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Infineon Technologies CY7C1360C-166AXCT

Part No.:
CY7C1360C-166AXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1360C-166AXCT.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,237

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Product details

Overview

CY7C1360C-166AXCT from Infineon Technologies (formerly Cypress) is a 9-Mbit pipelined synchronous SRAM with 256K × 36 organization, supporting 166 MHz bus operation, 3.3 V core supply (VDD), and 2.5 V/3.3 V I/O (VDDQ). It features registered inputs/outputs, synchronous self-timed writes, and IEEE 1149.1 JTAG boundary scan - deployed in high-speed network packet buffers and telecom line-card control planes.

For engineers reviewing the CY7C1360C-166AXCT datasheet, CY7C1360C-166AXCT pinout, CY7C1360C-166AXCT application, or CY7C1360C-166AXCT equivalent, key selection criteria include burst mode compatibility (Intel Pentium® interleaved/linear), 3-chip-enable TQFP package support, clock-to-output timing (3.5 ns), and byte-write granularity (1–4 byte width via BWx pins).

Technical Context

The device implements a two-bit internal burst counter synchronized to CLK's rising edge, enabling automatic address generation upon ADV assertion. All address, data, and control inputs (CE1/CE2/CE3, ADSP/ADSC, BWE/BWX, GW) are registered, while OE and ZZ remain asynchronous for fast output enable and low-power sleep control.

It supports dual-voltage I/O operation (2.5 V or 3.3 V on VDDQ), JEDEC JESD8-5-compliant signaling, and configurable depth expansion via CE2/CE3. The 100-pin TQFP package (A version) includes dedicated pins for MODE, ADV, ADSP, ADSC, and three independent chip enables - essential for multi-bank memory subsystems requiring deterministic latency.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 9 Mbit (256K × 36 organization), enabling 144-bit wide data paths per access cycle
Max Clock Frequency 166 MHz - defines maximum sustained burst throughput of 5.94 GB/s (36-bit × 166 MHz)
Access Time 3.5 ns - guaranteed clock-to-output delay under worst-case 166 MHz conditions
Core Supply 3.3 V ±0.3 V (VDD) - requires dedicated low-noise 3.3 V rail; not 5 V tolerant
I/O Supply 2.5 V or 3.3 V (VDDQ) - allows direct interfacing with both LVTTL and SSTL-2 logic families
Burst Support User-selectable Intel Pentium® interleaved or linear sequences - eliminates external address sequencer logic
Power Consumption 180 mA max operating current at 166 MHz - critical for thermal budgeting in dense line cards

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, A-version with 3-chip-enable configuration (CE1, CE2, CE3).

Pin/Terminal Circuit Role Design Meaning
CLK Positive-edge-triggered system clock input Synchronizes all registered inputs/outputs; determines maximum burst rate and access timing
ADSP / ADSC Address strobe processor / controller Triggers registration of address and control signals; selects master/slave arbitration in multi-controller systems
ADV Address valid advance signal Enables internal burst counter to generate next address without external sequencing logic
CE1 / CE2 / CE3 Chip enable inputs (3 independent) Supports depth expansion across multiple devices; CE3 available only in A-version TQFP and FBGA packages
BWA–BWD Byte write enable inputs (4 bits) Selects 1–4 byte write width per cycle; enables partial-word updates without read-modify-write overhead
DQA–DQD, DQPA–DQPD Data I/O and parity I/O pins (36-bit + 4-bit) 36-bit data bus with optional 4-bit parity; DQPx pins support error detection in mission-critical systems
ZZ Deep power-down control Reduces standby current to <100 µA - used during link idle periods in telecom PHY interfaces

Key Features

Feature Design Value
Pipelined synchronous interface Eliminates address setup/hold timing constraints; enables stable 166 MHz operation across PCB trace skew
Configurable burst addressing Hardware-selectable Intel Pentium® interleaved or linear mode via MODE pin - avoids firmware configuration overhead
Separate processor/controller strobes ADSP and ADSC allow concurrent CPU and DMA engine access without bus arbitration logic
IEEE 1149.1 JTAG boundary scan Enables in-system testability of SRAM interconnects on high-density backplanes without physical probe access
Asynchronous output enable (OE) Permits dynamic output tri-state control independent of clock phase - essential for shared-bus contention management

Applications

Telecom Line Cards Network Packet Buffers

Use Scenario: Storing ATM cell headers and payload fragments in OC-192 line interface modules.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer between SERDES and traffic manager ASIC.

Use Value: 3.5 ns clock-to-output and pipelined burst mode sustain 9.953 Gbps line rate with zero wait states.

Use Scenario: Temporary storage of fragmented IPv4/IPv6 packets in enterprise switch fabric controllers.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as first-level packet staging buffer before ASIC-based classification.

Use Value: Byte-write capability (via BWx) enables efficient partial-packet updates without full-line overwrites.

Military Radar Signal Processing Industrial PLC Motion Control

Use Scenario: Real-time buffering of digitized RF samples in phased-array radar front-end modules.

IC Role / Device Role / Timing Role: Deterministic-latency memory for time-critical DMA transfers between ADC and FFT accelerator.

Use Value: ZZ deep-sleep mode reduces power by >99% during beam dwell intervals, extending thermal margin.

Use Scenario: Storing motion trajectory tables and axis position feedback in CNC machine controllers.

IC Role / Device Role / Timing Role: Deterministic-access memory for servo loop lookup tables accessed by real-time microcontroller.

Use Value: 100-pin TQFP package provides robust thermal and mechanical stability in industrial temperature cycling environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362C-166AXC 512K × 18 organization (same density, different width); no CE3 pin in TQFP; lacks DQP parity pins Better suited for 18-bit bus architectures (e.g., legacy DSP interfaces); lower pin count for space-constrained layouts Select when system uses 18-bit data path and does not require parity or 3-chip-enable expansion
AS7C3616A-166JCIN 256K × 36, 166 MHz, but asynchronous interface; no pipelining, no burst counter, no JTAG Used where clock domain isolation is required or where external address sequencing is already implemented Choose only if deterministic pipeline latency is unnecessary and board layout must avoid clock distribution complexity

Compared with CY7C1360C-166AXCT, CY7C1362C-166AXC trades parity and 3-CE flexibility for smaller footprint in 18-bit systems, while AS7C3616A-166JCIN sacrifices pipelining and burst logic for simpler timing closure - making CY7C1360C-166AXCT optimal for high-throughput, low-jitter synchronous subsystems.

Availability

CY7C1360C-166AXCT is available at Aetrix Electronics and suitable for telecom infrastructure, military radar processing, and industrial motion control applications requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1360C-166AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains the former Cypress SRAM portfolio, including high-performance pipelined memories, with full technical and supply chain continuity.

This device belongs to the CY7C136x pipelined SRAM product line, engineered specifically for deterministic-latency, high-bandwidth buffering in telecom, defense, and industrial real-time systems where synchronous burst performance outweighs cost-per-bit optimization.

FAQ

What is the function of the MODE pin on CY7C1360C-166AXCT?

The MODE pin selects burst address sequence behavior: logic HIGH configures Intel Pentium®-compatible interleaved addressing (e.g., 0, 2, 4, 6), while logic LOW enables linear addressing (e.g., 0, 1, 2, 3). This setting is sampled at power-up and remains static during operation - no runtime reconfiguration is supported.

Can CY7C1360C-166AXCT operate with only 2.5 V on both VDD and VDDQ?

No. VDD must be 3.3 V ±0.3 V for core logic operation; only VDDQ may be 2.5 V or 3.3 V. Applying 2.5 V to VDD violates absolute maximum ratings and will prevent internal registers and sense amplifiers from functioning correctly, resulting in data corruption or functional failure.

Is CE3 functional in the 100-pin TQFP package of CY7C1360C-166AXCT?

Yes - CE3 is present and fully functional in the "A version" of the 100-pin TQFP package (as indicated by suffix 'XCT' and confirmed in Figure 1 of datasheet 38-05540 Rev. *U). It is absent in the "AJ version" (2-CE variant) and 119-ball BGA packages, which support only CE1 and CE2.

Does CY7C1360C-166AXCT support concurrent read and write operations on the same memory array?

No. The device implements a single-port synchronous SRAM architecture: read and write operations are mutually exclusive per cycle. While pipelining allows overlapping address setup and data transfer, true simultaneous R/W (like dual-port RAM) is not supported - attempting concurrent access results in bus contention or undefined data output.

CY7C1360C-166AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1360C-166AXCT FAQ

1.How can I place an order for CY7C1360C-166AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1360C-166AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1360C-166AXCT reliable?

The price and inventory of CY7C1360C-166AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1360C-166AXCT is usually 5 days.

3.What payment methods are accepted for CY7C1360C-166AXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1360C-166AXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1360C-166AXCT?

CY7C1360C-166AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1360C-166AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1360C-166AXCT?

For technical support, including CY7C1360C-166AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1360C-166AXCT requirements.

6.How does Aetrix verify that CY7C1360C-166AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1360C-166AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1360C-166AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1360C-166AXCT?

All CY7C1360C-166AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1360C-166AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1360C-166AXCT part is unused and in its original packaging.

Return procedure for CY7C1360C-166AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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