Infineon Technologies CY7C1355C-133AXC
- Part No.:
- CY7C1355C-133AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1355C-133AXC.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,700
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Product details
Overview
CY7C1355C-133AXC from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM with NoBL™ architecture, configured as 256K × 36-bit, operating at 133 MHz with zero wait states and 6.5 ns clock-to-output delay. It features registered inputs, byte write capability, three chip enables (CE1–CE3), and supports burst reads in linear or interleaved order for high-throughput memory subsystems in network packet buffers.
For engineers reviewing the CY7C1355C-133AXC datasheet, CY7C1355C-133AXC pinout, CY7C1355C-133AXC application, or CY7C1355C-133AXC equivalent, key selection criteria include synchronous self-timed writes, JTAG boundary-scan compliance (IEEE 1149.1), ZZ sleep mode power management, and TQFP-100 package compatibility with ZBT™-class timing interfaces.
Technical Context
This SRAM implements a true flow-through architecture where read and write operations execute back-to-back without bus latency-data transfers occur on every clock edge. Its internal logic uses rising-edge clocked input registers, synchronous self-timed write control, and tri-state output drivers qualified by OE and clock enable (CEN).
The device supports both single and burst access modes, with programmable burst order (linear/interleaved), automatic output buffer control eliminating external OE timing constraints, and depth expansion via three independent chip enables. Sleep mode is entered via ZZ pin or CE deselection, reducing standby current to 40 mA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36-bit organization) |
| Max Clock Frequency | 133 MHz - enables zero-wait-state operation in high-speed bus systems |
| Access Time (tAC) | 6.5 ns - defines minimum clock-to-valid-data delay for timing closure |
| I/O Voltage (VDDQ) | 3.3 V or 2.5 V - allows interoperability with mixed-voltage ASIC/FPGA I/O banks |
| Burst Capability | Linear or interleaved - matches CPU/DMA burst patterns for cache-line-aligned transfers |
| Power Management | ZZ sleep mode - reduces active standby current to 40 mA without losing data |
| JTAG Support | IEEE 1149.1 compliant - enables board-level test and debug without additional probes |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Primary synchronous clock input | Rising-edge-triggered register control for all address/data/control signals |
| CEN | Clock enable | Suspends internal clock domain without affecting state; extends previous cycle |
| CE1, CE2, CE3 | Chip enable inputs | Three independent enables allow seamless depth expansion across multiple devices |
| OE | Asynchronous output enable | Tri-states DQ outputs independently of clock; avoids bus contention during writes |
| BWA–BWD | Byte write select | Four independent 9-bit write masks for granular 36-bit word updates |
| ZZ | Deep power-down control | Enters ultra-low-power mode (40 mA standby) while retaining memory contents |
| DQPA–DQPD | Data I/O groups (A–D) | Four 9-bit bidirectional data buses aligned to byte lanes for burst transfer efficiency |
| ADV/LD | Address valid/load | Qualifies address latch timing for burst sequence initiation |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) architecture | Eliminates dead cycles between consecutive read/write operations, enabling 100% bus utilization at 133 MHz |
| Registered inputs with synchronous control | Ensures deterministic setup/hold timing across temperature/voltage, simplifying FPGA interface design |
| Internal self-timed write circuitry | Removes external write pulse width constraints; guarantees reliable data capture independent of system timing margins |
| Three chip enables + byte write masking | Supports scalable memory banks and partial-word updates without read-modify-write overhead |
| JTAG boundary scan (IEEE 1149.1) | Enables automated PCB test coverage for solder joint integrity and interconnect verification |
Applications
| Network Packet Buffer | Telecom Line Card Cache |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet frames in multi-gigabit switch ASICs before classification or forwarding. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer with deterministic 6.5 ns access. Use Value: Enables full-line-rate buffering at 10 Gbps+ with zero dropped packets due to back-to-back read/write throughput. | Use Scenario: Caching protocol headers and session state in carrier-grade DSLAM or OLT line cards. IC Role / Device Role / Timing Role: Burst-capable SRAM interfacing directly with telecom DSPs requiring linear/interleaved address sequences. Use Value: Matches DSP burst length requirements while maintaining sub-7 ns timing for real-time QoS processing. |
| Industrial PLC Data Log | Medical Imaging Frame Store |
Use Scenario: Capturing sensor time-series data at 1 MS/s in ruggedized programmable logic controllers. IC Role / Device Role / Timing Role: Synchronous SRAM providing jitter-free, deterministic write bursts synchronized to ADC sampling clock. Use Value: Guarantees lossless acquisition over extended periods using ZZ sleep mode between logging intervals. | Use Scenario: Temporary storage of uncompressed CT/MRI pixel frames (up to 4K × 4K × 16-bit) during reconstruction pipeline staging. IC Role / Device Role / Timing Role: High-density flow-through SRAM serving as frame buffer between GPU-accelerated processors and display engines. Use Value: Delivers sustained 1.6 GB/s bandwidth (133 MHz × 36-bit) required for real-time volumetric rendering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L133BG | Same 256K × 36 organization and 133 MHz speed, but uses ZBT™ architecture with separate write/read clocks | Requires dual-clock routing and external OE control; lacks integrated ZZ sleep mode | Prefer when legacy ZBT™ system compatibility is mandatory and power budget allows higher standby draw |
| ISSI IS61WV102436BLL-133TQLI | Pin-compatible 256K × 36 SRAM with identical TQFP-100 footprint and 133 MHz rating, but no JTAG support | Missing IEEE 1149.1 boundary scan; lower max operating current (220 mA vs. 250 mA) | Choose for cost-sensitive industrial designs where board test coverage is handled externally |
Compared with IDT72V2115L133BG and IS61WV102436BLL-133TQLI, the CY7C1355C-133AXC uniquely integrates NoBL™ latency elimination, ZZ deep-sleep control, and production-ready JTAG testability-making it optimal for new designs prioritizing timing determinism, power efficiency, and manufacturing testability.
Availability
CY7C1355C-133AXC is available at Aetrix Electronics and suitable for network packet buffers, telecom line card caches, and industrial PLC data loggers requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for CY7C1355C-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for industrial, automotive, and communications markets.
This device belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for high-throughput, low-latency memory subsystems in networking and telecom infrastructure where deterministic timing and burst efficiency are critical.
FAQ
What is the difference between CY7C1355C and CY7C1357C?
The CY7C1355C is organized as 256K × 36 bits (9 Mbit), while the CY7C1357C is 512K × 18 bits (9 Mbit) - same density but different width/depth mapping. They share identical timing, pinout (in TQFP), and feature set, but require different address decoding logic due to distinct memory geometry.
Does CY7C1355C-133AXC support 2.5 V I/O operation?
Yes - VDDQ is independently powered and supports either 3.3 V or 2.5 V, allowing direct interface with 2.5 V FPGAs or ASICs. VDD remains at 3.3 V for core logic; only the DQ pins and associated I/O circuitry operate at the selected VDDQ level.
How does the ZZ pin function during sleep mode?
Asserting ZZ places the device in deep power-down mode, reducing ICC to 40 mA while retaining all stored data. The part wakes instantly upon ZZ deassertion, with no initialization delay - unlike asynchronous SRAMs that require recovery time after power-up.
Is JTAG boundary scan enabled by default?
Yes - IEEE 1149.1 boundary scan is factory-enabled and active whenever TCK is toggled with TMS = 1. It can be disabled via the JTAG instruction register if board-level test is not required, but no hardware modification is needed for standard operation.
CY7C1355C-133AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1355C-133AXC FAQ
1.How can I place an order for CY7C1355C-133AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1355C-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1355C-133AXC reliable?
The price and inventory of CY7C1355C-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1355C-133AXC is usually 5 days.
3.What payment methods are accepted for CY7C1355C-133AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1355C-133AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1355C-133AXC?
CY7C1355C-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1355C-133AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1355C-133AXC?
For technical support, including CY7C1355C-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1355C-133AXC requirements.
6.How does Aetrix verify that CY7C1355C-133AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1355C-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1355C-133AXC meets industry standards.
7.What is the process for return or replacement of CY7C1355C-133AXC?
All CY7C1355C-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1355C-133AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1355C-133AXC part is unused and in its original packaging.
Return procedure for CY7C1355C-133AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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