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Infineon Technologies CY7C1356C-200AXI

Part No.:
CY7C1356C-200AXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1356C-200AXI.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,674

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Product details

Overview

CY7C1356C-200AXI from Cypress Semiconductor is a 9-Mbit (512K × 18) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It operates at 200 MHz with zero wait states, supports 3.3 V core supply and 2.5/3.3 V I/O, and delivers 3.2 ns clock-to-output access time in TQFP-100 package.

For engineers reviewing the CY7C1356C-200AXI datasheet, CY7C1356C-200AXI pinout, CY7C1356C-200AXI application, or CY7C1356C-200AXI equivalent, key selection criteria include burst order configuration (linear/interleaved via MODE pin), byte-write select granularity (BWa–BWb), synchronous self-timed write timing, and JTAG boundary-scan support for system-level testability.

Technical Context

The CY7C1356C-200AXI implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers synchronized to CLK. Its NoBL™ logic eliminates bus latency by enabling true back-to-back read/write operations without wait states.

Burst operation is configurable via the MODE strap pin (linear or interleaved), while write sequencing uses synchronous self-timed internal control-no external write pulse width constraints. Chip enable logic combines CE1 (active LOW), CE2 (active HIGH), and CE3 (active LOW) for flexible bank decoding in multi-SRAM systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 9 Mbit (512K × 18 organization), supporting 18-bit wide data paths in telecom and packet buffer applications.
Max Clock Frequency 200 MHz - enables 200 million consecutive read/write cycles per second with no pipeline stalls.
Access Time 3.2 ns - defines minimum clock-to-output delay for deterministic timing closure in high-speed synchronous designs.
VDD Supply 3.3 V ±0.3 V - single-core rail simplifies power delivery; decoupling required per Cypress layout guidelines.
VDDQ Supply 2.5 V or 3.3 V - independent I/O voltage allows interfacing with both 2.5 V and 3.3 V logic families without level shifters.
Burst Capability Linear or interleaved - selected by MODE pin; critical for matching burst patterns of upstream controllers (e.g., PowerPC, MIPS).
Byte Write Control BWa & BWb - enable independent 9-bit writes to upper/lower half of 18-bit word, reducing bus traffic in partial-word updates.

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, surface-mountable with standard reflow profile.

Pin/Terminal Circuit Role Design Meaning
CLK Clock input Rising-edge-triggered master timing reference; qualified by CEN - deasserting CEN extends prior cycle without deselecting device.
CE1, CE2, CE3 Chip enable group Three-input decode: CE1 (LOW), CE2 (HIGH), CE3 (LOW) must all be valid on same CLK edge to enable device; supports multi-bank memory mapping.
BWa, BWb Byte write select Active-LOW controls 9-bit write masks for DQ[0:8] (BWa) and DQ[9:17] (BWb); enables partial-word writes without read-modify-write overhead.
ADV/LD Burst address control HIGH advances internal counter for burst reads/writes; LOW loads new base address - essential for non-sequential access initiation.
MODE Burst order configuration Strap pin: HIGH = interleaved burst (e.g., for PowerPC MPC82xx), LOW = linear burst (e.g., for Intel XScale); sets burst sequence at power-up.
ZZ Deep sleep control Active-LOW entry into low-power sleep mode (40 mA standby current); reduces dynamic power during idle periods in burst-intensive systems.

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) architecture Enables unlimited back-to-back read/write transitions with zero wait states - eliminates pipeline bubbles in real-time packet buffering.
Fully registered I/O All inputs and outputs synchronized to CLK rising edge - ensures deterministic setup/hold timing and simplifies PCB routing for >150 MHz operation.
Synchronous self-timed writes Internal write completion detection removes dependency on external write pulse width - eliminates timing margin uncertainty in FPGA-based controllers.
IEEE 1149.1 JTAG boundary scan Full scan chain support (TDI/TDO/TCK/TMS) enables in-system testability and interconnect verification without physical probe access.
Flexible I/O voltage (VDDQ) 2.5 V or 3.3 V selectable - permits direct interface to legacy 2.5 V ASICs or modern 3.3 V FPGAs without external level translators.

Applications

Telecom Line Card Buffering Network Packet Processor Cache

Use Scenario: Storing ingress/egress packet headers and metadata in OC-192/STM-64 line cards requiring deterministic 200 MHz throughput.

IC Role / Device Role / Timing Role: High-speed dual-port-like buffer between SERDES PHY and traffic manager ASIC, operating in burst-read/burst-write mode.

Use Value: 3.2 ns access time and NoBL™ architecture eliminate wait states during header inspection loops, sustaining 3.2 Gbps sustained bandwidth.

Use Scenario: Acting as instruction/data cache for multi-threaded network processors handling IPv4/IPv6 forwarding at line rate.

IC Role / Device Role / Timing Role: Synchronous pipelined memory serving as L1 cache replacement for embedded RISC cores, configured with linear burst order.

Use Value: Byte-write capability (BWa/BWb) reduces write traffic by 50% when updating 9-bit TTL or ECN fields in packet headers.

Base Station Radio Controller Memory Industrial Real-Time PLC Data Buffer

Use Scenario: Buffering IQ samples between digital downconverters and channelizers in LTE/5G remote radio units.

IC Role / Device Role / Timing Role: Low-latency memory for cyclic data flow with strict jitter tolerance; MODE pin set to interleaved for DSP-compatible addressing.

Use Value: ZZ sleep mode cuts standby current to 40 mA during RF transmit gaps, extending thermal headroom in compact RF enclosures.

Use Scenario: Holding sensor fusion data streams from multiple CAN/EtherCAT nodes in deterministic motion control systems.

IC Role / Device Role / Timing Role: Deterministic-access SRAM interfaced to industrial MCU via parallel bus, using CE1/CE2/CE3 for modular I/O expansion.

Use Value: Fully registered I/O and 3.3 ns clock-to-output guarantee timing predictability under EMI stress, meeting IEC 61000-4-3 immunity requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V255L15PF 512K × 18, 15 ns access, 133 MHz max clock, 3.3 V only, no MODE pin or burst order selection. Lacks burst configurability and NoBL™ zero-wait-state operation; suited for lower-frequency control-plane buffers. Select when cost sensitivity outweighs throughput requirements and burst pattern flexibility is unnecessary.
ISSI IS61WV51218BLL-200TQLI 512K × 18, 200 MHz, 3.2 ns access, but no JTAG, no ZZ sleep mode, and no ADV/LD-controlled burst advance. Missing boundary-scan testability and deep-sleep power management - limits use in field-deployed telecom hardware. Prefer for cost-constrained industrial designs where test access and ultra-low standby power are secondary.

Compared with IDT72V255L15PF and IS61WV51218BLL-200TQLI, CY7C1356C-200AXI uniquely combines 200 MHz zero-wait-state operation, programmable burst order, JTAG testability, and ZZ sleep - making it the only choice for carrier-grade packet processing where deterministic latency, field testability, and thermal efficiency are co-constrained.

Availability

CY7C1356C-200AXI is available at Aetrix Electronics and suitable for telecom infrastructure, network processor design, and industrial real-time control applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1356C-200AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial and communications markets.

The CY7C1356C belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, high-bandwidth memory interfacing in packet-switched and real-time signal processing systems.

FAQ

What is the function of the MODE pin on CY7C1356C-200AXI?

The MODE pin is a strap input that selects burst address order at power-up: pulled HIGH for interleaved burst (e.g., compatible with PowerPC processors), pulled LOW for linear burst (e.g., Intel XScale). It is sampled only at initialization and cannot be changed dynamically during operation. External pull-up/pull-down resistors must meet Cypress's recommended values (typically 4.7 kΩ) to ensure reliable boot-time configuration.

Can CY7C1356C-200AXI operate with 2.5 V I/O while using 3.3 V core supply?

Yes - VDDQ (I/O supply) is independently configurable for 2.5 V or 3.3 V, while VDD (core supply) remains fixed at 3.3 V. This allows direct interfacing with 2.5 V FPGAs or ASICs without level shifters. The device guarantees full AC/DC specifications across both VDDQ options, and separate VDDQ decoupling capacitors are required per Cypress layout guidelines.

How does the ZZ (sleep) mode reduce power consumption?

Asserting ZZ LOW places the device in deep sleep mode, reducing standby current to 40 mA (typical) regardless of clock frequency or I/O activity. During ZZ mode, all internal logic except wake-up circuitry is gated, and outputs enter high-impedance state. Exit time from ZZ is ≤100 ns, enabling rapid resumption of burst transfers - ideal for duty-cycled packet processing in energy-constrained base stations.

Is JTAG boundary scan supported on CY7C1356C-200AXI, and how is it enabled?

Yes - CY7C1356C-200AXI implements IEEE 1149.1 JTAG with dedicated TDI, TDO, TCK, and TMS pins. JTAG is always active and requires no enable signal; however, it is disabled if TMS is held HIGH for more than 100 µs after power-up. Boundary scan testing follows standard IR/DR sequences and supports full pin interconnect verification per the device's 100-pin TQFP boundary-scan chain definition.

CY7C1356C-200AXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.2 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1356C-200AXI FAQ

1.How can I place an order for CY7C1356C-200AXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1356C-200AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1356C-200AXI reliable?

The price and inventory of CY7C1356C-200AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1356C-200AXI is usually 5 days.

3.What payment methods are accepted for CY7C1356C-200AXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1356C-200AXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1356C-200AXI?

CY7C1356C-200AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1356C-200AXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1356C-200AXI?

For technical support, including CY7C1356C-200AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1356C-200AXI requirements.

6.How does Aetrix verify that CY7C1356C-200AXI is sourced from the original manufacturer or authorized distributors?

All CY7C1356C-200AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1356C-200AXI meets industry standards.

7.What is the process for return or replacement of CY7C1356C-200AXI?

All CY7C1356C-200AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1356C-200AXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1356C-200AXI part is unused and in its original packaging.

Return procedure for CY7C1356C-200AXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1356C-200AXI Tags

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