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Infineon Technologies CY7C1360C-166BZC

Part No.:
CY7C1360C-166BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1360C-166BZC.pdf
Description:
IC SRAM 9MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:287

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Product details

Overview

CY7C1360C-166BZC from Infineon Technologies (formerly Cypress) is a 9-Mbit pipelined synchronous SRAM with 256K × 36 organization, supporting 166 MHz bus operation, 3.3 V core supply (VDD), and 2.5 V/3.3 V I/O (VDDQ). It features registered inputs/outputs, synchronous self-timed writes, and IEEE 1149.1 JTAG boundary scan - deployed in high-speed networking line cards requiring deterministic burst-access memory.

For engineers reviewing the CY7C1360C-166BZC datasheet, CY7C1360C-166BZC pinout, CY7C1360C-166BZC application, or CY7C1360C-166BZC equivalent, key selection criteria include pipelined access timing (3.5 ns clock-to-output), dual-voltage I/O compatibility, burst counter mode (Intel Pentium® interleaved/linear), CE1/CE2/CE3 chip enable flexibility, and TQFP-100 Pb-free packaging for thermal and layout-constrained telecom modules.

Technical Context

The CY7C1360C-166BZC implements a synchronous, clock-driven architecture where all address, data, and control inputs (ADSP, ADSC, ADV, BWA–BWD, GW, BWE, CE1–CE3) are registered on the rising edge of CLK. Its internal two-bit burst counter generates sequential addresses autonomously upon ADV assertion, enabling 3-1-1-1 access rates without external sequencing logic.

Burst operations support both Intel Pentium®-compatible interleaved and linear sequences via MODE pin configuration. Write cycles are byte-selectable (1–4 bytes) using BWx pins, with global write (GW) enabling full-word writes. Asynchronous OE and ZZ (sleep) pins allow output control and power-down independent of clock timing.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 9 Mbit (256K × 36 bits) - provides 1152 KB of wide-data storage for packet buffering in switch fabric interfaces.
Max Clock Frequency 166 MHz - enables 6 ns cycle time for sustained high-throughput read/write bursts in backplane controllers.
Access Time (tCO) 3.5 ns - guarantees sub-4 ns valid data at outputs after clock edge, critical for meeting setup/hold timing in 166 MHz systems.
VDD / VDDQ 3.3 V core / 2.5 V or 3.3 V I/O - supports mixed-voltage system integration with legacy 2.5 V ASICs or modern 3.3 V FPGAs.
Burst Mode User-selectable Intel Pentium® interleaved or linear via MODE pin - ensures compatibility with x86-based control plane processors.
Power (Active) 180 mA max at 166 MHz - enables thermal budgeting for dense multi-SRAM implementations in compact line card designs.
Package 100-pin Pb-free TQFP (14 × 20 × 1.4 mm) - offers standard reflow compatibility and mechanical stability for industrial-grade PCB assembly.

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, with 3-chip-enable (CE1/CE2/CE3) configuration per Figure 1 of datasheet Rev. *U.

Pin/Terminal Circuit Role Design Meaning
CLK Positive-edge-triggered system clock input Synchronizes all registered inputs/outputs; defines timing reference for pipelined burst access.
ADSP / ADSC Address strobe processor / controller Triggers registration of address and control signals; selects source of address pipeline initiation.
ADV Address advance Drives internal burst counter to generate next sequential address during burst mode.
CE1 / CE2 / CE3 Chip enable inputs Enable device with hierarchical depth-expansion support; CE3 available only in A-version TQFP and FBGA packages.
BWA–BWD Byte write enables Select 1–4 byte lanes for partial-word writes; enables efficient protocol header updates without full-word overwrites.
DQA–DQD / DQPA–DQPD Data I/O and parity I/O 36-bit data + 4-bit parity interface; DQx = data, DQP x = parity - supports ECC-capable systems.
OE Asynchronous output enable Controls output buffers independently of CLK; allows dynamic bus sharing without clock-domain constraints.
ZZ Deep power-down Reduces standby current to <100 µA; enables rapid low-power state entry/exit in energy-sensitive telecom applications.

Key Features

Feature Design Value
3-1-1-1 access rate Delivers four consecutive words in five clock cycles - minimizes latency overhead in burst-intensive packet forwarding engines.
Synchronous self-timed writes Eliminates need for external write pulse generation; write duration auto-adjusts to process/voltage/temperature variations.
JTAG boundary scan (IEEE 1149.1) Enables in-system testability and interconnect verification without physical probe access - critical for high-density BGA/SMT assemblies.
User-selectable burst sequence MODE pin configures interleaved (0) or linear (1) addressing - matches host CPU's native burst behavior without glue logic.
Separate processor/controller address strobes ADSP and ADSC allow dual-bus arbitration - supports simultaneous control-plane and data-plane access in modular switch architectures.

Applications

Network Line Card Buffering Telecom Control Plane Memory

Use Scenario: Storing packet headers and metadata in 10G/25G Ethernet line cards with FPGA-based traffic managers.

IC Role / Device Role / Timing Role: Pipelined SRAM acting as low-latency, burst-optimized buffer between MAC and switch fabric interface.

Use Value: 3.5 ns tCO and 3-1-1-1 access rate ensure zero-cycle stalls during back-to-back packet bursts at 166 MHz bus speed.

Use Scenario: Hosting real-time routing tables and session state in carrier-grade SDN controllers with dual-processor architecture.

IC Role / Device Role / Timing Role: Synchronous memory serving as shared, coherently accessed workspace for ARM Cortex-A and network coprocessor.

Use Value: ADSP/ADSC dual strobe support enables independent address pipelines - eliminating arbitration delay between control and data threads.

High-Speed Test Equipment Memory Radar Signal Processing Buffer

Use Scenario: Capturing high-fidelity waveform samples in automated test equipment with real-time pattern generation.

IC Role / Device Role / Timing Role: Burst-mode SRAM providing deterministic, jitter-free sample storage synchronized to instrument clock domain.

Use Value: IEEE 1149.1 JTAG support enables full boundary-scan validation of memory bus integrity before functional test execution.

Use Scenario: Holding intermediate FFT results in phased-array radar front-ends operating under strict timing deadlines.

IC Role / Device Role / Timing Role: Low-power pipelined memory used in sleep-wake cycles to minimize average power while preserving burst throughput.

Use Value: ZZ deep power-down reduces active standby current to <100 µA - extending operational window in battery-backed radar modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1360C-200BZC 200 MHz speed grade; 3.0 ns tCO; identical pinout and feature set Requires tighter PCB layout and stricter VDD/VDDQ decoupling to sustain 200 MHz timing margins Select when system clock exceeds 166 MHz and board-level signal integrity supports 5 ns cycle time.
AS7C331024P-166JCIN 3.3 V only (no 2.5 V I/O); no JTAG; 256K × 36 but non-pipelined (asynchronous interface) Lacks burst counter, ADSP/ADSC, and pipelined timing - unsuitable for Intel-compatible burst protocols Consider only for cost-sensitive, non-burst, non-JTAG applications where clock-to-output timing >10 ns is acceptable.

Compared with CY7C1360C-200BZC, the -166BZC trades 34 MHz bandwidth for relaxed layout constraints and lower power; versus AS7C331024P-166JCIN, it delivers deterministic pipelined timing and JTAG testability at higher BOM cost and complexity.

Availability

CY7C1360C-166BZC is available at Aetrix Electronics and suitable for network line card buffering, telecom control plane memory, high-speed test equipment memory, and radar signal processing buffer applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1360C-166BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for industrial, automotive, and communications markets.

CY7C1360C belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for high-bandwidth, low-latency data buffering in telecom infrastructure and test instrumentation where pipelined burst access and JTAG testability are mandatory.

FAQ

What is the function of the MODE pin on CY7C1360C-166BZC?

The MODE pin selects burst address sequence behavior: logic LOW configures Intel Pentium®-compatible interleaved addressing (e.g., 0, 2, 4, 6), while HIGH enables linear addressing (e.g., 0, 1, 2, 3). This setting is sampled at the first rising edge of CLK after device power-up or reset and remains latched until next power cycle.

Can CY7C1360C-166BZC operate with 2.5 V I/O while using 3.3 V core supply?

Yes - VDDQ accepts 2.5 V ±0.2 V while VDD is maintained at 3.3 V ±0.3 V. This dual-supply configuration is explicitly supported per datasheet Section "DC Electrical Characteristics" and enables direct interfacing with 2.5 V FPGAs or ASICs without level shifters, provided VDDQ and VDD are ramped monotonically during power-up.

Does CY7C1360C-166BZC support partial-word writes without affecting adjacent bytes?

Yes - byte write enables BWA through BWD independently gate each 9-bit byte lane (DQA/DQPA, DQB/DQPB, DQC/DQPC, DQD/DQPD). When a BWx pin is LOW, only its associated byte is written; other bytes retain prior data. Global write (GW = LOW) overrides BWx and writes all 36 data bits simultaneously.

Is JTAG boundary scan enabled by default on CY7C1360C-166BZC?

No - JTAG is disabled at power-on. To enable, TMS must be held HIGH for at least 10 consecutive TCK cycles after power stabilization. Once enabled, JTAG remains active until next power cycle or explicit disable via instruction register. Pin assignments (TCK, TDI, TDO, TMS) match IEEE 1149.1 standard and are fixed per 100-pin TQFP package layout.

CY7C1360C-166BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1360C-166BZC FAQ

1.How can I place an order for CY7C1360C-166BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1360C-166BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1360C-166BZC reliable?

The price and inventory of CY7C1360C-166BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1360C-166BZC is usually 5 days.

3.What payment methods are accepted for CY7C1360C-166BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1360C-166BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1360C-166BZC?

CY7C1360C-166BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1360C-166BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1360C-166BZC?

For technical support, including CY7C1360C-166BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1360C-166BZC requirements.

6.How does Aetrix verify that CY7C1360C-166BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1360C-166BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1360C-166BZC meets industry standards.

7.What is the process for return or replacement of CY7C1360C-166BZC?

All CY7C1360C-166BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1360C-166BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1360C-166BZC part is unused and in its original packaging.

Return procedure for CY7C1360C-166BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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