Infineon Technologies CY7C1360C-166AXI

Overview

CY7C1360C-166AXI from Infineon Technologies (formerly Cypress) is a 9-Mbit pipelined synchronous SRAM with 256K × 36 organization, supporting 166 MHz bus operation, 3.3 V core supply (VDD), and 2.5 V/3.3 V I/O (VDDQ). It features registered inputs/outputs, synchronous self-timed writes, and IEEE 1149.1 JTAG boundary scan - deployed in high-speed network packet buffers and telecom line-card control planes.

For engineers reviewing the CY7C1360C-166AXI datasheet, CY7C1360C-166AXI pinout, CY7C1360C-166AXI application, or CY7C1360C-166AXI equivalent, key selection criteria include burst mode compatibility (Intel Pentium® interleaved/linear), byte-write granularity (1–4 byte width), clock-to-output timing (3.5 ns), and TQFP-100 Pb-free package compliance for industrial-grade thermal cycling.

Technical Context

The device implements a two-bit internal burst counter synchronized to CLK's rising edge, generating sequential addresses upon ADV assertion while ADSP/ADSC strobes register address and chip-enable inputs. All data, write-enable (BWX/BWE/GW), and control signals are registered on-chip to initiate deterministic self-timed write cycles.

It supports asynchronous output enable (OE) and deep-sleep mode via ZZ pin, with separate processor (ADSP) and controller (ADSC) address strobes enabling dual-bus arbitration. I/O voltage flexibility (2.5 V or 3.3 V) and JEDEC JESD8-5-compliant signaling ensure interoperability with mixed-voltage ASIC/FPGA interfaces.

Key Specifications

Pinout & Package

Package: 100-pin Pb-free Thin Quad Flat Package (TQFP), 14 × 20 × 1.4 mm, with 3-chip-enable option (CE1, CE2, CE3).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar pipelined SRAM applications.

Compared with AS7C36256P-166JCIN and IS61WV25636BLL-166BLI, the CY7C1360C-166AXI uniquely combines VDDQ voltage selectability, integrated burst counter, JTAG testability, and ZZ sleep mode - making it optimal for thermally constrained, mixed-voltage, and test-intensive telecom and industrial designs.

Availability

CY7C1360C-166AXI is available at Aetrix Electronics and suitable for network packet buffering, telecom line-card control, industrial PLC data caching, and radar signal processing FIFOs requiring stable component supply across extended temperature ranges (–40°C to +85°C).

Supply support for CY7C1360C-166AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, emphasizing reliability, longevity, and industrial-grade qualification.

The CY7C1360C belongs to Cypress' legacy pipelined SRAM product line, engineered specifically for deterministic, high-bandwidth data buffering in telecom infrastructure, networking equipment, and real-time control systems.

FAQ

What is the function of the MODE pin on CY7C1360C-166AXI?

The MODE pin selects burst address sequence type: logic HIGH configures Intel Pentium®-compatible interleaved addressing (e.g., 0, 2, 4, 6), while logic LOW enables linear addressing (e.g., 0, 1, 2, 3). This setting is sampled at power-up and remains static during operation, directly determining how the internal two-bit burst counter increments.

Can CY7C1360C-166AXI operate with 2.5 V I/O while maintaining 3.3 V core supply?

Yes. VDD must be 3.3 V ± 0.3 V for core logic, while VDDQ may be independently set to either 2.5 V or 3.3 V. This dual-supply architecture allows direct connection to 2.5 V FPGAs without level shifters, provided VDDQ decoupling meets datasheet requirements (e.g., 0.1 µF + 10 µF per VDDQ bank).

How does the ZZ pin affect power consumption and timing recovery?

Asserting ZZ (LOW) places the device in deep-sleep mode, reducing ICC to ≤40 µA. Recovery to active operation requires ≥100 ns after ZZ returns HIGH before the first valid CLK edge; no additional reset or initialization sequence is needed, preserving internal state integrity.

Is JTAG boundary scan functional on CY7C1360C-166AXI in the TQFP package?

No. JTAG (TCK/TMS/TDI/TDO) is only implemented in the 119-ball BGA and 165-ball FBGA packages. The TQFP-100 variant (including -166AXI) omits these pins; boundary scan is unavailable in this package option per datasheet Figure 1 and ordering code definitions.