Infineon Technologies CY7C1360C-200AJXCT
- Part No.:
- CY7C1360C-200AJXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1360C-200AJXCT.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1360C-200AJXCT from Cypress Semiconductor is a 9-Mbit pipelined synchronous SRAM organized as 256K × 36, operating at 200 MHz with 3.3 V core supply (VDD) and 2.5/3.3 V I/O (VDDQ), supporting Intel Pentium®-compatible interleaved/linear burst sequences in high-speed cache and buffer applications.
For engineers reviewing the CY7C1360C-200AJXCT datasheet, CY7C1360C-200AJXCT pinout, CY7C1360C-200AJXCT application, or CY7C1360C-200AJXCT equivalent, key selection criteria include clock-to-output time (3.0 ns), registered synchronous interface, byte-write control (BWA–BWD + BWE), dual chip-enable architecture (CE1/CE2), and TQFP-100 Pb-free packaging for industrial memory subsystems.
Technical Context
The device implements a two-bit internal burst counter synchronized to CLK, with address registration triggered by ADSP (processor strobe) or ADSC (controller strobe) on the rising edge. All synchronous inputs-including A[1:0], CE1/CE2, ADV, GW, BWE, and BWx-are latched on CLK's positive edge.
Burst sequencing is controlled via ADV (active-low advance signal) and MODE pin, enabling either interleaved or linear address generation. Write cycles are self-timed and support 1-, 2-, or 4-byte granularity via byte write enables; global write (GW) overrides all BWx signals when asserted low.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36 organization), enabling full-word parallel access for 36-bit data buses. |
| Max Clock Frequency | 200 MHz - supports 5 ns clock period for high-throughput synchronous bus operation. |
| CLK-to-Output Delay | 3.0 ns - guarantees deterministic read latency critical for CPU cache coherency timing. |
| Core Supply Voltage | 3.3 V ± 0.3 V (VDD) - compatible with legacy 3.3 V logic domains and LDO regulation. |
| I/O Supply Range | 2.5 V or 3.3 V (VDDQ) - allows interoperability with mixed-voltage SoC interfaces. |
| Burst Access Rate | 3-1-1-1 - delivers first word in 3 clocks, subsequent words in 1 clock each for sustained bandwidth. |
| Byte Write Support | Four independent 9-bit byte lanes (BWA–BWD) with BWE gating - enables precise partial-word updates without read-modify-write. |
Pinout & Package
Package: Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 mm × 20 mm × 1.4 mm body, JEDEC MO-153 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Positive-edge-triggered master timing reference for all registered inputs/outputs and burst counter increment. |
| ADSP / ADSC | Address strobe inputs | Asynchronous-selectable address capture triggers: ADSP prioritized over ADSC for processor-initiated accesses. |
| ADV | Burst advance control | Active-low signal that increments internal 2-bit counter to generate next burst address without external address bus update. |
| CE1 / CE2 | Chip enable inputs | CE1 (active-low) and CE2 (active-high) jointly enable device selection; CE1 must be active for ADSP/ADSC to take effect. |
| BWA–BWD | Byte write select | Four active-low signals controlling 9-bit byte lanes; qualified by BWE to gate write enable per lane. |
| DQA–DQD / DQPA–DQPD | Data I/O banks | Four 9-bit bidirectional data groups (36-bit total); DQPx pins provide parity for ECC-capable systems. |
| ZZ | Asynchronous sleep control | Active-high entry into low-power sleep mode with data retention; internal pull-down ensures safe default LOW state. |
| OE | Asynchronous output enable | Active-low tristate control for all DQ/DQP pins; masked during first clock of deselected-to-read transition. |
Key Features
| Feature | Design Value |
|---|---|
| Registered synchronous interface | Eliminates setup/hold timing violations on high-speed buses by latching all address/data/control signals on CLK edge. |
| User-selectable burst mode | MODE pin configures interleaved (Pentium®) or linear addressing - matches host CPU burst protocol without glue logic. |
| Independent I/O voltage (VDDQ) | Enables direct connection to 2.5 V or 3.3 V ASIC/FPGA I/O banks while maintaining 3.3 V core integrity. |
| JTAG boundary scan (IEEE 1149.1) | Supports in-system test and interconnect verification on dense PCBs using standard TAP controller (TCK/TMS/TDI/TDO). |
| Single-cycle chip deselect | Allows rapid context switching between multiple SRAMs on shared bus without pipeline stalls or dummy cycles. |
Applications
| High-Performance CPU Cache | Network Packet Buffer |
|---|---|
Use Scenario: L2/L3 cache memory interfacing directly with x86-compatible microprocessors requiring burst-aligned 36-bit data paths. IC Role / Device Role / Timing Role: Pipelined SRAM providing zero-wait-state reads with 3-1-1-1 access pattern and sub-5 ns clock-to-output for instruction/data fetch alignment. Use Value: Eliminates cache refill bottlenecks by matching Pentium® burst protocol natively-no address translation or burst-length adaptation required. | Use Scenario: Line-rate buffering in 10 Gbps Ethernet switch fabric ASICs handling variable-length packet payloads. IC Role / Device Role / Timing Role: Synchronous FIFO replacement with burst write capability and asynchronous OE-controlled read bursting to match traffic scheduler timing. Use Value: Enables deterministic 200 MHz write throughput and concurrent read servicing via separate ADSP/ADSC strobes for ingress/egress pipelines. |
| Industrial Motion Controller Memory | Radar Signal Processing Buffer |
Use Scenario: Real-time trajectory interpolation buffer in CNC controllers requiring deterministic access to motion profile tables. IC Role / Device Role / Timing Role: Low-latency, jitter-free memory subsystem with ZZ sleep mode for power-gated idle periods between motion segments. Use Value: Maintains data integrity during 10 µs–100 ms sleep intervals while reducing average power by >60% versus continuous operation. | Use Scenario: High-speed ADC sample buffering in automotive radar ECU before FFT processing in DSP subsystem. IC Role / Device Role / Timing Role: 36-bit-wide ping-pong buffer supporting simultaneous 200 MHz sampling write and 100 MHz FFT read access via dual-port arbitration. Use Value: Achieves 720 MB/s sustained bandwidth with hardware-managed burst counters-reducing FPGA logic overhead for address generation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L15PF | 512K × 18 organization, 15 ns access, 3.3 V only I/O, no ZZ sleep mode | Limited to 18-bit data paths; lacks burst counter and MODE-selectable addressing | Select when 18-bit bus width suffices and sleep mode is unnecessary; verify compatibility with burst protocol requirements. |
| ISSI IS61WV102436BLL-15BLI | 1024K × 36 organization, 15 ns access, 3.3 V core/I/O, no JTAG or ADV-controlled burst | Higher density but asynchronous interface; requires external burst logic and lacks pipelined clock-to-output timing | Prefer for cost-sensitive designs where deterministic 200 MHz timing and burst automation are not required. |
Compared with IDT72V2115L15PF and IS61WV102436BLL-15BLI, CY7C1360C-200AJXCT uniquely delivers 200 MHz pipelined operation with integrated burst counter, dual-strobe address capture, and low-power ZZ mode-making it optimal for CPU-adjacent cache and real-time control buffers demanding sub-5 ns latency and protocol alignment.
Availability
CY7C1360C-200AJXCT is available at Aetrix Electronics and suitable for high-speed CPU cache subsystems, network packet buffering, industrial motion control memory, and radar signal processing buffers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1360C-200AJXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C solutions.
The CY7C1360C belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for CPU-adjacent cache, networking, and real-time control applications demanding deterministic timing, burst efficiency, and low-power sleep modes.
FAQ
What is the function of the MODE pin on CY7C1360C-200AJXCT?
The MODE pin selects burst address sequence behavior: when LOW, it configures linear burst (sequential addresses); when HIGH, it enables interleaved burst (Pentium®-compatible address mapping). This setting is sampled at power-up or reset and remains static during operation-no dynamic reconfiguration is supported.
Can CY7C1360C-200AJXCT operate with VDDQ = 2.5 V while VDD = 3.3 V?
Yes. The device supports independent 3.3 V core supply (VDD) and 2.5 V I/O supply (VDDQ), meeting JEDEC JESD8-5 standards. This allows direct interfacing with 2.5 V FPGAs or ASICs without level shifters, while maintaining full 200 MHz performance and 3.0 ns clock-to-output timing.
How does the ZZ pin affect power consumption and data retention?
When ZZ is driven HIGH, the device enters non-time-critical sleep mode with CMOS standby current ≤40 mA (typical), preserving all stored data indefinitely. Core clocks and I/O drivers are gated, but memory array bias remains active. Data retention is guaranteed across industrial temperature range (–40°C to +85°C) with no refresh required.
Is JTAG boundary scan functional on the CY7C1360C-200AJXCT in TQFP package?
No. JTAG (IEEE 1149.1) is implemented only on the 119-ball BGA and 165-ball FBGA packages. The 100-pin TQFP variant (including -200AJXCT) omits TDO, TDI, TMS, and TCK pins and does not support boundary scan functionality per the datasheet revision *U.
CY7C1360C-200AJXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1360C-200AJXCT FAQ
1.How can I place an order for CY7C1360C-200AJXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1360C-200AJXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1360C-200AJXCT reliable?
The price and inventory of CY7C1360C-200AJXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1360C-200AJXCT is usually 5 days.
3.What payment methods are accepted for CY7C1360C-200AJXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1360C-200AJXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1360C-200AJXCT?
CY7C1360C-200AJXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1360C-200AJXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1360C-200AJXCT?
For technical support, including CY7C1360C-200AJXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1360C-200AJXCT requirements.
6.How does Aetrix verify that CY7C1360C-200AJXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1360C-200AJXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1360C-200AJXCT meets industry standards.
7.What is the process for return or replacement of CY7C1360C-200AJXCT?
All CY7C1360C-200AJXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1360C-200AJXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1360C-200AJXCT part is unused and in its original packaging.
Return procedure for CY7C1360C-200AJXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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