Infineon Technologies CY7C1360A-150BGC

Overview

CY7C1360A-150BGC from Cypress Semiconductor is a 256K × 36-bit synchronous pipelined burst SRAM with 150 MHz clock speed, 3.5 ns maximum access time, and 3.3 V core supply. It implements address pipelining, byte-selectable write control (BWa–BWd), and JTAG boundary scan for testability. Used in high-bandwidth memory subsystems of network packet buffers and telecom line cards where deterministic burst latency and depth expansion are critical.

For engineers reviewing the CY7C1360A-150BGC datasheet, CY7C1360A-150BGC pinout, CY7C1360A-150BGC application, or CY7C1360A-150BGC equivalent, key selection criteria include synchronous burst timing compliance, 119-ball PBGA mechanical compatibility, CE/CE2/CE3 depth-expansion support, and LVTTL I/O voltage tolerance with 2.5 V or 3.3 V VCCQ operation.

Technical Context

This SRAM uses a positive-edge-triggered CLK to register all synchronous inputs-addresses (A0–A1), chip enables (CE, CE2, CE3), burst controls (ADSC, ADSP, ADV), and write enables (BWa–BWd, BWE, GW). Internal address pipelining and a two-bit binary counter enable interleaved or linear burst sequences without external address generation.

Write operations are self-timed and support 1–4 byte granularity via BWa–BWd under BWE control, or full 36-bit writes via GW. Asynchronous OE enables output drivers independently of clock, while ZZ provides low-power standby mode. JTAG (TMS/TDI/TCK/TDO) is implemented only in BG and AJ packages per IEEE 1149.1.

Key Specifications

Pinout & Package

Package: 119-ball PBGA (14 mm × 22 mm, ball pitch 1.27 mm), RoHS-compliant, thermal pad not electrically connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with CY7C1360A-150BGC, the -166BGC offers higher throughput at identical packaging and features, while the IS61WV25636BLL-150BLI sacrifices testability and interface flexibility for lower unit cost in fixed-function systems.

Availability

CY7C1360A-150BGC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-performance DSP co-processor cache, and industrial motion controller look-up table applications requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1360A-150BGC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial and communications infrastructure.

The CY7C1360A belongs to Cypress's Synchronous Burst SRAM product line, designed specifically for deterministic, low-latency memory subsystems in telecom, networking, and real-time embedded systems demanding pipelined burst access and depth scalability.

FAQ

What is the function of the CE3 pin on CY7C1360A-150BGC?

The CE3 pin is an active LOW synchronous chip enable available only in the "A" package version (not BG or AJ), and is absent in CY7C1360A-150BGC (BG package). Its absence in this variant means depth expansion relies solely on CE and CE2, limiting stack configurations to two devices unless external logic is added.

Can CY7C1360A-150BGC operate with 2.5 V I/O supply while using 3.3 V core supply?

Yes. VCCQ (pins 1A, 7A, 1F, etc.) accepts either 2.5 V or 3.3 V, independent of VCC = 3.3 V ±5%/+10%. This allows direct interfacing with 2.5 V FPGAs or ASICs without level shifters, while maintaining full 150 MHz performance and 3.5 ns access timing.

Does CY7C1360A-150BGC support both interleaved and linear burst modes?

Yes. The MODE pin (pin 3R) selects burst sequence: LOW enables linear burst (0,1,2,3), HIGH or NC enables interleaved burst (0,2,1,3). This is confirmed in the Functional Description and Pin Descriptions sections of Rev. *C datasheet, and applies identically to BG package variants.

Is JTAG boundary scan functional on CY7C1360A-150BGC?

Yes. As a BG package variant, CY7C1360A-150BGC includes full IEEE 1149.1 JTAG support via TMS (pin 5U), TDI (pin 4U), TCK (pin 3U), and TDO (pin 42) - all LVTTL-compatible. This enables serial chain testing and visibility into I/O states during production and field diagnostics.