Infineon Technologies CY7C1357C-133AXIT

Overview

CY7C1357C-133AXIT from Cypress Semiconductor is a 9-Mbit synchronous flow-through burst SRAM (512K × 18 organization) with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It supports true back-to-back read/write operations at 133 MHz with zero wait states, 6.5 ns clock-to-output delay, and 3.3 V/2.5 V I/O (VDDQ) compatibility - enabling seamless integration into DDR-adjacent data paths requiring deterministic latency.

For engineers reviewing the CY7C1357C-133AXIT datasheet, CY7C1357C-133AXIT pinout, CY7C1357C-133AXIT application, or CY7C1357C-133AXIT equivalent, key selection criteria include synchronous burst capability (linear/interleaved), three chip enables for depth expansion, registered address/data inputs, byte write control (BWA–BWD), and JTAG boundary-scan support in BGA packages.

Technical Context

The CY7C1357C-133AXIT implements a fully synchronous, flow-through pipeline where all inputs (address, WE, BWX, ADV/LD, CE1–CE3, CEN) are registered on the rising edge of CLK. Its NoBL™ architecture eliminates bus dead cycles by enabling consecutive read/write transitions without interlock insertion - critical for packet buffering in switch fabric controllers.

Burst operation is controlled by the MODE strap (linear vs. interleaved) and ADV/LD signal, with A0/A1 feeding a two-bit counter. Write operations use on-chip self-timed logic, while OE provides asynchronous output enable and automatic tri-state during write data phases to prevent bus contention.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), lead-free and RoHS-compliant. Pinout validated per Cypress Document #38-05539 Rev. *E, Pages 4–5.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with IDT72V2115L133PFI and IS61WV51218BLL-133TQLI, the CY7C1357C-133AXIT uniquely delivers true zero-wait-state back-to-back operation using a single clock domain and standard SRAM timing - reducing FPGA logic overhead and simplifying timing closure in legacy synchronous bus architectures.

Availability

CY7C1357C-133AXIT is available at Aetrix Electronics and suitable for packet buffering in switch fabric controllers, line card memory for telecom equipment, baseband processing in wireless BTS, and real-time protocol stack buffers requiring stable component supply across extended production lifecycles.

Supply support for CY7C1357C-133AXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C1357C belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, high-bandwidth memory subsystems in telecom infrastructure where zero-wait-state burst performance and synchronous timing predictability are mandatory.

FAQ

What is the function of the MODE pin on CY7C1357C-133AXIT?

The MODE pin is a static strap input that selects burst order: tied to GND for linear burst sequence (0,1,2,3), or to VDD/floating for interleaved burst (0,2,1,3). It is sampled only at power-up or reset and does not require dynamic control. This eliminates configuration registers and simplifies PCB layout by removing the need for GPIO-driven mode selection.

How does the ZZ pin interact with clock and chip enable signals?

The ZZ pin operates asynchronously and independently of CLK, CEN, or CE signals. When asserted HIGH, it forces the device into low-power sleep mode regardless of clock activity or chip select status - preserving data while drawing <40 mA. The internal pull-down ensures safe default LOW state during power-up, and no external pull-down resistor is required.

Can CY7C1357C-133AXIT be used with a 2.5 V core voltage (VDD)?

No - VDD must be 3.3 V ± 0.3 V per datasheet specification. Only VDDQ (I/O supply) supports dual-voltage operation at either 2.5 V or 3.3 V. Using 2.5 V on VDD violates absolute maximum ratings and will cause functional failure, including corrupted address latching and invalid burst counter behavior.

Is JTAG boundary scan supported in the TQFP package of CY7C1357C-133AXIT?

No - JTAG pins (TDO, TDI, TCK, TMS) are physically absent in the 100-pin TQFP package. They are only available in the 119-ball and 165-ball BGA variants. For TQFP-based designs requiring test access, external boundary-scan must be implemented via dedicated test points or alternate test methodologies.