Infineon Technologies CY7C1360A-150AC

Overview

CY7C1360A-150AC from Cypress Semiconductor is a 256K × 36-bit synchronous pipelined burst SRAM with 150 MHz clock speed, 3.5 ns access time, and 3.3V core supply. It implements address pipelining via ADSP/ADSC inputs, supports interleaved or linear burst sequences via MODE pin, and features four independent byte write enables (BWa–BWd) for granular 8-bit writes. Used in high-speed network packet buffering and FPGA co-processor memory interfaces.

For engineers reviewing the CY7C1360A-150AC datasheet, CY7C1360A-150AC pinout, CY7C1360A-150AC application, or CY7C1360A-150AC equivalent, key selection criteria include synchronous burst timing compliance, CE2/CE3 depth-expansion support, ZZ sleep mode power-down behavior, and TQFP-100 package compatibility with LVTTL I/O levels.

Technical Context

This SRAM uses a positive-edge-triggered CLK to register all synchronous inputs-including addresses A0–A1, chip enables CE/CE2/CE3, burst controls ADSC/ADSP/ADV, and write controls BWa–BWd/BWE/GW. Internal address generation relies on a two-bit binary counter synchronized to ADV transitions, enabling burst lengths of 1–4 words without external address sequencing.

It supports dual I/O voltage operation (3.3V or 2.5V VCCQ), tolerates 5V on non-I/O inputs, and integrates clamp diodes to VSS on all pins. The device implements self-timed write cycles, automatic power-down via ZZ or CE deselect, and-on AJ/BG packages-IEEE 1149.1 JTAG boundary scan using TMS/TDI/TCK/TDO pins.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (Thin Quad Flat Package), 14 mm × 14 mm body, 0.5 mm pitch, lead-free (RoHS-compliant). Pin 1 marked by corner notch; thermal pad not electrically connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with IS61WV25636BLL-150BLI and MT55LSD25636D-150:J, the CY7C1360A-150AC provides unique 5V-tolerant control inputs, three-depth chip enable architecture, and configurable VCCQ-making it optimal for legacy 5V system upgrades and multi-bank telecom designs where supply separation and robustness are critical.

Availability

CY7C1360A-150AC is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor memory, and telecom line card cache applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant TQFP packaging.

Supply support for CY7C1360A-150AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C solutions.

The CY7C1360A belongs to Cypress' Synchronous Burst SRAM product line, designed specifically for low-latency, high-throughput memory interfacing in networking, telecommunications, and real-time embedded systems where deterministic timing and depth scalability are essential.

FAQ

What is the function of the CE2 pin on CY7C1360A-150AC?

CE2 is an active-high synchronous chip enable used for depth expansion. When CE = LOW and CE2 = HIGH, the device enters active mode and accepts address/data inputs. Unlike CE (active-low), CE2 enables hierarchical memory stacking-e.g., pairing with CE3 (A-version only) to select among three physical banks in a 768K×36 system. It does not gate ADSP and operates independently of OE.

Can CY7C1360A-150AC operate with 2.5V I/O while maintaining 3.3V core supply?

Yes. VCCQ (pins 14, 16, 66 on TQFP) accepts 2.5V or 3.3V independently of VCC (3.3V ±5% to +10%). This allows interfacing with 2.5V FPGAs or ASICs while preserving noise margin and timing integrity of the 3.3V core logic. Data outputs swing to VCCQ level; inputs recognize 2.5V logic thresholds when VCCQ = 2.5V.

How does the MODE pin affect burst addressing behavior?

The MODE pin selects burst address sequence: LOW enables linear burst (0,1,2,3), while HIGH or NC enables interleaved burst (0,2,4,6). This matches host processor bus protocols-e.g., Intel Pentium uses interleaved; PowerPC G4 uses linear. The selection is static and must be set before burst initiation; changing MODE mid-burst has undefined behavior per datasheet.

Is JTAG boundary scan supported on the CY7C1360A-150AC in TQFP package?

No. JTAG (TMS/TDI/TCK/TDO) is only available on BG (BGA) and AJ (TQFP) package versions-not on the standard A-version TQFP (like -150AC). The -150AC suffix denotes the A-version, which lacks JTAG pins. For JTAG capability, specify CY7C1360A-150AJ or CY7C1360A-150BG, both of which include dedicated test pins and IEEE 1149.1 compliance.