Infineon Technologies CY7C1357C-133AXCT
- Part No.:
- CY7C1357C-133AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1357C-133AXCT.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,334
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Product details
Overview
CY7C1357C-133AXCT from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM with NoBL™ architecture, configured as 512K × 18, operating at 133 MHz with zero wait states and 6.5 ns clock-to-output delay. It features registered inputs, synchronous self-timed writes, three chip enables, and supports linear/interleaved burst modes for high-throughput data buffering in network packet processors.
For engineers reviewing the CY7C1357C-133AXCT datasheet, CY7C1357C-133AXCT pinout, CY7C1357C-133AXCT application, or CY7C1357C-133AXCT equivalent, key selection criteria include burst order support (linear/interleaved), VDDQ voltage flexibility (2.5 V/3.3 V), ZZ sleep mode current (≤40 mA), JTAG boundary scan compliance, and TQFP-100 package compatibility with legacy ZBT™ designs.
Technical Context
The device implements a synchronous flow-through architecture where all address, control, and data inputs are registered on the rising edge of CLK, with CEN qualifying clock activity. Internal NoBL™ logic eliminates bus latency by enabling true back-to-back read/write operations without dead cycles.
Burst access uses ADV/LD to latch address and initiate linear or interleaved sequences; write operations employ synchronous self-timed circuitry with BWB/BWA byte write controls, while OE provides asynchronous output tri-state control independent of clock timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (512K × 18 configuration) |
| Max Clock Frequency | 133 MHz - enables zero-wait-state operation in high-speed bus interfaces |
| Access Time (tCO) | 6.5 ns - defines minimum clock-to-valid-data delay for timing closure |
| VDDQ Supply Range | 2.5 V or 3.3 V - allows interoperability with mixed-voltage SoC I/O domains |
| Standby Current (IZZ) | 40 mA max - specifies power draw in ZZ sleep mode for low-power idle states |
| Burst Order Support | Linear and interleaved - determines address sequencing behavior for cache-line-aligned transfers |
| JTAG Compliance | IEEE 1149.1 - enables boundary-scan testability and PCB-level fault detection |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Synchronizes all register transfers; qualified by CEN for gated operation |
| CEN | Clock enable | Deassertion suspends internal clocking and extends previous cycle for power gating |
| ADV/LD | Address valid/load | Latches burst start address and initiates linear/interleaved sequence generation |
| CE1–CE3 | Chip enable inputs | Three synchronous enables allow depth expansion without external logic |
| OE | Output enable | Asynchronous control of DQ output drivers; tri-states during write data phase |
| BWA, BWB | Byte write selects | Enable 9-bit write masking per 18-bit word for partial-word updates |
| ZZ | Deep power-down | Reduces standby current to ≤40 mA; requires CE deassertion to enter |
| DQPA–DQPD | Data I/O banks | Four 9-bit bidirectional data groups mapped to 18-bit word organization |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ architecture | Enables consecutive read/write cycles with no dead cycles-critical for packet buffer throughput in telecom line cards |
| Registered inputs with clock qualification | All control/address signals sampled on CLK rise edge, simplifying timing analysis and PCB layout |
| Internal self-timed write control | Eliminates need for external write pulse timing constraints-reduces system-level timing margin pressure |
| Flexible VDDQ supply | Supports 2.5 V or 3.3 V I/O voltage-enables direct interfacing with FPGA or ASIC I/O banks without level shifters |
| IEEE 1149.1 boundary scan | Provides full pin-level test coverage for automated optical inspection and functional test in production |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as frame buffer between MAC and switching fabric. Use Value: 133 MHz zero-wait-state operation ensures deterministic frame turnaround time under burst traffic loads. | Use Scenario: Holding ATM cell headers and payload segments in OC-192 SONET framer modules. IC Role / Device Role / Timing Role: Synchronous burst memory supporting interleaved addressing for header/payload separation. Use Value: Interleaved burst mode aligns with cell-based processing pipelines, reducing address overhead per transfer. |
| Industrial PLC Data Logging | Radar Signal Processing Buffer |
Use Scenario: Capturing sensor telemetry streams at 10 kHz sampling rate with timestamped metadata. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used in ping-pong configuration for continuous acquisition and host readout. Use Value: Byte write capability (BWA/BWB) allows efficient metadata tagging without full-word overwrites. | Use Scenario: Temporary storage of digitized IF samples prior to FFT computation in phased-array radar receivers. IC Role / Device Role / Timing Role: High-speed flow-through buffer synchronized to ADC clock domain via CLK/CEN. Use Value: 6.5 ns tCO enables tight timing alignment between sample capture and processing pipeline initiation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L133PF | 512K × 18, 133 MHz, but uses QDR-II+ interface with separate read/write clocks | Requires dual-clock domain management; not compatible with single-clock NoBL™ systems | Select only when migrating to QDR-II+ architecture with dedicated RCLK/WCLK routing |
| CY7C1355C-133AXCT | Same NoBL™ architecture and pinout, but 256K × 36 configuration (same density, different width) | Requires data bus width adaptation (36-bit vs. 18-bit); identical timing and control logic | Choose for 36-bit data path systems needing same performance and footprint compatibility |
Compared with IDT72V2115L133PF and CY7C1355C-133AXCT, the CY7C1357C-133AXCT uniquely delivers 18-bit bus width with NoBL™ zero-latency operation in a single-clock domain-making it optimal for cost-sensitive, space-constrained 18-bit datapath designs requiring deterministic burst throughput.
Availability
CY7C1357C-133AXCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial PLC data logging requiring stable component supply across multi-year production cycles.
Supply support for CY7C1357C-133AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with emphasis on reliability and industrial longevity.
This device belongs to Infineon's legacy Cypress synchronous SRAM product line, designed specifically for high-throughput, low-latency buffering in communications infrastructure and real-time embedded systems.
FAQ
What is the difference between CY7C1357C-133AXCT and CY7C1355C-133AXCT?
The CY7C1357C-133AXCT is organized as 512K × 18 (9 Mbit), while the CY7C1355C-133AXCT is 256K × 36 (also 9 Mbit). Both share identical NoBL™ architecture, timing specs (133 MHz, 6.5 ns tCO), pinout in TQFP-100, and feature set-including JTAG, ZZ mode, and burst control-but differ in data bus width and address depth mapping.
Does CY7C1357C-133AXCT support both linear and interleaved burst modes?
Yes, the device supports both linear and interleaved burst orders, selected via the MODE pin state at reset. Linear mode increments addresses sequentially (e.g., 0x0000, 0x0001), while interleaved mode follows IEEE 1149.1-defined patterns useful for cache-line-aligned accesses in processor coherency protocols.
Can CY7C1357C-133AXCT operate with 2.5 V VDDQ while maintaining 133 MHz performance?
Yes, the datasheet specifies full 133 MHz operation and 6.5 ns tCO at both 2.5 V and 3.3 V VDDQ. The core VDD remains 3.3 V; only the I/O power domain is adjustable-enabling seamless integration with 2.5 V FPGA I/O banks without performance penalty.
Is JTAG boundary scan enabled by default on CY7C1357C-133AXCT?
JTAG is factory-enabled and compliant with IEEE 1149.1. The TAP controller operates independently of memory function; no configuration fuse or strap is required. Boundary scan testing can be performed immediately after power-up using standard TCK/TMS/TDI/TDO sequences per the documented state diagram.
CY7C1357C-133AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1357C-133AXCT FAQ
1.How can I place an order for CY7C1357C-133AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1357C-133AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1357C-133AXCT reliable?
The price and inventory of CY7C1357C-133AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1357C-133AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1357C-133AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1357C-133AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1357C-133AXCT?
CY7C1357C-133AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1357C-133AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1357C-133AXCT?
For technical support, including CY7C1357C-133AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1357C-133AXCT requirements.
6.How does Aetrix verify that CY7C1357C-133AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1357C-133AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1357C-133AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1357C-133AXCT?
All CY7C1357C-133AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1357C-133AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1357C-133AXCT part is unused and in its original packaging.
Return procedure for CY7C1357C-133AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1357C-133AXCT Tags

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