQ
1.How can I place an order for CY7C1354CV25-166BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1354CV25-166BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1354CV25-166BZCT reliable?
The price and inventory of CY7C1354CV25-166BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1354CV25-166BZCT is usually 5 days.
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Once your CY7C1354CV25-166BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1354CV25-166BZCT?
For technical support, including CY7C1354CV25-166BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1354CV25-166BZCT requirements.
6.How does Aetrix verify that CY7C1354CV25-166BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1354CV25-166BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1354CV25-166BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1354CV25-166BZCT?
All CY7C1354CV25-166BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1354CV25-166BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1354CV25-166BZCT part is unused and in its original packaging.
Return procedure for CY7C1354CV25-166BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1354CV25-166BZCT Tags

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STMicroelectronics
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Microchip Technology

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Microchip Technology
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STMicroelectronics

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