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Infineon Technologies CY7C1355C-100AXCT
- Part No.:
- CY7C1355C-100AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1355C-100AXCT.pdf
- Description:
- IC SRAM 9MBIT PAR 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,858
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Product details
Overview
CY7C1355C-100AXCT from Cypress Semiconductor is a 9-Mbit (256K × 36) synchronous flow-through SRAM with NoBL™ architecture, supporting true back-to-back read/write operations at 100 MHz with zero wait states. It features 3.3V core and I/O supply, 7.5 ns clock-to-output delay, registered inputs, byte-write capability, and three chip enables for depth expansion in high-bandwidth memory subsystems such as network packet buffers and DSP data caches.
For engineers reviewing the CY7C1355C-100AXCT datasheet, CY7C1355C-100AXCT pinout, CY7C1355C-100AXCT application, or CY7C1355C-100AXCT equivalent, key selection criteria include burst mode configuration (linear/interleaved), synchronous self-timed write timing, ZZ sleep mode behavior, and TQFP-100 pin compatibility with ZBT™-class interfaces.
Technical Context
The CY7C1355C-100AXCT implements a synchronous flow-through architecture where all inputs-including address, WE, BWx, CE1–CE3, ADV/LD, and CEN-are registered on the rising edge of CLK. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without dead cycles, delivering data on every clock edge.
Burst operation is controlled by the MODE pin (linear vs. interleaved) and the two-bit internal counter driven by A0/A1; ADV/LD determines whether to load a new address or increment the counter. Output drivers are synchronously tri-stated during write data phases and upon chip deselect, independent of OE state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36 configuration) |
| Max Clock Frequency | 100 MHz - supports sustained zero-wait-state bus operation |
| Access Time (tCDV) | 7.5 ns - maximum clock-to-output delay at 100 MHz |
| VDD / VDDQ | 3.3 V core / 3.3 V I/O - single-supply interface simplifies power design |
| Byte Write Control | Four active-low BWx pins (BWA–BWD) - enables selective 8-bit writes within 36-bit word |
| Chip Enable Logic | Three synchronous enables: CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW) - enables flexible bank decoding |
| Power Management | ZZ pin enables non-time-critical sleep mode with data retention - reduces standby current to 40 mA |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), RoHS-compliant, JEDEC-standard footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous Address Input | Latched on rising CLK edge; A0/A1 drive internal 2-bit burst counter |
| BWA–BWD | Synchronous Byte Write Select | Active-LOW per-byte mask; qualified with WE to enable partial-word writes |
| CE1, CE3 | Synchronous Chip Enable | Active-LOW enables; CE2 is active-HIGH - allows 3-signal depth expansion |
| CLK, CEN | Clock & Clock Enable | CEN masks CLK when HIGH; preserves internal state without cycle extension |
| ADV/LD | Advance/Load Control | HIGH advances burst counter; LOW loads new address - critical for burst initialization |
| OE | Asynchronous Output Enable | Active-LOW enables output drivers; masked automatically during write data phase |
| ZZ | Asynchronous Sleep Input | Active-HIGH enters low-power retention mode; internal pull-down ensures safe default |
| DQPA–DQPD | Bidirectional Data I/O (Parity) | 36-bit data bus with parity lanes; direction controlled by OE and internal write logic |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables unlimited true back-to-back read/write transitions with no dead cycles - increases effective memory bandwidth by >30% vs. conventional SRAMs |
| Synchronous Self-Timed Writes | On-chip write timing control eliminates external write-pulse width constraints - simplifies timing closure in FPGA-attached systems |
| Configurable Burst Order | MODE pin selects linear or interleaved burst sequence - matches CPU cache line ordering requirements without external logic |
| Automatic Output Tri-State | Outputs disable synchronously during write data phase and chip deselect - prevents bus contention without OE coordination |
| JTAG Boundary Scan Support | IEEE 1149.1-compliant TDI/TDO/TCK/TMS pins - enables in-system testability and board-level debug on BGA variants |
Applications
| Network Packet Buffering | DSP Data Cache |
|---|---|
|
Use Scenario: High-speed Ethernet switch ASICs buffering variable-length packets before classification and forwarding. IC Role / Device Role / Timing Role: Primary data buffer interfacing directly to 100 MHz system bus with deterministic 7.5 ns read latency. Use Value: NoBL™ architecture sustains full 100 MHz throughput across mixed read/write traffic patterns, eliminating packet drop under bursty ingress load. |
Use Scenario: Real-time audio processing engine requiring low-latency access to coefficient tables and intermediate sample storage. IC Role / Device Role / Timing Role: Synchronous data scratchpad with burst-read support for 4-sample FFT windows and byte-write updates to filter coefficients. Use Value: Linear burst mode delivers four consecutive samples in one address setup, reducing address bus overhead by 75% per window. |
| Telecom Line Card Control | Industrial Motion Controller |
|
Use Scenario: SONET/SDH framer subsystem storing frame headers, CRC values, and pointer adjustment data. IC Role / Device Role / Timing Role: Dual-port-like behavior via CE partitioning - CE1/CE2 manage host processor access while CE3 handles framer DMA bursts. Use Value: Three independent chip enables allow seamless time-division multiplexing between control plane and data plane without arbitration logic. |
Use Scenario: CNC machine controller buffering motion trajectory points and real-time I/O status registers. IC Role / Device Role / Timing Role: Deterministic memory interface for servo loop execution at 10 kHz update rate with guaranteed sub-8 ns read response. Use Value: ZZ sleep mode cuts standby power during idle axis movement, extending thermal margin in enclosed cabinet environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V255L10PF | 512K × 18 configuration, 10 ns access, 3.3V only, no ZZ sleep mode | Requires two devices for 256K × 36 width; lacks automatic output tri-state during writes | Select when 18-bit bus width suffices and JTAG testability is not required |
| ISSI IS61WV25636BLL-10TLI | 256K × 36, 10 ns access, 3.3V/2.5V I/O, no burst counter or MODE pin | Fixed linear burst only; no interleaved mode; no ADV/LD-controlled address loading | Choose for cost-sensitive designs where burst flexibility and NoBL™ latency advantage are non-critical |
Compared with IDT72V255L10PF and IS61WV25636BLL-10TLI, the CY7C1355C-100AXCT uniquely delivers true zero-wait-state back-to-back operation, configurable burst order, and integrated sleep-mode power control - making it optimal for latency-constrained, multi-master memory subsystems.
Availability
CY7C1355C-100AXCT is available at Aetrix Electronics and suitable for network packet buffering, DSP data caching, telecom line card control, and industrial motion control applications requiring stable component supply and long-term manufacturability.
Supply support for CY7C1355C-100AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.
The CY7C1355C belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, burst-capable memory interfaces in high-speed digital signal processing and packet-forwarding architectures.
FAQ
What is the function of the MODE pin on CY7C1355C-100AXCT?
The MODE pin configures the on-chip burst counter's sequence: tied LOW to ground it selects linear burst order (0,1,2,3); tied HIGH to VDD or left floating it selects interleaved order (0,2,1,3). This setting is sampled at power-up and remains static during operation unless reconfigured externally. It directly determines how successive burst reads traverse the memory array without requiring software intervention.
How does the ZZ pin affect power consumption and data retention?
When ZZ is driven HIGH, the device enters a non-time-critical sleep mode that reduces ICC to ≤40 mA while preserving all stored data. The internal pull-down ensures safe LOW default if unconnected. Data retention is guaranteed over commercial temperature range (0°C to +70°C) with VDD ≥ 2.0 V, and the device resumes normal operation within one clock cycle after ZZ returns LOW.
Can CY7C1355C-100AXCT operate with mixed VDD and VDDQ voltages?
No - the CY7C1355C-100AXCT requires VDD = VDDQ = 3.3 V ±0.3 V. Unlike later-generation SRAMs, it does not support split-rail I/O operation. Applying 2.5 V to VDDQ while maintaining 3.3 V on VDD violates absolute maximum ratings and may cause input threshold instability or latch-up.
Is the TQFP-100 package of CY7C1355C-100AXCT JTAG-capable?
No - JTAG signals (TDO, TDI, TCK, TMS) are only present on the 119-ball BGA and 165-ball FBGA packages. The TQFP-100 variant omits these pins entirely; boundary scan testing is not supported in this package. Designers requiring JTAG must select the BGA variants (e.g., CY7C1355C-100BAXCT).
CY7C1355C-100AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1355C-100AXCT FAQ
1.How can I place an order for CY7C1355C-100AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1355C-100AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1355C-100AXCT reliable?
The price and inventory of CY7C1355C-100AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1355C-100AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1355C-100AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1355C-100AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1355C-100AXCT?
CY7C1355C-100AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1355C-100AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1355C-100AXCT?
For technical support, including CY7C1355C-100AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1355C-100AXCT requirements.
6.How does Aetrix verify that CY7C1355C-100AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1355C-100AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1355C-100AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1355C-100AXCT?
All CY7C1355C-100AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1355C-100AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1355C-100AXCT part is unused and in its original packaging.
Return procedure for CY7C1355C-100AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1355C-100AXCT Tags
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