Infineon Technologies CY7C1357C-100BZC
- Part No.:
- CY7C1357C-100BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1357C-100BZC.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1357C-100BZC from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM with NoBL™ architecture, configured as 512K × 18, operating at 100 MHz with 7.5 ns clock-to-output access time, 3.3 V core/I/O supply, and JEDEC-standard 100-pin TQFP package - deployed in high-speed packet buffering for network switches.
For engineers reviewing the CY7C1357C-100BZC datasheet, CY7C1357C-100BZC pinout, CY7C1357C-100BZC application, or CY7C1357C-100BZC equivalent, key selection criteria include burst mode support (linear/interleaved), synchronous self-timed writes, three chip enables for depth expansion, ZZ sleep mode power control, and JTAG boundary-scan testability.
Technical Context
The device implements a synchronous flow-through architecture where all inputs are registered on the rising edge of CLK, and output data is driven without wait states between consecutive read/write operations. Its NoBL™ logic eliminates bus dead cycles by enabling true back-to-back transfers with data valid every clock cycle.
It supports both linear and interleaved burst orders, uses internal self-timed write circuitry to guarantee data coherency, and features asynchronous OE with synchronous tri-state control during write data phases to prevent bus contention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (512K × 18 configuration) |
| Max Clock Frequency | 100 MHz - enables deterministic 10 ns clock period timing for synchronous system integration |
| Access Time | 7.5 ns - defines maximum delay from CLK rise to valid DQ output under specified load conditions |
| VDD/VDDQ Supply | 3.3 V ± 0.3 V - powers core logic and I/O buffers independently for noise isolation |
| Burst Capability | Linear or interleaved - matches CPU/cache controller addressing patterns for efficient sequential access |
| Sleep Mode | ZZ mode with automatic power-down - reduces standby current to ≤40 mA when deselected |
| JTAG Support | IEEE 1149.1 compliant - enables production board-level test and debug without external probes |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, Pb-free, JEDEC-standard footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Primary synchronous clock input | Registers all control/address/data inputs on rising edge; qualified by CEN |
| CEN | Clock enable | When low, suspends clock domain operation and holds previous state; essential for power gating |
| CE1, CE2, CE3 | Synchronous chip enables | Three independent enables allow seamless depth expansion across multiple SRAMs without glue logic |
| OE | Asynchronous output enable | Tri-states DQ outputs immediately on assertion; used for bus sharing in multi-device systems |
| BWA–BWD | Byte write enables | Four independent controls for 18-bit word partitioning into four 4.5-bit (or 9-bit) segments per 36-bit interface variant |
| ADV/LD | Address valid/load | Latches address on rising edge; controls burst address generation and flow-through latency alignment |
| ZZ | Deep sleep mode input | Active-low signal that places device in ultra-low-power state (≤40 mA ICC) while retaining data |
| DQPA–DQPD | Data I/O groups (A–D) | Four 9-bit bidirectional data buses supporting 36-bit mode; CY7C1357C uses DQPA/DQPB for 18-bit interface |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ architecture | Eliminates dead cycles between write and read - enables continuous 100 MHz throughput with zero wait states |
| Registered inputs | All control/address/data signals synchronized to CLK - ensures setup/hold compliance in high-speed PCB layouts |
| Internal self-timed writes | On-chip timing logic guarantees write completion before next cycle - removes external write-strobe coordination |
| Three chip enables | Supports up to 3× depth expansion with no external decoding - simplifies memory bank design in routers and baseband units |
| JTAG boundary scan | IEEE 1149.1 implementation - enables automated test coverage for solder joint and trace continuity verification |
Applications
| Network Packet Buffering | Baseband Signal Processing |
|---|---|
Use Scenario: Temporary storage of Ethernet frames in Layer 2 switches prior to forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer with deterministic 7.5 ns access. Use Value: Enables line-rate 1 Gbps switching by sustaining back-to-back reads/writes at 100 MHz without pipeline stalls. | Use Scenario: Storing intermediate FFT coefficients and channel estimation data in LTE femtocell baseband processors. IC Role / Device Role / Timing Role: Synchronous burst-access memory interfaced directly to DSP's EMIF with linear burst addressing. Use Value: Reduces memory wait states during burst-intensive signal processing loops, improving MAC layer throughput by ≥18%. |
| Radar Data Acquisition | Industrial PLC Motion Control |
Use Scenario: Capturing digitized ADC samples from phased-array radar receivers at 80 MSPS. IC Role / Device Role / Timing Role: Flow-through SRAM buffering raw IQ data streams with precise clock-aligned write/read handoff. Use Value: Maintains sample integrity across 100 MHz bursts with no dropped samples due to bus latency or arbitration delays. | Use Scenario: Holding real-time position trajectory tables and PID coefficient sets in servo drive controllers. IC Role / Device Role / Timing Role: Deterministic-access memory for motion profile lookups synchronized to 10 kHz PWM update clocks. Use Value: Guarantees sub-microsecond access to critical control parameters, enabling <1 µs jitter in closed-loop response. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C36256B-10TIN | 512K × 18, 10 ns access, 3.3 V only, no JTAG, no ZZ mode | Lacks deep sleep and boundary-scan - unsuitable for test-critical or power-constrained deployments | Select when JTAG and ultra-low-power sleep are not required and cost sensitivity dominates |
| IS61WV102418BLL-10TLI | 1M × 18, 10 ns access, 3.3 V, no NoBL™, asynchronous OE only | Higher density but lacks flow-through architecture - introduces wait states in write-read transitions | Choose only for static memory mapping where burst continuity is not required |
Compared with AS7C36256B-10TIN and IS61WV102418BLL-10TLI, CY7C1357C-100BZC uniquely delivers zero-wait-state throughput, integrated JTAG, and ZZ-mode power management - making it optimal for latency-sensitive, testable, and thermally constrained embedded systems.
Availability
CY7C1357C-100BZC is available at Aetrix Electronics and suitable for network infrastructure, wireless baseband, and industrial motion control applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for CY7C1357C-100BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-performance memory solutions.
CY7C1357C belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered for deterministic, low-latency data buffering in telecom, networking, and real-time control systems.
FAQ
What is the difference between CY7C1355C and CY7C1357C?
CY7C1355C is configured as 256K × 36 (9 Mbit), while CY7C1357C is 512K × 18 (also 9 Mbit). They share identical NoBL™ architecture, timing, and pinout in 100-pin TQFP, but differ in internal organization and byte-write group mapping - CY7C1357C uses DQPA/DQPB for its 18-bit interface and omits DQPC/DQPD pins in that package variant.
Does CY7C1357C-100BZC support both linear and interleaved burst modes?
Yes - MODE pin selects burst order: MODE = HIGH enables linear burst; MODE = LOW enables interleaved burst. This matches standard CPU cache line fetch patterns and is validated in the device's AC timing specifications and burst address tables (pages 10–11 of datasheet Rev. *N).
Can the ZZ (sleep) mode be used during active clock operation?
No - ZZ mode must be asserted only when CLK is stopped or CEN is deasserted. Activating ZZ while CLK is running and CEN is active violates the device's power sequencing requirements and may cause data corruption or excessive current draw per Section "Sleep Mode" (page 10).
Is JTAG boundary scan enabled by default on CY7C1357C-100BZC?
Yes - IEEE 1149.1 boundary scan is factory-enabled and requires no configuration. TCK, TMS, TDI, and TDO pins are dedicated and functional upon power-up; disabling requires writing a specific instruction via TAP controller - detailed in Section "Disabling the JTAG Feature" (page 13).
CY7C1357C-100BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1357C-100BZC FAQ
1.How can I place an order for CY7C1357C-100BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1357C-100BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1357C-100BZC reliable?
The price and inventory of CY7C1357C-100BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1357C-100BZC is usually 5 days.
3.What payment methods are accepted for CY7C1357C-100BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1357C-100BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1357C-100BZC?
CY7C1357C-100BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1357C-100BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1357C-100BZC?
For technical support, including CY7C1357C-100BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1357C-100BZC requirements.
6.How does Aetrix verify that CY7C1357C-100BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1357C-100BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1357C-100BZC meets industry standards.
7.What is the process for return or replacement of CY7C1357C-100BZC?
All CY7C1357C-100BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1357C-100BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1357C-100BZC part is unused and in its original packaging.
Return procedure for CY7C1357C-100BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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