Infineon Technologies CY7C1355C-100AXC

Overview

CY7C1355C-100AXC from Cypress Semiconductor is a 9-Mbit (256K × 36) synchronous flow-through SRAM with NoBL™ architecture, designed for high-throughput back-to-back read/write operations in networking and telecom data paths. It operates at 133 MHz with zero wait states, delivers 6.5 ns clock-to-output delay, supports byte write via four BWx inputs, and uses 3.3 V/2.5 V I/O supply (VDDQ).

For engineers reviewing the CY7C1355C-100AXC datasheet, CY7C1355C-100AXC pinout, CY7C1355C-100AXC application, or CY7C1355C-100AXC equivalent, key selection criteria include burst order control (linear/interleaved), synchronous self-timed write timing, three chip enables for depth expansion, and JTAG boundary scan support in BGA packages.

Technical Context

The CY7C1355C-100AXC implements a synchronous flow-through architecture with registered address, data, and control inputs sampled on the rising edge of CLK, qualified by CEN. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write transfers on every clock cycle without dead cycles.

Burst operation is controlled by ADV/LD and MODE pins: MODE selects linear or interleaved order using A0/A1; ADV/LD loads or increments the internal two-bit burst counter. Write sequencing uses synchronous self-timed circuitry with WE and four active-low byte write enables (BWA–BWD), while OE provides asynchronous output enable with automatic tri-state during write data phases.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with IDT72V2115L133PFI and IS61WV102436BLL-133TQLI, the CY7C1355C-100AXC uniquely combines 256K × 36 density, MODE-configurable burst order, IEEE 1149.1 JTAG, and ZZ sleep - making it optimal for space-constrained, testable, and power-aware telecom and networking modules.

Availability

CY7C1355C-100AXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffers, and industrial real-time controller cache applications requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1355C-100AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable systems-on-chip for industrial, automotive, and communications markets.

The CY7C1355C belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-wait-state, high-frequency data buffering in packet-switched infrastructure and real-time signal processing systems.

FAQ

What is the function of the MODE pin on CY7C1355C-100AXC?

The MODE pin selects burst access order: tied to GND for linear burst (0,1,2,3), or to VDD/floating for interleaved burst (0,2,1,3). This setting is sampled at power-up and remains static during operation, directly determining how the internal two-bit burst counter sequences A0/A1 for consecutive reads/writes without re-driving addresses.

How does the ZZ pin affect power consumption and data retention?

When ZZ is driven HIGH, the device enters non-time-critical sleep mode with full data retention and standby current reduced to ≤40 mA. Data integrity is preserved indefinitely under recommended operating conditions. The pin has an internal pull-down, so floating ZZ defaults to active-LOW normal operation - no external biasing required unless sleep mode is actively used.

Can CY7C1355C-100AXC operate with mixed VDD (core) and VDDQ (I/O) voltages?

Yes - VDD must be 3.3 V ± 0.3 V for core logic, while VDDQ supports either 3.3 V or 2.5 V ± 0.2 V for I/O drivers. This dual-supply configuration allows direct interfacing with 2.5 V FPGAs or 3.3 V ASICs without level shifters, provided VDDQ is stable before VDD during power-up and meets tVDDQVDD timing requirements per datasheet.

Is JTAG boundary scan supported in the 100-pin TQFP package?

No - TDO, TDI, TCK, and TMS pins are not bonded out in the 100-pin TQFP package. JTAG functionality is only available in the 119-ball and 165-ball BGA variants. For TQFP-based designs requiring test access, external boundary scan must be implemented at the board level using adjacent test-capable components.