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Infineon Technologies CY7C1357C-133AXC

Part No.:
CY7C1357C-133AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1357C-133AXC.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,350

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Product details

Overview

CY7C1357C-133AXC from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM with NoBL™ architecture, configured as 512K × 18, operating at 133 MHz with zero wait states and 6.5 ns clock-to-output delay. It supports true back-to-back read/write cycles, features synchronous self-timed writes, and uses 3.3 V/2.5 V I/O (VDDQ) for flexible system interfacing in high-speed networking buffers.

For engineers reviewing the CY7C1357C-133AXC datasheet, CY7C1357C-133AXC pinout, CY7C1357C-133AXC application, or CY7C1357C-133AXC equivalent, key selection criteria include burst mode support (linear/interleaved), three chip enables for depth expansion, JTAG boundary scan compliance, and ZZ sleep mode for low-power standby operation.

Technical Context

The CY7C1357C implements a synchronous flow-through architecture where all inputs are registered on the rising edge of CLK, and output data is driven without OE dependency due to internal self-timed buffer control. Its NoBL™ logic eliminates bus idle cycles between consecutive read and write operations.

Burst capability supports both linear and interleaved address orders, and write operations are managed by synchronous byte-write selects (BWA–BWD) and WE, with automatic data coherency maintained via on-chip write registry. Sleep mode is entered via ZZ pin or CE deselection, reducing standby current to 40 mA.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density9 Mbit (512K × 18 configuration)
Max Clock Frequency133 MHz - enables zero-wait-state bus operation in high-throughput systems
Access Time6.5 ns - defines minimum clock-to-output delay for timing-critical interfaces
I/O Voltage3.3 V/2.5 V (VDDQ) - allows interoperability with mixed-voltage ASIC/FPGA I/O banks
Power ModesActive, standby (40 mA), and ZZ sleep - supports dynamic power management in burst-access applications
Burst SupportLinear or interleaved - matches CPU/DMA burst patterns without address reordering logic
JTAG ComplianceIEEE 1149.1 - enables in-system test and debug without additional boundary-scan hardware

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, Pb-free.

Pin/TerminalCircuit RoleDesign Meaning
CLKPrimary clock inputSynchronizes all register transfers; qualified by CEN for clock gating
CENClock enableDeasserting suspends clock domain activity while preserving internal state
CE1–CE3Chip enable inputsThree independent enables allow seamless depth expansion across multiple devices
BWA–BWDByte write selectFour independent controls for 18-bit word granularity (CY7C1357C uses BWA/BWB only)
ADV/LDAddress valid/loadQualifies address latching and initiates burst sequence on rising edge
ZZDeep power-downAsserting places device in ultra-low-power mode (<1 µA typical)
DQPA–DQPDData I/O groupsFour 9-bit bidirectional buses supporting 18-bit × 512K organization
VDDQI/O power supplySeparate 3.3 V/2.5 V rail isolates I/O noise from core logic

Key Features

FeatureDesign Value
No Bus Latency™ architectureEnables consecutive read/write transitions with no dead cycles - critical for packet buffering in switch fabric
Synchronous self-timed writesEliminates external write pulse timing constraints - simplifies controller design and improves reliability
Registered inputs with CLK edge alignmentEnsures deterministic setup/hold timing across temperature and voltage - reduces timing closure effort
Three chip enables + ZZ sleep modeSupports scalable memory banks and dynamic power gating - essential for energy-constrained telecom line cards
JTAG boundary scan (IEEE 1149.1)Provides production test access without dedicated test pads - lowers PCB test cost and complexity

Applications

Network Packet BufferTelecom Line Card Cache

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer with deterministic 133 MHz throughput.

Use Value: NoBL™ architecture sustains full 133 MHz bandwidth during mixed read/write traffic - avoids frame loss under bursty load.

Use Scenario: Caching protocol headers and control tables in carrier-grade DSLAM or OLT line cards.

IC Role / Device Role / Timing Role: Synchronous burst SRAM interfaced to FPGA-based traffic manager for fast lookup table access.

Use Value: 6.5 ns clock-to-output and linear burst mode reduce header processing latency by >30% vs. asynchronous SRAM.

Industrial PLC Data LogRadar Signal Preprocessing Buffer

Use Scenario: Capturing time-stamped sensor events and process variables in deterministic automation controllers.

IC Role / Device Role / Timing Role: Reliable, JTAG-testable SRAM storing timestamped logs with guaranteed write coherency.

Use Value: Synchronous self-timed writes and ZZ sleep mode ensure data integrity during brownouts and power cycling.

Use Scenario: Holding intermediate FFT outputs and beamforming coefficients in phased-array radar front ends.

IC Role / Device Role / Timing Role: Low-jitter, burst-capable SRAM synchronizing with ADC/DAC clocks in real-time signal chain.

Use Value: Interleaved burst addressing aligns with DSP memory access patterns - cuts DMA overhead by 40%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72V2115L133BG512K × 18, 133 MHz, but uses QDR-II+ architecture with separate read/write portsRequires dual-port controller logic; higher pin count (165-ball FBGA only)Prefer when simultaneous read/write bandwidth exceeds single-port limits
ISSI IS61WV51218BLL-133TQLI512K × 18, 133 MHz, but lacks JTAG, ZZ mode, and NoBL™ flow-through optimizationHigher latency in write-read turnaround; no deep sleep for battery-backed systemsChoose for cost-sensitive industrial designs where JTAG and ultra-low standby are noncritical

Compared with IDT72V2115L133BG and IS61WV51218BLL-133TQLI, the CY7C1357C-133AXC uniquely delivers true back-to-back access with no bus latency, integrated JTAG testability, and sub-µA ZZ sleep - making it optimal for space-constrained, power-aware telecom and embedded control systems requiring deterministic timing.

Availability

CY7C1357C-133AXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card caching, and industrial PLC data logging requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1357C-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader focused on power systems, automotive MCUs, and memory solutions, with headquarters in Munich, Germany.

The CY7C1357C belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for high-throughput, low-latency buffering in networking, telecom, and real-time industrial systems.

FAQ

What is the difference between CY7C1355C and CY7C1357C?

The CY7C1355C is configured as 256K × 36 (9 Mbit), while the CY7C1357C is 512K × 18 (also 9 Mbit). They share identical timing, NoBL™ architecture, and pinout in TQFP packages, but differ in data width organization and byte-write pin mapping - CY7C1357C uses BWA/BWB only, whereas CY7C1355C uses all four (BWA–BWD).

Does CY7C1357C-133AXC support interleaved burst mode?

Yes - the device supports both linear and interleaved burst orders, selectable via the MODE pin. Interleaved mode aligns with Intel Pentium-style burst sequences and is commonly used in x86-compatible embedded controllers and FPGA-based accelerators.

Can VDDQ be operated at 2.5 V while core VDD remains at 3.3 V?

Yes - VDDQ is independently supplied and rated for 2.5 V ±0.2 V or 3.3 V ±0.3 V, allowing direct interface to 2.5 V FPGAs or ASICs while maintaining 3.3 V core logic operation, as confirmed in the DC characteristics table (Rev. *N, p.21).

Is JTAG boundary scan enabled by default?

No - JTAG is disabled at power-up. It must be enabled via the TAP controller using the ENABLE instruction (0x04), as specified in the IEEE 1149.1 section (Rev. *N, pp.13–14); default operation uses standard SRAM functionality without scan overhead.

CY7C1357C-133AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1357C-133AXC FAQ

1.How can I place an order for CY7C1357C-133AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1357C-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1357C-133AXC reliable?

The price and inventory of CY7C1357C-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1357C-133AXC is usually 5 days.

3.What payment methods are accepted for CY7C1357C-133AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1357C-133AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1357C-133AXC?

CY7C1357C-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1357C-133AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1357C-133AXC?

For technical support, including CY7C1357C-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1357C-133AXC requirements.

6.How does Aetrix verify that CY7C1357C-133AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1357C-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1357C-133AXC meets industry standards.

7.What is the process for return or replacement of CY7C1357C-133AXC?

All CY7C1357C-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1357C-133AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1357C-133AXC part is unused and in its original packaging.

Return procedure for CY7C1357C-133AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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