Infineon Technologies CY7C1355B-100AC

Overview

CY7C1355B-100AC from Cypress Semiconductor is a 9-Mbit synchronous flow-through SRAM (256K × 36 organization) with No Bus Latency™ architecture, designed for high-throughput memory buffering in networking and telecom data paths. It supports 100-MHz zero-wait-state operation, delivers 7.5 ns clock-to-output delay, features byte-write capability across four 9-bit data groups, and operates with 3.3V core/I/O supply.

For engineers reviewing the CY7C1355B-100AC datasheet, CY7C1355B-100AC pinout, CY7C1355B-100AC application, or CY7C1355B-100AC equivalent, key selection criteria include burst order configuration (linear/interleaved), synchronous chip enable timing (CE1/CE3 active-low, CE2 active-high), ZZ sleep mode behavior, and TQFP-100 package pin compatibility with ZBT™-class systems.

Technical Context

The device implements a synchronous flow-through architecture with registered address, control, and data inputs sampled on the rising edge of CLK, qualified by CEN. Burst addressing is driven by a two-bit internal counter using A[1:0], configurable via MODE pin for linear or interleaved sequences.

Write operations are self-timed and synchronized to CLK, with byte write select (BWA–BWD) controlling 9-bit segments independently. Output drivers are synchronously three-stated during write data cycles and upon deselection, eliminating bus contention without requiring external OE timing coordination.

Key Specifications

Pinout & Package

Package: 100-lead Thin Quad Flat Package (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, thermally enhanced with exposed pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with IDT72V2115L10PF and IS61WV102436BLL-100TQLI, the CY7C1355B-100AC uniquely delivers zero-wait-state back-to-back operation via NoBL™ architecture, retains data in ZZ sleep mode, and supports mixed-polarity chip enables for flexible bank decoding-critical for telecom and networking designs demanding deterministic latency.

Availability

CY7C1355B-100AC is available at Aetrix Electronics and suitable for packet buffering in switch ASICs, line card memory in telecom routers, and PCI Express endpoint buffering requiring stable component supply and long-term obsolescence planning.

Supply support for CY7C1355B-100AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C1355B belongs to Cypress's NoBL™ SRAM product line, engineered specifically to eliminate bus latency in high-speed packet-processing and real-time control systems where deterministic memory access is mandatory.

FAQ

What is the function of the MODE pin on CY7C1355B-100AC?

The MODE pin selects burst addressing order: tied to GND for linear burst (incrementing addresses), or to VDD/floating for interleaved burst (bit-reversed address sequencing). This setting is latched at power-up and remains fixed until reset. It directly affects how ADV/LD advances the internal burst counter and must match the expected pattern of the memory controller.

How does the ZZ pin behave during sleep mode?

When ZZ is driven HIGH, the device enters a non-time-critical sleep state with full data retention and reduced current draw (~30 mA standby drops further). Clock and control inputs are ignored except for ZZ itself; wake-up occurs synchronously on the next valid CLK edge after ZZ returns LOW. No initialization sequence is required post-wake.

Can CY7C1355B-100AC operate with mixed voltage supplies?

Yes - it requires 3.3V ± 0.3V on VDD (core) and VDDQ (I/O), with both rails referenced to the same ground. There is no separate 2.5V option for this -100AC speed grade; the 2.5V I/O support mentioned in general family docs applies only to other variants (e.g., -133AC with dual-voltage option). All I/Os are LVTTL-compatible at 3.3V.

Is JTAG boundary scan supported in the TQFP package?

No - JTAG (TDO, TDI, TMS, TCK) is available only on BGA and fBGA packages (119-ball and 165-ball). The 100-lead TQFP package omits these pins entirely; boundary scan testing is not possible in this variant. System-level test strategies must rely on functional I/O verification or external boundary-scan masters on adjacent devices.