Infineon Technologies CY7C1360C-200AJXC
- Part No.:
- CY7C1360C-200AJXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1360C-200AJXC.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,012
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Product details
Overview
CY7C1360C-200AJXC from Infineon Technologies (formerly Cypress) is a 9-Mbit pipelined synchronous SRAM with 256K × 36 organization, supporting 200 MHz bus operation, 3.3 V core supply (VDD), and 2.5 V/3.3 V I/O (VDDQ). It features registered inputs/outputs, IEEE 1149.1 JTAG boundary scan, and is packaged in Pb-free 100-pin TQFP for high-speed cache and buffer applications in networking switches and telecom line cards.
For engineers reviewing the CY7C1360C-200AJXC datasheet, CY7C1360C-200AJXC pinout, CY7C1360C-200AJXC application, or CY7C1360C-200AJXC equivalent, key selection criteria include burst-mode timing compliance, byte-write control granularity (BWA–BWD), dual chip-enable architecture (CE1/CE2), and ZZ sleep mode current (≤40 mA standby).
Technical Context
This SRAM implements a synchronous, clock-driven pipeline with positive-edge-triggered CLK controlling registration of addresses, data, CE1/CE2/CE3, ADSP/ADSC/ADV, BWE/BWX, and GW. All read/write cycles are self-timed and synchronized to CLK, enabling deterministic 3.0 ns clock-to-output delay at 200 MHz.
Burst addressing is generated internally via a two-bit counter, supporting both Intel Pentium®-compatible interleaved and linear sequences. The device supports asynchronous OE and ZZ (deep power-down), with separate processor (ADSP) and controller (ADSC) address strobes for multi-master system integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 9 Mbit (256K × 36 configuration) |
| Max clock frequency | 200 MHz - enables 200 MT/s sustained throughput in pipelined bus systems |
| Access time | 3.0 ns - guaranteed clock-to-output delay under full-speed operation |
| VDD / VDDQ | 3.3 V core / 2.5 V or 3.3 V I/O - supports mixed-voltage system interfacing |
| Standby current | 40 mA - measured in CMOS standby mode with all controls inactive |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, 3-chip-enable variant (A version) |
| JTAG support | IEEE 1149.1 compliant - enables board-level testability without external test fixtures |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, with 3-chip-enable option (CE1, CE2, CE3). Pinout validated per Figure 1 (Rev. *U, p.4) of datasheet 38-05540.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Positive-edge clock input | Synchronizes all registered inputs and internal burst counter |
| ADSP / ADSC | Address strobe (processor/controller) | Triggers address registration on rising CLK edge; selects master interface domain |
| ADV | Address advance control | Enables internal burst counter to generate next address in sequence |
| CE1 / CE2 / CE3 | Chip enable inputs | Three independent enables for depth expansion and hierarchical memory mapping |
| BWA–BWD | Byte write enables | Four independent controls for 1–4 byte write granularity per cycle |
| DQA–DQD / DQPA–DQPD | Data I/O and parity I/O | 36-bit data bus (32 data + 4 parity) with registered output drivers |
| ZZ | Deep power-down | Reduces current to ≤40 mA standby; asynchronous entry/exit |
| OE | Output enable | Asynchronous control for tri-state output buffers; overrides clock-gated outputs |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined 200 MHz operation | Enables 3-1-1-1 access rate for sustained bandwidth in high-clock-rate systems |
| User-selectable burst mode | Configurable via MODE pin for Intel Pentium® interleaved or linear address sequencing |
| Synchronous self-timed writes | Eliminates external write pulse timing constraints; write completion determined on-chip |
| Separate ADSP/ADSC strobes | Allows concurrent CPU and DMA controller access without arbitration logic |
| JTAG boundary scan (IEEE 1149.1) | Supports automated PCB test coverage for interconnect and solder-joint verification |
Applications
| Network Packet Buffering | Telecom Line Card Cache |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/L3 switching ASICs with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer interfaced directly to packet processing engines. Use Value: 3.0 ns clock-to-output and 200 MHz pipelining ensure sub-10 ns read turnaround for real-time forwarding decisions. |
Use Scenario: Caching protocol headers and control tables in carrier-grade SDH/SONET line cards. IC Role / Device Role / Timing Role: Synchronous burst-access memory for deterministic access to routing metadata and statistics counters. Use Value: Registered I/O and 3.3 V core/2.5 V I/O allow seamless integration with FPGA-based control planes operating at 2.5 V. |
| High-Performance Computing Interconnect | Radar Signal Processing Buffer |
|
Use Scenario: Serving as local scratchpad between multi-core DSP clusters and shared memory controllers in HPC backplanes. IC Role / Device Role / Timing Role: Pipelined SRAM acting as coherency-managed buffer with burst-addressing support. Use Value: Dual ADSP/ADSC strobes enable simultaneous CPU and DMA access, reducing interconnect arbitration overhead by >35%. |
Use Scenario: Capturing and buffering digitized IF samples in phased-array radar front-ends before FFT processing. IC Role / Device Role / Timing Role: Low-jitter, deterministic-access memory for time-critical sample streaming. Use Value: ZZ deep-sleep mode reduces idle power to ≤40 mA, critical for airborne radar thermal management. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C361024B-200BIN | 256K × 36, 200 MHz, 3.3 V only (no VDDQ flexibility), no JTAG, 119-ball BGA only | Lacks ADSP/ADSC separation and ZZ sleep mode; requires redesign of control logic and power management | Select only if BGA footprint and absence of boundary scan are acceptable trade-offs |
| IS61WV25636BLL-200BLI | 256K × 36, 200 MHz, 3.3 V core/I/O, no burst counter, asynchronous OE only, no ADV/ADSC/ADSP | Requires external burst address generation and lacks pipelined write initiation; higher timing uncertainty | Choose only for cost-sensitive designs where full pipelining and burst autonomy are not required |
Compared with AS7C361024B-200BIN and IS61WV25636BLL-200BLI, CY7C1360C-200AJXC uniquely delivers integrated burst addressing, dual-strobe support, and JTAG testability-critical for complex, high-reliability telecom and defense systems where timing predictability and test coverage are non-negotiable.
Availability
CY7C1360C-200AJXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card cache, high-performance computing interconnect, and radar signal processing requiring stable component supply across extended product lifecycles.
Supply support for CY7C1360C-200AJXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and support for legacy Cypress memory devices including the CY7C1360C series.
This device belongs to Infineon's high-speed synchronous SRAM product line, designed specifically for deterministic, low-latency memory subsystems in infrastructure equipment where pipelined throughput and JEDEC-compliant interoperability are essential.
FAQ
What is the function of the MODE pin on CY7C1360C-200AJXC?
The MODE pin selects burst address sequence behavior: when LOW, it configures the internal two-bit counter for Intel Pentium®-compatible interleaved bursts; when HIGH, it enables linear burst addressing. This setting is sampled at power-up or reset and remains static during operation, directly determining how ADV transitions increment the address counter.
Does CY7C1360C-200AJXC support 2.5 V-only I/O operation?
Yes. VDDQ may be independently supplied at 2.5 V while VDD remains at 3.3 V, enabling direct interface with 2.5 V FPGAs or ASICs. Input thresholds remain compatible with LVTTL levels, and output drive strength is specified for both 2.5 V and 3.3 V VDDQ conditions per datasheet AC characteristics tables.
How does the ZZ (sleep) mode interact with ongoing read/write operations?
ZZ is asynchronous and takes effect immediately upon assertion, halting all internal clocks and disabling outputs. Any active read or write cycle in progress is completed before sleep activation; no data corruption occurs. Exit from ZZ is also asynchronous and requires tZZEX (100 ns max) before first valid access.
Can CE3 be used in the 100-pin TQFP package of CY7C1360C-200AJXC?
Yes. The -AJXC suffix denotes the 3-chip-enable TQFP variant (A version), where CE3 is assigned to pin 71. CE3 functions identically to CE1/CE2 for depth expansion but is omitted in the 2-CE TQFP (-AJ) and 119-ball BGA variants, as confirmed in the pin configuration diagrams (Figures 1 and 3) of datasheet 38-05540 Rev. *U.
CY7C1360C-200AJXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1360C-200AJXC FAQ
1.How can I place an order for CY7C1360C-200AJXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1360C-200AJXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1360C-200AJXC reliable?
The price and inventory of CY7C1360C-200AJXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1360C-200AJXC is usually 5 days.
3.What payment methods are accepted for CY7C1360C-200AJXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1360C-200AJXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1360C-200AJXC?
CY7C1360C-200AJXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1360C-200AJXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1360C-200AJXC?
For technical support, including CY7C1360C-200AJXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1360C-200AJXC requirements.
6.How does Aetrix verify that CY7C1360C-200AJXC is sourced from the original manufacturer or authorized distributors?
All CY7C1360C-200AJXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1360C-200AJXC meets industry standards.
7.What is the process for return or replacement of CY7C1360C-200AJXC?
All CY7C1360C-200AJXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1360C-200AJXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1360C-200AJXC part is unused and in its original packaging.
Return procedure for CY7C1360C-200AJXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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