Infineon Technologies CY7C1356C-166AXI
- Part No.:
- CY7C1356C-166AXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1356C-166AXI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:375
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Product details
Overview
CY7C1356C-166AXI from Cypress Semiconductor is a 9-Mbit (512K × 18) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It operates at 166 MHz with zero wait states, supports 3.3 V core supply and 2.5/3.3 V I/O, and delivers 3.5 ns clock-to-output access time.
For engineers reviewing the CY7C1356C-166AXI datasheet, CY7C1356C-166AXI pinout, CY7C1356C-166AXI application, or CY7C1356C-166AXI equivalent, this device is selected for systems requiring deterministic burst read/write timing, byte-selectable writes, and JTAG boundary-scan testability in space-constrained TQFP layouts.
Technical Context
The CY7C1356C-166AXI implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers synchronized to CLK. Its NoBL™ logic eliminates bus latency by enabling back-to-back read/write operations without wait states.
Burst operation supports both linear and interleaved orders via the MODE strap pin; write cycles use on-chip self-timed control with synchronous byte enables (BWa–BWb); output drivers are synchronously tristated during write data phases to prevent bus contention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (512K × 18 configuration), enabling compact high-bandwidth buffer storage for 18-bit data paths. |
| Max Clock Frequency | 166 MHz - guarantees full-speed operation in systems with 6 ns clock period timing budgets. |
| Access Time | 3.5 ns - defines worst-case clock-to-output delay for timing closure in synchronous bus designs. |
| VDD Supply | 3.3 V ± 0.3 V - requires single-core rail, simplifying power delivery versus dual-voltage SRAMs. |
| VDDQ Supply | 2.5 V or 3.3 V - allows interface voltage matching to adjacent logic (e.g., ASIC I/O or FPGA banks). |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm) - provides leaded, rework-friendly footprint with verified thermal performance up to 85°C ambient. |
| Standby Current | 40 mA max - ensures low static power in idle states for power-sensitive telecom modules. |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), RoHS-compliant, body size 14 mm × 20 mm × 1.4 mm, exposed pad not present.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Input | 19-bit synchronous address bus sampled on CLK rising edge; supports full 512K-word addressing. |
| BWa, BWb | Byte Write Select | Active-low synchronous enables controlling 9-bit DQa and 9-bit DQb groups independently during writes. |
| CLK | Clock Input | Rising-edge-triggered master clock; qualified by CEN - only active when CEN = LOW. |
| CEN | Clock Enable | Asynchronous enable that masks CLK without deselecting device; extends previous cycle for timing margin. |
| CE1, CE3 | Chip Enable (active LOW) | Synchronous chip select pair; CE2 (active HIGH) forms 3-signal bank decode for multi-SRAM systems. |
| DQa–DQb | Data I/O (18-bit) | Bidirectional synchronous data bus; direction controlled by OE and internal write/read state machine. |
| OE | Output Enable | Asynchronous control - overrides internal logic to force tristate during debug or bus arbitration. |
| MODE | Strap Input | Static configuration pin selecting linear vs. interleaved burst order; tied HIGH/LOW at power-up. |
| ZZ | Deep Sleep Control | Asynchronous entry to low-power sleep mode (<5 mA ICC); retains memory contents. |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables true back-to-back read/write transitions with no wait states - critical for packet buffering in switch fabric controllers. |
| Byte-Write Capability (BWa/BWb) | Allows partial 9-bit word updates without read-modify-write cycles - reduces bus traffic in protocol header manipulation. |
| Synchronous Self-Timed Writes | Eliminates external write pulse timing constraints - simplifies PCB layout and timing analysis for high-speed buses. |
| JTAG Boundary Scan (IEEE 1149.1) | Enables production-level interconnect testing on dense PCBs without physical probe access. |
| Flexible I/O Voltage (VDDQ) | Supports 2.5 V or 3.3 V signaling - permits direct interfacing with legacy 2.5 V FPGAs or modern 3.3 V ASICs. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/L3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-speed synchronous SRAM acting as first-level packet buffer with deterministic 166 MHz burst reads/writes. Use Value: Eliminates pipeline stalls during rapid frame ingress/egress, sustaining wire-speed throughput across 10 Gbps ports. |
Use Scenario: Holding ATM cell headers and payload fragments in OC-192 SONET framer subsystems. IC Role / Device Role / Timing Role: Burst-mode memory supporting interleaved address sequences required by SONET overhead processing engines. Use Value: Matches exact burst order (linear/interleaved) mandated by framer ASICs, avoiding software-based address remapping. |
| Baseband Processor Cache | Industrial PLC Data Logging |
|
Use Scenario: Temporary storage of decoded TDMA burst data in 3G/4G base station transceivers. IC Role / Device Role / Timing Role: Low-latency pipelined SRAM interfaced directly to DSP memory-mapped bus with CEN-controlled clock gating. Use Value: Reduces average memory access latency by 40% compared to asynchronous SRAM, improving real-time scheduling fidelity. |
Use Scenario: Buffering sensor acquisition streams in modular automation controllers prior to SD card write. IC Role / Device Role / Timing Role: Deterministic write buffer with ZZ sleep mode enabling microamp-level quiescent current between logging intervals. Use Value: Extends battery life in remote field units while maintaining guaranteed 166 MHz burst write capability during acquisition bursts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L16PF | 512K × 18, 166 MHz, but uses QDR-II+ architecture with separate read/write clocks and no ZZ sleep mode. | Lacks deep-sleep capability and MODE-configurable burst order; requires dual-clock routing. | Select when system already uses QDR-II+ infrastructure and prioritizes peak bandwidth over power efficiency. |
| ISSI IS61WV51218BLL-166TQLI | 512K × 18, 166 MHz, but lacks JTAG boundary scan, MODE pin, and ZZ sleep; only supports linear burst. | Missing IEEE 1149.1 testability and flexible burst ordering - limits use in high-reliability telecom BOMs. | Choose for cost-sensitive industrial controls where JTAG and sleep modes are non-critical. |
Compared with IDT72V2115L16PF and IS61WV51218BLL-166TQLI, the CY7C1356C-166AXI uniquely combines JTAG testability, programmable burst order, and deep-sleep mode in a pin-compatible ZBT-equivalent package - making it optimal for telecom and networking designs requiring production test coverage and dynamic power management.
Availability
CY7C1356C-166AXI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and baseband processor cache applications requiring stable component supply and long-term industrial lifecycle support.
Supply support for CY7C1356C-166AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC, and USB solutions for industrial, automotive, and communications markets.
The CY7C1356C belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-frequency memory interfacing in telecom infrastructure and packet-switching equipment.
FAQ
What is the function of the MODE pin on CY7C1356C-166AXI?
The MODE pin is a static configuration input that selects burst address order: tied HIGH for interleaved burst (required by many framer ASICs), pulled LOW for linear burst. It is sampled at power-up and cannot be changed dynamically during operation. This pin eliminates need for external logic to generate burst addresses, reducing design complexity and PCB area.
Does CY7C1356C-166AXI support 2.5 V I/O operation with 3.3 V core supply?
Yes - VDD is fixed at 3.3 V ± 0.3 V for core logic, while VDDQ accepts either 2.5 V ± 0.2 V or 3.3 V ± 0.3 V to match interfacing logic voltage levels. The datasheet specifies separate AC/DC characteristics for each VDDQ condition, and both are fully supported in the 100-pin TQFP package without derating.
How does the ZZ (sleep) mode affect data retention and wake-up time?
In ZZ mode, ICC drops to ≤5 mA while retaining full memory contents; wake-up is asynchronous and completes within one CLK cycle after ZZ is deasserted. No initialization sequence is required - the device resumes normal operation immediately upon exit, preserving burst counter state and pending transactions.
Is the CY7C1356C-166AXI pin-compatible with ZBT SRAMs?
Yes - it is explicitly designed as pin-compatible and functionally equivalent to ZBT SRAMs such as the IDT ZBT-18V919. Signal mapping (A0–A18, BWa/BWb, CE1/CE2/CE3, CLK, CEN, OE, DQa–DQb) matches ZBT footprints, enabling drop-in replacement in existing designs without layout changes.
CY7C1356C-166AXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1356C-166AXI FAQ
1.How can I place an order for CY7C1356C-166AXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1356C-166AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1356C-166AXI reliable?
The price and inventory of CY7C1356C-166AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1356C-166AXI is usually 5 days.
3.What payment methods are accepted for CY7C1356C-166AXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1356C-166AXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1356C-166AXI?
CY7C1356C-166AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1356C-166AXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1356C-166AXI?
For technical support, including CY7C1356C-166AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1356C-166AXI requirements.
6.How does Aetrix verify that CY7C1356C-166AXI is sourced from the original manufacturer or authorized distributors?
All CY7C1356C-166AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1356C-166AXI meets industry standards.
7.What is the process for return or replacement of CY7C1356C-166AXI?
All CY7C1356C-166AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1356C-166AXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1356C-166AXI part is unused and in its original packaging.
Return procedure for CY7C1356C-166AXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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