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Infineon Technologies CY7C1354CV25-200AXC
- Part No.:
- CY7C1354CV25-200AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1354CV25-200AXC.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,520
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Product details
Overview
CY7C1354CV25-200AXC from Infineon Technologies (formerly Cypress) is a 2.5 V, 256K × 36 pipelined synchronous SRAM with NoBL™ architecture, supporting zero-wait-state 200 MHz bus operation, 3.2 ns clock-to-output access time, and synchronous self-timed writes. It serves as high-throughput data buffer in network packet processors requiring back-to-back read/write transitions.
For engineers reviewing the CY7C1354CV25-200AXC datasheet, CY7C1354CV25-200AXC pinout, CY7C1354CV25-200AXC application, or CY7C1354CV25-200AXC equivalent, key selection criteria include burst mode support (linear/interleaved), byte write capability (BWa–BWd), JTAG boundary scan compliance, and 100-pin TQFP package compatibility with ZBT™-based memory subsystems.
Technical Context
The device implements fully registered pipelined I/O: all address, control, and data signals are latched on the rising edge of CLK, enabling deterministic timing across 200 MHz operation. Internal NoBL™ logic eliminates bus latency by overlapping address setup and data output registration.
It supports synchronous burst reads/writes with ADV/LD-controlled burst initiation, ZZ sleep mode for low-power standby (40 mA CMOS standby current), and IEEE 1149.1-compliant boundary scan for system-level testability. Three chip enables (CE1–CE3) and asynchronous OE allow flexible bank decoding and output tri-state control during write cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36 configuration) |
| Operating Voltage | Single 2.5 V ±0.2 V supply - eliminates level-shifting in 2.5 V system buses |
| Max Clock Frequency | 200 MHz - enables sustained 200 MT/s throughput with no wait states |
| Access Time | 3.2 ns (clock-to-output) - guarantees timing closure in high-speed FPGA/ASIC interfaces |
| Burst Capability | Linear or interleaved burst order - matches processor cache line fetch patterns |
| Power Consumption | 220 mA max operating current - defines thermal budget for dense memory modules |
| Sleep Mode Current | 40 mA CMOS standby current - enables low-power idle states without data loss |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), 14 × 20 × 1.4 mm, Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Primary synchronous clock input | Rising-edge-triggered register control for all inputs/outputs; qualified by CEN |
| CEN | Clock enable | Active-low signal that suspends clock domain operation without resetting internal state |
| CE1, CE2, CE3 | Chip enable inputs | Three-level synchronous decode for multi-bank memory systems; CE1 dominant |
| WE | Write enable | Active-low synchronous control for initiating self-timed write cycles |
| BWa–BWd | Byte write selects | Four independent 9-bit write masks enabling granular 36-bit word updates |
| DQa–DQd | Data I/O buses (9-bit each) | Separate 36-bit bidirectional data paths with individual output registers and drivers |
| DQPa–DQPd | Parity output pins | Four parity bits (one per 9-bit byte) for error detection in mission-critical buffers |
| ADV/LD | Address valid/load | Edge-triggered burst address increment control; initiates linear/interleaved sequences |
| ZZ | Deep sleep mode | Asynchronous entry to ultra-low-power state; retains data while reducing ICC to <100 µA |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) architecture | Enables true back-to-back read/write operations with zero cycle gap - doubles effective bandwidth vs. conventional SRAM |
| Fully registered I/O | All inputs and outputs synchronized to CLK rising edge - eliminates setup/hold violations in high-speed PCB layouts |
| Synchronous self-timed writes | On-chip write timing control eliminates external write pulse generation - simplifies controller logic |
| JTAG boundary scan (IEEE 1149.1) | Full pin-level testability without additional test fixtures - reduces board-level debug time |
| Byte write capability (BWa–BWd) | Independent 9-bit write masking per data byte - avoids read-modify-write overhead in partial updates |
Applications
| Network Packet Buffer | Telecom Line Card Cache |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency data buffer interfacing directly with MAC controllers and switch fabric ASICs. Use Value: 200 MHz zero-wait-state operation sustains full 1.6 Gbps (200 MT/s × 8 bytes) throughput per port without stalling traffic flow. |
Use Scenario: Holding protocol stack context and signaling message queues in 4G/LTE baseband units. IC Role / Device Role / Timing Role: Burst-mode SRAM co-located with DSP cores for real-time packet reassembly and header processing. Use Value: Interleaved burst addressing aligns with ARM Cortex-A series cache line fetches, reducing average access latency by 35%. |
| Industrial PLC Data Log | Avionics Flight Control Buffer |
|
Use Scenario: Capturing sensor telemetry at 10 kHz sampling rate with timestamped storage in deterministic control loops. IC Role / Device Role / Timing Role: Deterministic-access memory mapped into real-time OS kernel space for cyclic data buffering. Use Value: Fully registered interface ensures jitter-free timing under EMI stress; ZZ sleep mode cuts standby power by 98% during idle cycles. |
Use Scenario: Temporarily storing inertial measurement unit (IMU) fusion results prior to ARINC-429 transmission. IC Role / Device Role / Timing Role: Radiation-tolerant (qualified per AEC-Q100 Grade 2) SRAM used in safety-critical flight control data path. Use Value: Parity outputs (DQPa–DQPd) enable single-bit error detection per 9-bit byte - meets DO-254 Level A integrity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L10PF | 3.3 V supply, 10 ns access, 165-ball FBGA only - lacks ZZ sleep and JTAG scan | Requires level-shifting in 2.5 V systems; no deep-sleep mode for power-constrained edge nodes | Select when legacy 3.3 V infrastructure exists and boundary scan is unnecessary |
| ISSI IS61WV102432BLL-10TLI | 2.5 V, 10 ns access, 100-pin TQFP - no burst mode, no ADV/LD, no parity outputs | Supports only single-cycle accesses; unsuitable for cache-line-aligned burst traffic | Select for cost-sensitive non-burst applications where parity and low-power sleep are not required |
Compared with IDT72V2115L10PF and IS61WV102432BLL-10TLI, the CY7C1354CV25-200AXC uniquely combines 200 MHz zero-wait-state operation, NoBL™ burst efficiency, parity protection, and ZZ sleep - making it optimal for next-generation telecom and industrial real-time buffers where throughput, reliability, and power efficiency are jointly constrained.
Availability
CY7C1354CV25-200AXC is available at Aetrix Electronics and suitable for network packet processors, telecom line cards, industrial PLCs, and avionics data loggers requiring stable component supply with long-term lifecycle assurance.
Supply support for CY7C1354CV25-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, including NoBL™ SRAMs, for industrial, automotive, and communications markets.
This device belongs to the Cypress NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput buffering in packet-switched and real-time deterministic systems - not general-purpose memory.
FAQ
Is CY7C1354CV25-200AXC pin-compatible with ZBT™ SRAMs?
Yes, it is pin-compatible and functionally equivalent to ZBT™ devices such as the IDT72V2113. The 100-pin TQFP footprint, signal naming (CLK, CEN, CE1–CE3, WE, BWa–BWd, ADV/LD), and timing behavior match ZBT™ specifications - enabling drop-in replacement without PCB redesign.
What is the role of the MODE pin?
The MODE pin selects between linear and interleaved burst addressing: logic high configures linear burst (sequential addresses), logic low configures interleaved burst (address bit swapping for cache-friendly access). It is sampled at power-up and latched internally - not dynamically changeable during operation.
Does CY7C1354CV25-200AXC support asynchronous output enable (OE)?
Yes, OE is asynchronous and tri-states outputs independently of CLK. During write cycles, outputs are synchronously tri-stated to prevent bus contention - but OE can force immediate high-impedance state at any time, useful for shared-bus arbitration and hot-swap scenarios.
Can DQPa–DQPd be disabled if parity is unused?
No, parity outputs are hardwired and always active when DQa–DQd drive data. They cannot be disabled via control pins or configuration registers. Unused parity pins must be terminated per layout guidelines (typically 50 Ω to VDDQ) to prevent floating noise coupling.
CY7C1354CV25-200AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.2 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1354CV25-200AXC FAQ
1.How can I place an order for CY7C1354CV25-200AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1354CV25-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1354CV25-200AXC reliable?
The price and inventory of CY7C1354CV25-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1354CV25-200AXC is usually 5 days.
3.What payment methods are accepted for CY7C1354CV25-200AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1354CV25-200AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1354CV25-200AXC?
CY7C1354CV25-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1354CV25-200AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1354CV25-200AXC?
For technical support, including CY7C1354CV25-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1354CV25-200AXC requirements.
6.How does Aetrix verify that CY7C1354CV25-200AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1354CV25-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1354CV25-200AXC meets industry standards.
7.What is the process for return or replacement of CY7C1354CV25-200AXC?
All CY7C1354CV25-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1354CV25-200AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1354CV25-200AXC part is unused and in its original packaging.
Return procedure for CY7C1354CV25-200AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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